公开(公告)号：US07912100B2

公开(公告)日：2011-03-22

申请号：US12339744

申请日：2008-12-19

申请人： Lawrence Shah ,  James M. Bovatsek ,  Alan Y. Arai ,  Tadashi Yamamoto ,  Rajesh S. Patel ,  Donald J. Harter

发明人： Lawrence Shah ,  James M. Bovatsek ,  Alan Y. Arai ,  Tadashi Yamamoto ,  Rajesh S. Patel ,  Donald J. Harter

IPC分类号： H01S3/30

CPC分类号： H01S3/10038 ,  G01J11/00 ,  H01S3/0014 ,  H01S3/005 ,  H01S3/0057 ,  H01S3/0064 ,  H01S3/0078 ,  H01S3/06754 ,  H01S3/10023 ,  H01S3/10061 ,  H01S3/102 ,  H01S3/1024 ,  H01S3/108 ,  H01S3/109 ,  H01S3/1305 ,  H01S3/1618

摘要： A femtosecond laser based laser processing system having a femtosecond laser, frequency conversion optics, beam manipulation optics, target motion control, processing chamber, diagnostic systems and system control modules. The femtosecond laser based laser processing system allows for the utilization of the unique heat control in micromachining, and the system has greater output beam stability, continuously variable repetition rate and unique temporal beam shaping capabilities.

摘要翻译： 飞秒激光激光处理系统，具有飞秒激光，变频光学，光束操纵光学，目标运动控制，处理室，诊断系统和系统控制模块。 基于飞秒激光的激光加工系统允许在微加工中利用独特的热控制，并且该系统具有更大的输出光束稳定性，连续可变的重复率和独特的时间波束整形能力。

公开(公告)号：US08279903B2

公开(公告)日：2012-10-02

申请号：US13025408

申请日：2011-02-11

申请人： Lawrence Shah ,  James M. Bovatsek ,  Alan Y. Arai ,  Tadashi Yamamoto ,  Rajesh S. Patel ,  Donald J. Harter

发明人： Lawrence Shah ,  James M. Bovatsek ,  Alan Y. Arai ,  Tadashi Yamamoto ,  Rajesh S. Patel ,  Donald J. Harter

IPC分类号： H01S3/13

CPC分类号： H01S3/10038 ,  G01J11/00 ,  H01S3/0014 ,  H01S3/005 ,  H01S3/0057 ,  H01S3/0064 ,  H01S3/0078 ,  H01S3/06754 ,  H01S3/10023 ,  H01S3/10061 ,  H01S3/102 ,  H01S3/1024 ,  H01S3/108 ,  H01S3/109 ,  H01S3/1305 ,  H01S3/1618

摘要： A femtosecond laser based laser processing system having a femtosecond laser, frequency conversion optics, beam manipulation optics, target motion control, processing chamber, diagnostic systems and system control modules. The femtosecond laser based laser processing system allows for the utilization of the unique heat control in micromachining, and the system has greater output beam stability, continuously variable repetition rate and unique temporal beam shaping capabilities.

摘要翻译： 飞秒激光激光处理系统，具有飞秒激光，变频光学，光束操纵光学，目标运动控制，处理室，诊断系统和系统控制模块。 基于飞秒激光的激光加工系统允许在微加工中利用独特的热控制，并且该系统具有更大的输出光束稳定性，连续可变的重复率和独特的时间波束整形能力。

公开(公告)号：US07491909B2

公开(公告)日：2009-02-17

申请号：US10813389

申请日：2004-03-31

申请人： Tadashi Yamamoto ,  Donald J. Harter ,  Rajesh S. Patel ,  Alan Y. Arai

发明人： Tadashi Yamamoto ,  Donald J. Harter ,  Rajesh S. Patel ,  Alan Y. Arai

IPC分类号： B23K26/38

CPC分类号： B23K26/0624 ,  B23K26/0622

摘要： A method for laser machining of material using a burst comprised of laser pulses. The method tailors the pulse width, pulse separation duration, wavelength and polarization of the multiple laser pulses included in a burst to maximize the positive effect of thermal and physical changes achieved by previous pulses that have impinged upon the machined material.

