利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

44 条记录 (耗时 0.031 秒)

    Printed circuit board and method of manufacturing the same
    2.
    发明授权
    Printed circuit board and method of manufacturing the same 有权
    印刷电路板及其制造方法

    公开(公告)号：US09029708B2

    公开(公告)日：2015-05-12

    申请号：US13086449

    申请日：2011-04-14

    申请人： Tetsuya Oosawa ,  Mitsuru Honjo ,  Daisuke Yamauchi

    发明人： Tetsuya Oosawa ,  Mitsuru Honjo ,  Daisuke Yamauchi

    IPC分类号： H05K1/00 ,  H05K1/05 ,  H05K1/02

    CPC分类号： H05K1/056 ,  H05K1/0245 ,  H05K1/0251 ,  Y10T29/49155

    摘要： A base insulating layer is formed on a suspension body. Read wiring patterns, write wiring patterns and a ground pattern are formed in parallel on the base insulating layer. A first cover insulating layer is formed on the base insulating layer to cover the read wiring patterns, the write wiring patterns and the ground pattern. A ground layer is formed in a region on the first cover insulating layer above the write wiring patterns. A second cover insulating layer is formed on the first cover insulating layer to cover the ground layer.

    摘要翻译： 基体绝缘层形成在悬架体上。 读取布线图案，写入布线图案和接地图案在基底绝缘层上平行地形成。 第一覆盖绝缘层形成在基底绝缘层上以覆盖读取的布线图案，写入布线图案和接地图案。 在写入布线图案上方的第一覆盖绝缘层的区域中形成接地层。 第二盖绝缘层形成在第一盖绝缘层上以覆盖接地层。

    Flexible printed circuit board
    5.
    发明授权
    Flexible printed circuit board 有权
    柔性印刷电路板

    公开(公告)号：US08569629B2

    公开(公告)日：2013-10-29

    申请号：US12768258

    申请日：2010-04-27

    申请人： Tadao Ookawa ,  Mitsuru Honjo ,  Daisuke Yamauchi

    发明人： Tadao Ookawa ,  Mitsuru Honjo ,  Daisuke Yamauchi

    IPC分类号： H05K1/00 ,  H05K1/03 ,  H05K1/16 ,  H05K1/18 ,  H05K7/00 ,  H01B7/08

    CPC分类号： H05K1/0245 ,  H05K1/0393 ,  H05K3/28 ,  H05K2201/09236 ,  H05K2201/09318

    摘要： An FPC board includes a base insulating layer. A plurality of wiring traces are formed on the base insulating layer. The adjacent wiring traces are arranged at a distance d from each other, and each wiring trace has a predetermined width and a thickness t1. Each transmission line pair is constituted by the two adjacent wiring traces of the plurality of wring traces. A ratio of the thickness t1 of the wiring trace to the distance d between the adjacent wiring traces is set to 0.8 or more. A cover insulating layer may be formed on the base insulating layer to cover the wiring traces. A metal layer having a predetermined thickness may be provided on a back surface of the base insulating layer. Furthermore, a differential impedance of each transmission line pair may be set to 100 Ω.

    摘要翻译： FPC基板包括基底绝缘层。 在基底绝缘层上形成多个布线迹线。 相邻的布线轨迹彼此间距离设置，每个布线迹线具有预定的宽度和厚度t1。 每个传输线对由多个连接迹线的两个相邻的布线迹线构成。 布线迹线的厚度t1与相邻布线之间的距离d的比率设定为0.8以上。 覆盖绝缘层可以形成在基底绝缘层上以覆盖布线迹线。 可以在基底绝缘层的背面上设置具有预定厚度的金属层。 此外，每个传输线对的差分阻抗可以被设置为100Ω。

    Printed circuit board and magnetic head driving device including the same
    6.
    发明授权
    Printed circuit board and magnetic head driving device including the same 有权
    印刷电路板和包括其的磁头驱动装置

