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    Flexible printed circuit board
    1.
    发明授权
    Flexible printed circuit board 有权
    柔性印刷电路板

    公开(公告)号：US08569629B2

    公开(公告)日：2013-10-29

    申请号：US12768258

    申请日：2010-04-27

    申请人： Tadao Ookawa ,  Mitsuru Honjo ,  Daisuke Yamauchi

    发明人： Tadao Ookawa ,  Mitsuru Honjo ,  Daisuke Yamauchi

    IPC分类号： H05K1/00 ,  H05K1/03 ,  H05K1/16 ,  H05K1/18 ,  H05K7/00 ,  H01B7/08

    CPC分类号： H05K1/0245 ,  H05K1/0393 ,  H05K3/28 ,  H05K2201/09236 ,  H05K2201/09318

    摘要： An FPC board includes a base insulating layer. A plurality of wiring traces are formed on the base insulating layer. The adjacent wiring traces are arranged at a distance d from each other, and each wiring trace has a predetermined width and a thickness t1. Each transmission line pair is constituted by the two adjacent wiring traces of the plurality of wring traces. A ratio of the thickness t1 of the wiring trace to the distance d between the adjacent wiring traces is set to 0.8 or more. A cover insulating layer may be formed on the base insulating layer to cover the wiring traces. A metal layer having a predetermined thickness may be provided on a back surface of the base insulating layer. Furthermore, a differential impedance of each transmission line pair may be set to 100 Ω.

    摘要翻译： FPC基板包括基底绝缘层。 在基底绝缘层上形成多个布线迹线。 相邻的布线轨迹彼此间距离设置，每个布线迹线具有预定的宽度和厚度t1。 每个传输线对由多个连接迹线的两个相邻的布线迹线构成。 布线迹线的厚度t1与相邻布线之间的距离d的比率设定为0.8以上。 覆盖绝缘层可以形成在基底绝缘层上以覆盖布线迹线。 可以在基底绝缘层的背面上设置具有预定厚度的金属层。 此外，每个传输线对的差分阻抗可以被设置为100Ω。

    Printed circuit board and method of manufacturing the same
    2.
    发明授权
    Printed circuit board and method of manufacturing the same 有权
    印刷电路板及其制造方法

    公开(公告)号：US09029708B2

    公开(公告)日：2015-05-12

    申请号：US13086449

    申请日：2011-04-14

    申请人： Tetsuya Oosawa ,  Mitsuru Honjo ,  Daisuke Yamauchi

    发明人： Tetsuya Oosawa ,  Mitsuru Honjo ,  Daisuke Yamauchi

    IPC分类号： H05K1/00 ,  H05K1/05 ,  H05K1/02

    CPC分类号： H05K1/056 ,  H05K1/0245 ,  H05K1/0251 ,  Y10T29/49155

    摘要： A base insulating layer is formed on a suspension body. Read wiring patterns, write wiring patterns and a ground pattern are formed in parallel on the base insulating layer. A first cover insulating layer is formed on the base insulating layer to cover the read wiring patterns, the write wiring patterns and the ground pattern. A ground layer is formed in a region on the first cover insulating layer above the write wiring patterns. A second cover insulating layer is formed on the first cover insulating layer to cover the ground layer.

    摘要翻译： 基体绝缘层形成在悬架体上。 读取布线图案，写入布线图案和接地图案在基底绝缘层上平行地形成。 第一覆盖绝缘层形成在基底绝缘层上以覆盖读取的布线图案，写入布线图案和接地图案。 在写入布线图案上方的第一覆盖绝缘层的区域中形成接地层。 第二盖绝缘层形成在第一盖绝缘层上以覆盖接地层。

    Printed circuit board and magnetic head driving device including the same
    4.
    发明授权
    Printed circuit board and magnetic head driving device including the same 有权
    印刷电路板和包括其的磁头驱动装置

    公开(公告)号：US08330054B2

    公开(公告)日：2012-12-11

    申请号：US12771500

    申请日：2010-04-30

    申请人： Mitsuru Honjo ,  Daisuke Yamauchi ,  Kei Nakamura

    发明人： Mitsuru Honjo ,  Daisuke Yamauchi ,  Kei Nakamura

    IPC分类号： H05K1/16

    CPC分类号： G11B5/4846 ,  G11B5/484 ,  H05K1/0245 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/09236 ,  H05K2201/09318 ,  H05K2201/10674 ,  H05K2201/2009

    摘要： A plurality of wiring traces are formed on a base insulating layer, and a metal layer is formed on the opposite surface of the base insulating layer. Two adjacent wiring traces constitute a transmission line pair. The width of the wiring trace is set to not more than 250 μm, and the distance between the adjacent wiring traces is set to not less than 8 μm. The thickness of the base insulating layer is selected to cause differential impedance of the transmission line pair to be not less than 10 Ω and not more than 50 Ω.