摘要翻译： 使用由激光脉冲组成的脉冲激光加工材料的方法。 该方法调整脉冲包括的脉冲宽度，脉冲间隔持续时间，波长和多个激光脉冲的极化，以最大限度地发挥已经冲击加工材料的先前脉冲实现的热和物理变化的积极作用。

公开(公告)号：US08644356B2

公开(公告)日：2014-02-04

申请号：US13611271

申请日：2012-09-12

申请人： Lawrence Shah ,  James M. Bovatsek ,  Alan Y. Arai ,  Tadashi Yamamoto ,  Rajesh S. Patel ,  Donald J. Harter

发明人： Lawrence Shah ,  James M. Bovatsek ,  Alan Y. Arai ,  Tadashi Yamamoto ,  Rajesh S. Patel ,  Donald J. Harter

IPC分类号： H01S3/10

CPC分类号： H01S3/10038 ,  G01J11/00 ,  H01S3/0014 ,  H01S3/005 ,  H01S3/0057 ,  H01S3/0064 ,  H01S3/0078 ,  H01S3/06754 ,  H01S3/10023 ,  H01S3/10061 ,  H01S3/102 ,  H01S3/1024 ,  H01S3/108 ,  H01S3/109 ,  H01S3/1305 ,  H01S3/1618

摘要： A femtosecond laser based laser processing system having a femtosecond laser, frequency conversion optics, beam manipulation optics, target motion control, processing chamber, diagnostic systems and system control modules. The femtosecond laser based laser processing system allows for the utilization of the unique heat control in micromachining, and the system has greater output beam stability, continuously variable repetition rate and unique temporal beam shaping capabilities.

摘要翻译： 飞秒激光激光处理系统，具有飞秒激光，变频光学，光束操纵光学，目标运动控制，处理室，诊断系统和系统控制模块。 基于飞秒激光的激光加工系统允许在微加工中利用独特的热控制，并且该系统具有更大的输出光束稳定性，连续可变的重复率和独特的时间波束整形能力。

公开(公告)号：US20090097514A1

公开(公告)日：2009-04-16

申请号：US12339744

申请日：2008-12-19

申请人： Lawrence SHAH ,  James M. Bovatsek ,  Alan Y. Arai ,  Tadashi Yamamoto ,  Rajesh S. Patel ,  Donald J. Harter

发明人： Lawrence SHAH ,  James M. Bovatsek ,  Alan Y. Arai ,  Tadashi Yamamoto ,  Rajesh S. Patel ,  Donald J. Harter

IPC分类号： H01S3/10

CPC分类号： H01S3/10038 ,  G01J11/00 ,  H01S3/0014 ,  H01S3/005 ,  H01S3/0057 ,  H01S3/0064 ,  H01S3/0078 ,  H01S3/06754 ,  H01S3/10023 ,  H01S3/10061 ,  H01S3/102 ,  H01S3/1024 ,  H01S3/108 ,  H01S3/109 ,  H01S3/1305 ,  H01S3/1618

摘要： A femtosecond laser based laser processing system having a femtosecond laser, frequency conversion optics, beam manipulation optics, target motion control, processing chamber, diagnostic systems and system control modules. The femtosecond laser based laser processing system allows for the utilization of the unique heat control in micromachining, and the system has greater output beam stability, continuously variable repetition rate and unique temporal beam shaping capabilities.

摘要翻译： 飞秒激光激光处理系统，具有飞秒激光，变频光学，光束操纵光学，目标运动控制，处理室，诊断系统和系统控制模块。 基于飞秒激光的激光加工系统允许在微加工中利用独特的热控制，并且该系统具有更大的输出光束稳定性，连续可变的重复率和独特的时间波束整形能力。