    公开(公告)号：US08330054B2

    公开(公告)日：2012-12-11

    申请号：US12771500

    申请日：2010-04-30

    申请人： Mitsuru Honjo ,  Daisuke Yamauchi ,  Kei Nakamura

    发明人： Mitsuru Honjo ,  Daisuke Yamauchi ,  Kei Nakamura

    IPC分类号： H05K1/16

    CPC分类号： G11B5/4846 ,  G11B5/484 ,  H05K1/0245 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/09236 ,  H05K2201/09318 ,  H05K2201/10674 ,  H05K2201/2009

    摘要： A plurality of wiring traces are formed on a base insulating layer, and a metal layer is formed on the opposite surface of the base insulating layer. Two adjacent wiring traces constitute a transmission line pair. The width of the wiring trace is set to not more than 250 μm, and the distance between the adjacent wiring traces is set to not less than 8 μm. The thickness of the base insulating layer is selected to cause differential impedance of the transmission line pair to be not less than 10 Ω and not more than 50 Ω.

    摘要翻译： 在基底绝缘层上形成多个布线迹线，并且在基底绝缘层的相对表面上形成金属层。 两个相邻的布线迹线构成传输线对。 布线迹线的宽度设定为不大于250μm，并且相邻布线迹线之间的距离设定为不小于8μm。 选择基极绝缘层的厚度使传输线对的差分阻抗不小于10Ω; 不超过50个

    Opto-electric hybrid board and manufacturing method therefor
    8.
    发明授权
    Opto-electric hybrid board and manufacturing method therefor 有权
    光电混合电路板及其制造方法

    公开(公告)号：US08837873B2

    公开(公告)日：2014-09-16

    申请号：US13413853

    申请日：2012-03-07

    申请人： Akiko Nagafuji ,  Yuichi Tsujita ,  Masayuki Hodono ,  Masami Inoue ,  Mitsuru Honjo

    发明人： Akiko Nagafuji ,  Yuichi Tsujita ,  Masayuki Hodono ,  Masami Inoue ,  Mitsuru Honjo

    IPC分类号： G02B6/12 ,  G02B6/42 ,  G02B6/26

    CPC分类号： G02B6/4202 ,  G02B6/4231 ,  Y10T29/4914

    摘要： Provided are an opto-electric hybrid board and a manufacturing method therefor. An optical waveguide unit includes protruding portions which are extendingly provided at portions of at least one of an undercladding layer and an overcladding layer, and the protruding portions are located and formed at predetermined locations with respect to a light transmitting surface of a core. An electric circuit unit includes a bent portion having fitting holes into which the protruding portions fit and having an optical element. The fitting holes are located and formed at predetermined locations with respect to the optical element. The optical waveguide unit and the electric circuit unit are coupled to each other in a state in which the protruding portions fit into the fitting holes to form an opto-electric hybrid board.

    摘要翻译： 提供了一种光电混合基板及其制造方法。 光波导单元包括突出部分，其突出部分设置在下包层和外包层中的至少一个的部分处，并且突出部分相对于芯的透光表面定位并形成在预定位置。 电路单元包括具有嵌合孔的弯曲部分，突出部分配合并具有光学元件。 装配孔相对于光学元件定位并形成在预定位置。 光波导单元和电路单元在突出部分配合到装配孔中以形成光电混合板的状态下彼此耦合。

    Opto-electric hybrid board and manufacturing method therefor
    9.
    发明授权
    Opto-electric hybrid board and manufacturing method therefor 失效
    光电混合电路板及其制造方法

    公开(公告)号：US08644655B2

    公开(公告)日：2014-02-04

    申请号：US13407009

    申请日：2012-02-28

    申请人： Yuichi Tsujita ,  Masayuki Hodono ,  Akiko Nagafuji ,  Masami Inoue ,  Ryusuke Naito ,  Mitsuru Honjo