    摘要翻译： 在基底绝缘层上形成多个布线迹线，并且在基底绝缘层的相对表面上形成金属层。 两个相邻的布线迹线构成传输线对。 布线迹线的宽度设定为不大于250μm，并且相邻布线迹线之间的距离设定为不小于8μm。 选择基极绝缘层的厚度使传输线对的差分阻抗不小于10Ω; 不超过50个

    Printed circuit board and method of manufacturing the same
    6.
    发明授权
    Printed circuit board and method of manufacturing the same 有权
    印刷电路板及其制造方法

    公开(公告)号：US08802994B2

    公开(公告)日：2014-08-12

    申请号：US13456824

    申请日：2012-04-26

    申请人： Jun Ishii ,  Daisuke Yamauchi

    发明人： Jun Ishii ,  Daisuke Yamauchi

    IPC分类号： H05K1/03 ,  H05K1/00 ,  H05K1/11

    CPC分类号： H05K1/0253 ,  G11B5/484 ,  G11B5/486 ,  H05K1/0225 ,  H05K1/056 ,  H05K1/111 ,  H05K3/388 ,  Y02P70/611

    摘要： An insulating layer is formed on a support substrate having a conductive property. Write wiring traces, read wiring traces, and first and second electrode pad pairs are formed on the insulating layer. The first electrode pad pair is connected to the write wiring traces. The second electrode pad pair is connected to the read wiring traces. Parts of regions of the support substrate, which overlap the electrode pads, are removed. Thus, openings are formed in the regions of the support substrate, which overlap the electrode pads.

    摘要翻译： 在具有导电性的支撑基板上形成绝缘层。 在绝缘层上形成写入布线迹线，读取布线迹线以及第一和第二电极焊盘对。 第一电极焊盘对连接到写入布线迹线。 第二电极焊盘对连接到读取的布线迹线。 去除与电极焊盘重叠的支撑衬底的部分区域。 因此，在与电极焊盘重叠的支撑基板的区域中形成开口。

    Differential transmission line with a set relationship to a ground conductor and method of manufacturing
    7.
    发明授权
    Differential transmission line with a set relationship to a ground conductor and method of manufacturing 有权
    具有与接地导体的集合关系的差动传输线和制造方法

    公开(公告)号：US08797114B2

    公开(公告)日：2014-08-05

    申请号：US13176229

    申请日：2011-07-05

    申请人： Daisuke Yamauchi

    发明人： Daisuke Yamauchi

    IPC分类号： H01P3/08 ,  H05K1/02

    CPC分类号： H05K1/0245 ,  H01P3/08 ,  H05K1/0253 ,  H05K1/0393 ,  Y10T29/49155

    摘要： Two transmission lines are formed adjacent to each other at spacing on an upper surface of a base insulating layer, and a ground conductor layer is formed on a lower surface of the base insulating layer. The ground conductor layer is arranged to be opposite to at least part of one transmission line and at least part of the other transmission line in a width direction of the two transmission lines. When a width of one transmission line, a width of the other transmission line, a spacing between the two transmission lines and a width of the ground conductor layer in an arbitrary cross section perpendicular to the two transmission lines are referred to as W1, W2, S, Wg, respectively, the width Wg of the ground conductor layer is set to satisfy relationship of Wg

    摘要翻译： 在基底绝缘层的上表面上以间隔彼此相邻地形成两个传输线，并且在基底绝缘层的下表面上形成接地导体层。 接地导体层布置成与两个传输线的宽度方向上的一个传输线的至少一部分和另一个传输线的至少一部分相对。 当将两条传输线的宽度，另一条传输线的宽度，两条传输线之间的间距和与两条传输线垂直的任意横截面中接地导体层的宽度称为W1，W2， S，Wg，接地导体层的宽度Wg被设定为满足Wg <（W1 + W2 + S）和S＆NlE; 0.8Wg的关系。