公开(公告)号：US08530786B2

公开(公告)日：2013-09-10

申请号：US12571598

申请日：2009-10-01

申请人： James Bovatsek ,  Alan Y. Arai ,  Fumiyo Yoshino

发明人： James Bovatsek ,  Alan Y. Arai ,  Fumiyo Yoshino

IPC分类号： B23K26/00

CPC分类号： B23K26/0057 ,  B23K26/0617 ,  B23K26/0624 ,  B23K26/244 ,  B23K26/364 ,  B23K26/40 ,  B23K26/53 ,  B23K2103/50 ,  B28D5/0011 ,  B29C59/16 ,  B29C65/14 ,  B29C65/1616 ,  B29C65/1635 ,  B29C65/1638 ,  B29C65/1658 ,  B29C65/1664 ,  B29C65/1674 ,  B29C65/1696 ,  B29C65/38 ,  B29C66/1122 ,  B29C66/30223 ,  B29C66/322 ,  B29C66/3282 ,  B29C66/41 ,  B29C66/43 ,  B29C66/71 ,  B29C66/73366 ,  B29C66/7352 ,  B29C66/73921 ,  B29C66/836 ,  B29C66/91641 ,  B29C66/919 ,  B29C66/934 ,  B29C66/939 ,  B29C66/944 ,  B29C66/949 ,  B29K2033/12 ,  B29K2069/00 ,  B29K2995/0026 ,  B81B1/00 ,  B81C1/00119 ,  C03B23/20 ,  C03B23/203 ,  C03B33/0222 ,  C03C23/0025 ,  Y10T428/13 ,  Y10T428/15 ,  Y10T428/24479 ,  Y10T428/24802 ,  B29C65/00

摘要： Methods for ultrashort pulse laser processing of optically transparent materials. A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with side-illumination and not clearly visible without side-illumination. In addition, a method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. The ultrashort pulse duration causes nonlinear absorption of the laser radiation, and the high repetition rate of the laser causes pulse-to-pulse accumulation of heat within the materials. The laser is focused near the interface of the materials, generating a high energy fluence at the region to be welded. This minimizes damage to the rest of the material and enables fine weld lines.

公开(公告)号：US08389891B2

公开(公告)日：2013-03-05

申请号：US12580739

申请日：2009-10-16

申请人： James Bovatsek ,  Alan Y. Arai ,  Fumiyo Yoshino

发明人： James Bovatsek ,  Alan Y. Arai ,  Fumiyo Yoshino

IPC分类号： B23K26/38 ,  B23K26/40

CPC分类号： B23K26/0057 ,  B23K26/0617 ,  B23K26/0624 ,  B23K26/244 ,  B23K26/364 ,  B23K26/40 ,  B23K26/53 ,  B23K2103/50 ,  B28D5/0011 ,  B29C59/16 ,  B29C65/14 ,  B29C65/1616 ,  B29C65/1635 ,  B29C65/1638 ,  B29C65/1658 ,  B29C65/1664 ,  B29C65/1674 ,  B29C65/1696 ,  B29C65/38 ,  B29C66/1122 ,  B29C66/30223 ,  B29C66/322 ,  B29C66/3282 ,  B29C66/41 ,  B29C66/43 ,  B29C66/71 ,  B29C66/73366 ,  B29C66/7352 ,  B29C66/73921 ,  B29C66/836 ,  B29C66/91641 ,  B29C66/919 ,  B29C66/934 ,  B29C66/939 ,  B29C66/944 ,  B29C66/949 ,  B29K2033/12 ,  B29K2069/00 ,  B29K2995/0026 ,  B81B1/00 ,  B81C1/00119 ,  C03B23/20 ,  C03B23/203 ,  C03B33/0222 ,  C03C23/0025 ,  Y10T428/13 ,  Y10T428/15 ,  Y10T428/24479 ,  Y10T428/24802 ,  B29C65/00

摘要： Methods for ultrashort pulse laser processing of optically transparent materials. A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with side-illumination and not clearly visible without side-illumination. In addition, a method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. The ultrashort pulse duration causes nonlinear absorption of the laser radiation, and the high repetition rate of the laser causes pulse-to-pulse accumulation of heat within the materials. The laser is focused near the interface of the materials, generating a high energy fluence at the region to be welded. This minimizes damage to the rest of the material and enables fine weld lines.