    发明人： Yuichi Tsujita ,  Masayuki Hodono ,  Akiko Nagafuji ,  Masami Inoue ,  Ryusuke Naito ,  Mitsuru Honjo

    IPC分类号： G02B6/12

    CPC分类号： H05K1/181 ,  G02B6/4214 ,  G02B6/423 ,  G02B6/424 ,  G02B6/4257 ,  H05K1/0284 ,  H05K2201/09063 ,  H05K2201/10121 ,  Y02P70/611 ,  Y10T29/49124

    摘要： Provided are an opto-electric hybrid board which eliminates the necessity of an aligning operation of a core of an optical waveguide unit and an optical element of an electric circuit unit and which is excellent in mass-productivity, and a manufacturing method therefor. The opto-electric hybrid board includes an optical waveguide unit and an electric circuit unit having an optical element mounted thereon, the electric circuit unit being coupled to the optical waveguide unit. The optical waveguide unit includes protruding portions which are extendingly provided at portions of at least one of the undercladding layer and the overcladding layer, and are located and formed at predetermined locations with respect to a light transmitting surface of a core. The electric circuit unit includes fitting holes into which the protruding portions fit, and are located and formed at predetermined locations with respect to the optical element.

    摘要翻译： 提供了一种光电混合板，其不需要光波导单元的芯和电路单元的光学元件的对准操作，并且其批量生产率优异，并且其制造方法。 光电混合基板包括光波导单元和安装有光学元件的电路单元，电路单元耦合到光波导单元。 光波导单元包括突出部分，其突出设置在下包层和外包层中的至少一个的部分处，并且相对于芯的透光表面定位并形成在预定位置。 电路单元包括嵌合孔，突出部分配合在该孔中，并且相对于光学元件定位并形成在预定位置。

    Opto-electric hybrid board and manufacturing method therefor
    10.
    发明授权
    Opto-electric hybrid board and manufacturing method therefor 有权
    光电混合电路板及其制造方法

    公开(公告)号：US09265141B2

    公开(公告)日：2016-02-16

    申请号：US13406674

    申请日：2012-02-28

    申请人： Masami Inoue ,  Masayuki Hodono ,  Akiko Nagafuji ,  Yuichi Tsujita ,  Mitsuru Honjo

    发明人： Masami Inoue ,  Masayuki Hodono ,  Akiko Nagafuji ,  Yuichi Tsujita ,  Mitsuru Honjo

    IPC分类号： G02B6/12 ,  H05K1/02 ,  G02B6/42 ,  H05K1/18

    CPC分类号： H05K1/0274 ,  G02B6/4214 ,  G02B6/424 ,  G02B6/4257 ,  G02B6/428 ,  H05K1/181 ,  H05K2201/09072 ,  H05K2201/10121 ,  Y10T29/4913

    摘要： Provided are an opto-electric hybrid board which eliminates the necessity of an aligning operation of a core of an optical waveguide unit and an optical element of an electric circuit unit and which is excellent in mass-productivity, and a manufacturing method therefor. The opto-electric hybrid board includes an optical waveguide unit and an electric circuit unit having an optical element mounted thereon, the electric circuit unit being coupled to the optical waveguide unit. The optical waveguide unit includes fitting holes which are formed in a surface of an overcladding layer and are located and formed at predetermined locations with respect to one end surface of a core. The electric circuit unit includes protruding portions which fit into the fitting holes and are located and formed at predetermined locations with respect to the optical element.

    摘要翻译： 提供了一种光电混合板，其不需要光波导单元的芯和电路单元的光学元件的对准操作，并且其批量生产率优异，并且其制造方法。 光电混合基板包括光波导单元和安装有光学元件的电路单元，电路单元耦合到光波导单元。 光波导单元包括形成在外包层的表面中并且相对于芯的一个端面定位并形成在预定位置处的嵌合孔。 电路单元包括装配到装配孔中并且相对于光学元件定位并形成在预定位置的突出部分。