Coating composition
    1.
    发明授权
    Coating composition 有权
    涂料组成

    公开(公告)号:US06338869B1

    公开(公告)日:2002-01-15

    申请号:US09594789

    申请日:2000-06-16

    IPC分类号: B32B3500

    摘要: The present invention provides a coating composition capable of forming a coating film having good performances such as an adhesive property even if coated on a deteriorated coating film surface of a high rust-preventive coating film of a tar epoxy resin coating material and the like without providing pre-treatment, and a coating method thereof. The above coating composition is a coating composition of an organic solvent type or solventless type comprising an epoxy resin having at least one epoxy group in a molecule and an amine base curing agent as resin components, wherein moisture of 1 to 30 parts by weight per 100 parts by weight of the solid matter of the coating composition is contained.

    摘要翻译: 本发明提供一种涂料组合物,即使涂覆在焦油环氧树脂涂料等的高防锈涂膜的劣化涂膜表面上,也能够形成具有良好性能等粘合性能的涂膜,而无需提供 预处理及其涂布方法。 上述涂料组合物是包含分子中具有至少一个环氧基的环氧树脂和作为树脂组分的胺基固化剂的有机溶剂型或无溶剂型涂料组合物,其中水分为1至30重量份/ 100 含有重量份的涂料组合物的固体物质。

    Stent
    4.
    发明授权
    Stent 有权
    支架

    公开(公告)号:US09173754B2

    公开(公告)日:2015-11-03

    申请号:US13060395

    申请日:2009-08-28

    IPC分类号: A61F2/82 A61F2/89

    CPC分类号: A61F2/89 A61F2250/0018

    摘要: A stent including a plurality of loop stents connected by struts so that it bends uniformly as a whole.A stent A including a plurality of loop stents 2 connected by a plurality of struts 3, the loop stents 2 each formed of a stent main wire 1 folded into a zigzag shape and joined at its ends, wherein the bending strength of each strut 3 is larger than the bending strength of the stent main wire 1.

    摘要翻译: 一种支架,其包括通过支柱连接的多个环形支架,使得其整体上均匀地弯曲。 支架A,其包括多个由多个支柱3连接的环形支架2,每个支架2由支架主线1形成,折叠成Z字形并在其端部连接,其中每个支柱3的弯曲强度为 大于支架主线1的弯曲强度。

    PROCESSING TARGET REFORMING APPARATUS, PRINTING APPARATUS, PRINTING SYSTEM, AND METHOD
    5.
    发明申请
    PROCESSING TARGET REFORMING APPARATUS, PRINTING APPARATUS, PRINTING SYSTEM, AND METHOD 有权
    加工目标改造设备,印刷设备,印刷系统和方法

    公开(公告)号:US20150076124A1

    公开(公告)日:2015-03-19

    申请号:US14486919

    申请日:2014-09-15

    IPC分类号: B23K10/00 B23K9/28

    摘要: A processing target reforming apparatus includes: a conveying unit that conveys a processing target along a conveyance path; a discharge unit including a plurality of discharge electrodes aligned along the conveyance path, a counter electrode with the conveyance path interposed therebetween, and a power source that applies a voltage waveform to the discharge electrodes; and a control unit that controls the discharge unit such that a phase of the voltage waveform applied to a first discharge electrode of the discharge electrodes at a timing when a certain point of the processing target passes between the first discharge electrode and the counter electrode is shifted with respect to a phase of the voltage waveform applied by the power source to a second discharge electrode of the discharge electrodes at a timing when the certain point of the processing target passes between the second discharge electrode and the counter electrode.

    摘要翻译: 一种加工对象重整装置,包括:输送单元,其沿着输送路径输送加工对象物; 放电单元,包括沿着输送路径排列的多个放电电极,具有介于其间的输送路径的对置电极和向放电电极施加电压波形的电源; 以及控制单元,其控制所述放电单元,使得在所述处理对象的某一点在所述第一放电电极和所述对置电极之间通过的时刻的施加到所述放电电极的第一放电电极的电压波形的相位偏移 相对于处理对象的特定点在第二放电电极和对电极之间通过的时刻,由电源对放电电极的第二放电电极施加的电压波形的相位。

    Cu-Ni-Si-BASED COPPER ALLOY SHEET HAVING EXCELLENT MOLD ABRASION RESISTANCE AND SHEAR WORKABILITY AND METHOD FOR MANUFACTURING SAME
    6.
    发明申请
    Cu-Ni-Si-BASED COPPER ALLOY SHEET HAVING EXCELLENT MOLD ABRASION RESISTANCE AND SHEAR WORKABILITY AND METHOD FOR MANUFACTURING SAME 审中-公开
    具有优异的模具耐磨性和耐磨性的铜镍硅基铜合金板及其制造方法

    公开(公告)号:US20150000803A1

    公开(公告)日:2015-01-01

    申请号:US14366921

    申请日:2011-12-22

    IPC分类号: C22F1/08 C22C9/04 C22C9/06

    摘要: A Cu—Ni—Si-based copper alloy sheet of the invention has excellent mold abrasion resistance and shear workability while maintaining strength and conductivity, in which 1.0 mass % to 4.0 mass % of Ni is contained, 0.2 mass % to 0.9 mass % of Si is contained, the remainder is made up of Cu and inevitable impurities. The number of the Ni—Si precipitate particles having a grain diameter in a range of 20 nm to 80 nm in a surface layer that is as thick as 20% of the entire sheet thickness from the surface is represented by a particles/mm2, and the number of the Ni—Si precipitate particles having a grain diameter in a range of 20 nm to 80 nm in a portion below the surface layer is represented by b particles/mm2, a/b is in a range of 0.5 to 1.5.