公开(公告)号：US20100084384A1

公开(公告)日：2010-04-08

申请号：US12580762

申请日：2009-10-16

申请人： James BOVATSEK ,  Alan Y. Arai ,  Fumiyo Yoshino

发明人： James BOVATSEK ,  Alan Y. Arai ,  Fumiyo Yoshino

IPC分类号： B23K26/00

CPC分类号： B23K26/0057 ,  B23K26/0617 ,  B23K26/0624 ,  B23K26/244 ,  B23K26/364 ,  B23K26/40 ,  B23K26/53 ,  B23K2103/50 ,  B28D5/0011 ,  B29C59/16 ,  B29C65/14 ,  B29C65/1616 ,  B29C65/1635 ,  B29C65/1638 ,  B29C65/1658 ,  B29C65/1664 ,  B29C65/1674 ,  B29C65/1696 ,  B29C65/38 ,  B29C66/1122 ,  B29C66/30223 ,  B29C66/322 ,  B29C66/3282 ,  B29C66/41 ,  B29C66/43 ,  B29C66/71 ,  B29C66/73366 ,  B29C66/7352 ,  B29C66/73921 ,  B29C66/836 ,  B29C66/91641 ,  B29C66/919 ,  B29C66/934 ,  B29C66/939 ,  B29C66/944 ,  B29C66/949 ,  B29K2033/12 ,  B29K2069/00 ,  B29K2995/0026 ,  B81B1/00 ,  B81C1/00119 ,  C03B23/20 ,  C03B23/203 ,  C03B33/0222 ,  C03C23/0025 ,  Y10T428/13 ,  Y10T428/15 ,  Y10T428/24479 ,  Y10T428/24802 ,  B29C65/00

摘要： Methods for ultrashort pulse laser processing of optically transparent materials. A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with side-illumination and not clearly visible without side-illumination. In addition, a method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. The ultrashort pulse duration causes nonlinear absorption of the laser radiation, and the high repetition rate of the laser causes pulse-to-pulse accumulation of heat within the materials. The laser is focused near the interface of the materials, generating a high energy fluence at the region to be welded. This minimizes damage to the rest of the material and enables fine weld lines.

摘要翻译： 光学透明材料的超短脉冲激光加工方法。 用于划线透明材料的方法使用超短激光脉冲来产生多个划线特征，其中激光束通过该材料的单次通过，其中至少一个划线特征形成在材料表面下方。 这样可以以比传统技术更高的速度清洁透明材料。 稍微修改超短脉冲激光加工条件会产生次表面痕迹。 当正确布置时，这些标记在侧面照明下清晰可见，并且在没有侧面照明的情况下不清晰可见。 此外，用于焊接透明材料的方法使用超短激光脉冲通过局部加热产生粘结。 超短脉冲持续时间导致激光辐射的非线性吸收，并且激光器的高重复率导致材料内的脉冲 - 脉冲积累的热量。 激光聚焦在材料界面附近，在待焊接的区域产生高能量通量。 这可以最大限度地减少对其余材料的损坏，并能实现细焊缝。

公开(公告)号：US09138913B2

公开(公告)日：2015-09-22

申请号：US12397567

申请日：2009-03-04

申请人： Alan Y. Arai ,  Gyu C. Cho ,  Jingzhou Xu ,  Fumiyo Yoshino ,  Haibin Zhang ,  James Bovatsek ,  Makoto Yoshida

发明人： Alan Y. Arai ,  Gyu C. Cho ,  Jingzhou Xu ,  Fumiyo Yoshino ,  Haibin Zhang ,  James Bovatsek ,  Makoto Yoshida

IPC分类号： B23K26/00 ,  B64D47/06 ,  B41J2/435 ,  B29C35/08 ,  B28D5/00 ,  B23K26/06 ,  B23K26/40 ,  B29C65/00 ,  B29C65/16 ,  B29C65/38