    Conductor-clad laminate, wiring circuit board, and processes for producing the same
    8.
    发明授权
    Conductor-clad laminate, wiring circuit board, and processes for producing the same 失效
    导线覆层压板，布线电路板及其制造方法

    公开(公告)号：US08099866B2

    公开(公告)日：2012-01-24

    申请号：US11603048

    申请日：2006-11-22

    申请人： Daisuke Yamauchi

    发明人： Daisuke Yamauchi

    IPC分类号： H05K3/10

    CPC分类号： B32B37/1284 ,  B32B37/203 ,  B32B2038/006 ,  B32B2311/12 ,  B32B2379/08 ,  B32B2457/08 ,  H05K3/022 ,  H05K3/386 ,  H05K2201/0355 ,  H05K2203/066 ,  H05K2203/1545 ,  Y10T29/49117 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49885 ,  Y10T29/4998

    摘要： In a roll-to-roll step, an adhesive solution is applied to a release film 1 including a polyethylene terephthalate film and this film 1 is passed through a drying oven 500 regulated to 60 to 150° C. to thereby form an adhesive layer 2. Subsequently, an insulating film 3 including a polyimide film is laminated on the adhesive layer 2 at room temperature (about 25° C.) to thereby produce a layered product 6 including the release film 1, adhesive layer 2 and insulating film 3. Next, the release film 1 is stripped from the layered product 6 and a conductor film 4 including a copper foil is laminated to the adhesive layer 2 to thereby produce a conductor-clad laminate 8.

    摘要翻译： 在卷对卷步骤中，将粘合剂溶液施加到包括聚对苯二甲酸乙二醇酯膜的剥离膜1上，并将该膜1通过调节至60至150℃的干燥炉500，从而形成粘合剂层2 接着，在室温（约25℃）下，在粘合剂层2上层压包含聚酰亚胺膜的绝缘膜3，从而制造包含脱模膜1，粘合剂层2和绝缘膜3的层叠体6。 将剥离膜1从层叠体6剥离，并且将包含铜箔的导体膜4层压到粘合剂层2上，从而制造导体覆盖层压体8。

    Printed circuit board and method of manufacturing the same
    9.
    发明授权
    Printed circuit board and method of manufacturing the same 有权
    印刷电路板及其制造方法

    公开(公告)号：US08969736B2

    公开(公告)日：2015-03-03

    申请号：US13671029

    申请日：2012-11-07

    申请人： Daisuke Yamauchi

    发明人： Daisuke Yamauchi

    IPC分类号： H05K1/11 ,  H05K1/02 ,  G11B5/48

    CPC分类号： G11B5/486 ,  G11B5/484 ,  G11B5/4853 ,  H05K1/0245 ,  H05K1/0248 ,  Y10T29/49126 ,  Y10T29/49146 ,  Y10T29/49155

    摘要： A cover insulating layer is formed on a base insulating layer. One of write wiring traces includes first to third lines, and the other write wiring trace includes fourth to sixth lines. The one and other write wiring traces constitute a signal line pair, the second and fifth lines are arranged on an upper surface of the cover insulating layer, and the third and sixth lines are arranged on an upper surface of the base insulating layer. At least parts of the second and fifth lines are respectively opposed to the sixth and third lines with the cover insulating layer sandwiched therebetween. The second and third lines are electrically connected to the first line, and the fifth and sixth lines are electrically connected to the fourth line. The fourth line is electrically connected to at least one of the fifth and sixth lines through a jumper wiring on a lower surface of the base insulating layer.

    摘要翻译： 覆盖绝缘层形成在基底绝缘层上。 写入布线迹线之一包括第一至第三条线，另一条写入布线包含第四至第六条线。 一个写入布线迹线构成信号线对，第二和第五线布置在盖绝缘层的上表面上，第三和第六线布置在基底绝缘层的上表面上。 第二和第五行的至少一部分分别与夹在其间的盖绝缘层相对的第六和第三行相对。 第二线和第三线电连接到第一线，并且第五和第六线电连接到第四线。 第四线通过基底绝缘层的下表面上的跨接布线电连接到第五和第六线中的至少一个。