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公开(公告)号：US09527721B2
公开(公告)日：2016-12-27
申请号：US14713243
申请日：2015-05-15
发明人： Shyh-Wei Cheng , Chao-Po Lu , Chung-Hsien Hun , Chih-Shan Chen , Chuan-Yi Ko , Chih-Yu Wang , Hsi-Cheng Hsu , Ji-Hong Chiang , Jui-Chun Weng , Wei-Ding Wu
CPC分类号： B81B3/0005 , B81B3/001 , B81B2201/0235 , B81B2207/012 , B81C1/00984 , B81C2203/0109 , B81C2203/0118 , B81C2203/035 , B81C2203/036 , B81C2203/0785 , B81C2203/0792 , H01L2224/81805 , H01L2924/1461 , H01L2924/16235
摘要： The present disclosure relates to a microelectromechanical systems (MEMS) package with an anti-stiction layer, and an associated method of formation. In some embodiments, the MEMS package comprises a device substrate and a CMOS substrate. The device substrate comprises a MEMS device having a moveable or flexible part that is movable or flexible with respect to the device substrate. A surface of the moveable or flexible part is coated by a conformal anti-stiction layer made of polycrystalline silicon. A method for manufacturing the MEMS package is also provided.
摘要翻译： 本公开涉及具有抗静电层的微机电系统（MEMS）封装以及相关联的形成方法。 在一些实施例中，MEMS封装包括器件衬底和CMOS衬底。 器件衬底包括具有相对于器件衬底可移动或柔性的可移动或柔性部件的MEMS器件。 可移动或柔性部分的表面由多晶硅制成的共形抗静电层涂覆。 还提供了一种制造MEMS封装的方法。
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公开(公告)号：US20160332863A1
公开(公告)日：2016-11-17
申请号：US14713243
申请日：2015-05-15
发明人： Shyh-Wei Cheng , Chao-Po Lu , Chung-Hsien Hun , Chih-Shan Chen , Chuan-Yi Ko , Chih-Yu Wang , Hsi-Cheng Hsu , Ji-Hong Chiang , Jui-Chun Weng , Wei-Ding Wu
CPC分类号： B81B3/0005 , B81B3/001 , B81B2201/0235 , B81B2207/012 , B81C1/00984 , B81C2203/0109 , B81C2203/0118 , B81C2203/035 , B81C2203/036 , B81C2203/0785 , B81C2203/0792 , H01L2224/81805 , H01L2924/1461 , H01L2924/16235
摘要： The present disclosure relates to a microelectromechanical systems (MEMS) package with an anti-stiction layer, and an associated method of formation. In some embodiments, the MEMS package comprises a device substrate and a CMOS substrate. The device substrate comprises a MEMS device having a moveable or flexible part that is movable or flexible with respect to the device substrate. A surface of the moveable or flexible part is coated by a conformal anti-stiction layer made of polycrystalline silicon. A method for manufacturing the MEMS package is also provided.
摘要翻译： 本公开涉及具有抗静电层的微机电系统（MEMS）封装以及相关联的形成方法。 在一些实施例中，MEMS封装包括器件衬底和CMOS衬底。 器件衬底包括具有相对于器件衬底可移动或柔性的可移动或柔性部件的MEMS器件。 可移动或柔性部分的表面由多晶硅制成的共形抗静电层涂覆。 还提供了一种制造MEMS封装的方法。
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公开(公告)号：US20190010047A1
公开(公告)日：2019-01-10
申请号：US16114521
申请日：2018-08-28
发明人： Shyh-Wei Cheng , Chih-Yu Wang , Hsi-Cheng Hsu , Hsin-Yu Chen , Ji-Hong Chiang , Jui-Chun Weng , Wei-Ding Wu
CPC分类号： B81B7/0041 , B81B3/0081 , B81B2201/0235 , B81B2201/0242 , B81B2207/012 , B81B2207/07 , B81B2207/09 , B81C1/00293 , B81C2201/013 , B81C2203/0109 , B81C2203/0118 , B81C2203/037 , B81C2203/038 , B81C2203/0735 , H01L28/20
摘要： The present disclosure relates to a micro-electromechanical system (MEMs) package. In some embodiments, the MEMs package has a plurality of conductive interconnect layers disposed within a dielectric structure over an upper surface of a first substrate. A heating element is electrically coupled to a semiconductor device within the first substrate by one or more of the plurality of conductive interconnect layers. The heating element is vertically separated from the first substrate by the dielectric structure. A MEMs substrate is coupled to the first substrate and has a MEMs device. A hermetically sealed chamber surrounding the MEMs device is disposed between the first substrate and the MEMs substrate. An out-gassing material is disposed laterally between the hermetically sealed chamber and the heating element.