CPC分类号： B23K26/0624 ,  B23K26/0676 ,  B23K26/083 ,  B23K26/0869 ,  B23K26/21 ,  B23K26/324 ,  B23K26/359 ,  B23K26/364 ,  B23K26/40 ,  B23K26/402 ,  B23K26/53 ,  B23K26/55 ,  B23K2103/50 ,  B23K2103/54 ,  B28D5/00 ,  B28D5/0011 ,  B29C65/1606 ,  B29C65/1612 ,  B29C65/1619 ,  B29C65/1629 ,  B29C65/1635 ,  B29C65/1638 ,  B29C65/1654 ,  B29C65/1658 ,  B29C65/1687 ,  B29C65/38 ,  B29C66/1122 ,  B29C66/43 ,  B29C66/71 ,  B29C66/73161 ,  B29C66/73366 ,  B29C66/73921 ,  B29C66/836 ,  B29C66/952 ,  B29K2995/0026 ,  B41M5/26 ,  B41M5/262 ,  B41M5/267 ,  C03B23/006 ,  C03B33/102 ,  C03C23/0025 ,  H01L21/268 ,  H01L21/78 ,  B29K2069/00

摘要： Methods, devices, and systems for ultrashort pulse laser processing of optically transparent materials are presented, with example applications in scribing, marking, welding, and joining. For example, ultrashort laser pulses create multiple scribe features with one pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. Slightly modifying the ultrashort pulse laser processing conditions produces different types of sub-surface marks. When properly arranged, these marks are clearly visible with correctly aligned illumination through either light scattering or light reflection and nearly invisible without illumination. Transparent material other than glass may be utilized. A method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. In some embodiments of transparent material processing, a multifocus beam generator simultaneously forms multiple beam waists spaced depthwise relative to the transparent material, thereby increasing processing speed.

摘要翻译： 介绍了光学透明材料超短脉冲激光加工的方法，装置和系统，其中包括划线，标记，焊接和接合等应用。 例如，超短激光脉冲通过激光束穿过材料而产生多个刻划特征，其中至少一个刻划特征形成在材料表面下方。 稍微修改超短脉冲激光加工条件产生不同类型的子表面标记。 当正确布置时，这些标记通过光散射或光反射通过正确对准的照明而清晰可见，并且几乎不可见而不照射。 可以使用玻璃以外的透明材料。 用于焊接透明材料的方法使用超短激光脉冲通过局部加热产生粘结。 在透明材料处理的一些实施例中，多焦点光束发生器同时形成相对于透明材料沿深度方向间隔开的多个光束束，从而提高处理速度。

公开(公告)号：US20100012631A1

公开(公告)日：2010-01-21

申请号：US12571598

申请日：2009-10-01

申请人： James BOVATSEK ,  Alan Y. Arai ,  Fumiyo Yoshino

发明人： James BOVATSEK ,  Alan Y. Arai ,  Fumiyo Yoshino

IPC分类号： B23K26/38

CPC分类号： B23K26/0057 ,  B23K26/0617 ,  B23K26/0624 ,  B23K26/244 ,  B23K26/364 ,  B23K26/40 ,  B23K26/53 ,  B23K2103/50 ,  B28D5/0011 ,  B29C59/16 ,  B29C65/14 ,  B29C65/1616 ,  B29C65/1635 ,  B29C65/1638 ,  B29C65/1658 ,  B29C65/1664 ,  B29C65/1674 ,  B29C65/1696 ,  B29C65/38 ,  B29C66/1122 ,  B29C66/30223 ,  B29C66/322 ,  B29C66/3282 ,  B29C66/41 ,  B29C66/43 ,  B29C66/71 ,  B29C66/73366 ,  B29C66/7352 ,  B29C66/73921 ,  B29C66/836 ,  B29C66/91641 ,  B29C66/919 ,  B29C66/934 ,  B29C66/939 ,  B29C66/944 ,  B29C66/949 ,  B29K2033/12 ,  B29K2069/00 ,  B29K2995/0026 ,  B81B1/00 ,  B81C1/00119 ,  C03B23/20 ,  C03B23/203 ,  C03B33/0222 ,  C03C23/0025 ,  Y10T428/13 ,  Y10T428/15 ,  Y10T428/24479 ,  Y10T428/24802 ,  B29C65/00

摘要： Methods for ultrashort pulse laser processing of optically transparent materials. A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with side-illumination and not clearly visible without side-illumination. In addition, a method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. The ultrashort pulse duration causes nonlinear absorption of the laser radiation, and the high repetition rate of the laser causes pulse-to-pulse accumulation of heat within the materials. The laser is focused near the interface of the materials, generating a high energy fluence at the region to be welded. This minimizes damage to the rest of the material and enables fine weld lines.