    摘要翻译: 本发明的Cu-Ni-Si系铜合金板在保持强度和导电性的同时具有优异的模具耐磨性和剪切加工性,其中含有1.0质量%至4.0质量%的Ni,0.2质量%至0.9质量% 含有Si,其余部分由Cu和不可避免的杂质构成。 在表面层厚度为20nm〜80nm范围内的Ni-Si析出物颗粒的数量比表面积为整个板厚的20%以粒子数/ mm2表示, 在表面层下面的部分,粒径在20nm〜80nm范围内的Ni-Si析出物颗粒的数量由b颗粒/ mm 2表示,a / b在0.5〜1.5的范围内。

    Method and device for extracting pollen proteins
    7.
    发明授权
    Method and device for extracting pollen proteins 有权
    提取花粉蛋白的方法和装置

    公开(公告)号:US08680250B2

    公开(公告)日:2014-03-25

    申请号:US13320738

    申请日:2010-05-10

    摘要: The present invention is one that, in a pollen protein extracting method, enables mass production, and while improving production efficiency, achieves a reduction in workload such as a reduction in man-hours, reductions in equipment cost and running cost, and an improvement of a work environment. Specifically, a pollen protein extracting method for extracting water-soluble protein from pollen is characterized by including: mixing the pollen and PBS; adding an aggregating agent including a natural inorganic component to a resultant mixed solution and performing stirring; and after formation of a pollen aggregate, performing filter filtration to perform solid-liquid separation.

    摘要翻译: 本发明是在花粉蛋白质提取方法中,能够进行批量生产,在提高生产效率的同时,能够减少工作时间,减少工时,降低设备成本和运行成本,并且提高 一个工作环境。 具体来说,从花粉中提取水溶性蛋白质的花粉蛋白质提取方法的特征在于:将花粉与PBS混合; 向得到的混合溶液中加入包含天然无机成分的凝集剂,进行搅拌; 在形成花粉骨料后进行过滤,进行固液分离。

    Circuit for compensating base current of transistor and amplifier circuit provided with the same
    8.
    发明授权
    Circuit for compensating base current of transistor and amplifier circuit provided with the same 有权
    用于补偿晶体管和放大器电路的基极电流补偿电路

    公开(公告)号:US08564372B2

    公开(公告)日:2013-10-22

    申请号:US13234029

    申请日:2011-09-15

    申请人: Akira Saito

    发明人: Akira Saito

    IPC分类号: H03F3/04

    摘要: According to one embodiment, a circuit for compensating fluctuation of a base current of a transistor is presented. The transistor has a base connected with an input terminal. The compensation circuit is provided with a first transistor, a current mirror circuit and a second transistor. The current mirror circuit mirrors a current which is supplied to a base of the first transistor. Further, the current mirror circuit supplies the obtained mirror current to the base of the transistor to be compensated. A base of the second transistor is connected with the input terminal electrically. The second transistor causes an early effect in the first transistor.

    摘要翻译: 根据一个实施例,提供了用于补偿晶体管的基极电流的波动的电路。 晶体管具有与输入端连接的基极。 补偿电路设置有第一晶体管,电流镜电路和第二晶体管。 电流镜电路镜像被提供给第一晶体管的基极的电流。 此外,电流镜电路将获得的镜电流提供给要补偿的晶体管的基极。 第二晶体管的基极与输入端子电连接。 第二晶体管在第一晶体管中产生早期效应。

    Cu-Ni-Si-BASED COPPER ALLOY PLATE HAVING EXCELLENT DEEP DRAWING WORKABILITY AND METHOD OF MANUFACTURING THE SAME
    9.
    发明申请
    Cu-Ni-Si-BASED COPPER ALLOY PLATE HAVING EXCELLENT DEEP DRAWING WORKABILITY AND METHOD OF MANUFACTURING THE SAME 有权
    具有优异深度绘图能力的Cu-Ni-Si基铜合金板及其制造方法

    公开(公告)号:US20130167988A1

    公开(公告)日:2013-07-04

    申请号:US13808351

    申请日:2010-07-07

    摘要: The Cu—Ni—Si-based copper alloy plate contains 1.0 mass % to 3.0 mass % of Ni, and Si at a concentration of ⅙ to ¼ of the mass % concentration of Ni with a remainder of Cu and inevitable impurities, in which, when the average value of the aspect ratio (the minor axis of crystal grains/the major axis of crystal grains) of each crystal grains in an alloy structure is 0.4 to 0.6, the average value of GOS in the all crystal grains is 1.2° to 1.5°, and the ratio (Lσ/L) of the total special grain boundary length Lσ of special grain boundaries to the total grain boundary length L of crystal grain boundaries is 60% to 70%, the spring bending elastic limit becomes 450 N/mm2 to 600 N/mm2, the solder resistance to heat separation is favorable and deep drawing workability is excellent at 150° C. for 1000 hours.

    摘要翻译: Cu-Ni-Si系铜合金板含有1.0质量%〜3.0质量%的Ni,Si的浓度为Ni的质量%浓度的1/6〜¼,余量为Cu和不可避免的杂质, 当合金结构中每个晶粒的纵横比(晶粒的短轴/晶粒长轴)的平均值为0.4至0.6时,所有晶粒中GOS的平均值为1.2 °至1.5°,特殊晶界的总特殊晶界长度Lsigma与晶界边界长度L之比(Lsigma / L)为60%至70%,弹簧弯曲弹性极限为450 N / mm 2〜600N / mm 2,耐热耐热性良好,150℃下1000小时的深冲加工性优异。