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公开(公告)号：US20170203962A1
公开(公告)日：2017-07-20
申请号：US15182754
申请日：2016-06-15
发明人： Shyh-Wei Cheng , Hsi-Cheng Hsu , Hsin-Yu Chen , Ji-Hong Chiang , Jui-Chun Weng , Wei-Ding Wu , Yu-Jui Wu , Ching-Hsiang Hu , Ming-Tsung Chen
CPC分类号： B81C1/00285 , B81B7/0038 , B81B2201/0235 , B81B2201/0242 , B81B2207/012 , B81B2207/07 , B81C2203/0118 , B81C2203/0792
摘要： The present disclosure relates to a MEMS package having an outgassing element configured to adjust a pressure within a hermetically sealed cavity by inducing outgassing of into the cavity, and an associated method. In some embodiments, the method is performed by forming an outgassing element within a passivation layer over a CMOS substrate and forming an outgassing resistive layer to cover the outgassing element. The outgassing resistive layer is removed from over the outgassing element, and the MEMS substrate is bonded to a front side of the CMOS substrate to enclose a first MEMS device within a first cavity and a second MEMS device within a second cavity. After removing the outgassing resistive layer, the outgassing element releases a gas into the second cavity to increase a second pressure of the second cavity to be greater than a first pressure of the first cavity.
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公开(公告)号：US09090452B2
公开(公告)日：2015-07-28
申请号：US14098974
申请日：2013-12-06
发明人： Shyh-Wei Cheng , Jui-Chun Weng , Hsi-Cheng Hsu , Chih-Yu Wang , Chuan-Yi Ko , Ji-Hong Chiang , Chung-Hsien Hung , Hsin-Yu Chen , Chih-Hsien Chen , Yu-Mei Wu , Jong Chen
CPC分类号： B81B3/001 , B81B3/0005
摘要： Embodiments of mechanisms for forming a micro-electro mechanical system (MEMS) device are provided. The MEMS device includes a substrate and a MEMS substrate disposed on the substrate. The MEMS substrate includes a movable element, a fixed element and at least a spring connected to the movable element and the fixed element. The MEMS device also includes a polysilicon layer on the movable element.
摘要翻译： 提供了用于形成微机电系统（MEMS）装置的机构的实施例。 MEMS器件包括设置在衬底上的衬底和MEMS衬底。 MEMS基板包括可移动元件，固定元件和连接到可移动元件和固定元件的至少一个弹簧。 MEMS器件还包括可移动元件上的多晶硅层。
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公开(公告)号：US11454820B2
公开(公告)日：2022-09-27
申请号：US16656290
申请日：2019-10-17
发明人： Hsin-Yu Chen , Yen-Chiang Liu , Jiun-Jie Chiou , Jia-Syuan Li , You-Cheng Jhang , Shin-Hua Chen , Lavanya Sanagavarapu , Han-Zong Pan , Chun-Peng Li , Chia-Chun Hung , Ching-Hsiang Hu , Wei-Ding Wu , Jui-Chun Weng , Ji-Hong Chiang , Hsi-Cheng Hsu
IPC分类号： G02B27/30 , G02B5/20 , G02B26/00 , H01L27/146 , H01L31/0216 , G06V40/13
摘要： Disclosed is a cost-effective method to fabricate a multifunctional collimator structure for contact image sensors to filter ambient infrared light to reduce noises. In one embodiment, an optical collimator, includes: a dielectric layer; a substrate; a plurality of via holes; and a conductive layer, wherein the dielectric layer is formed over the substrate, wherein the plurality of via holes are configured as an array along a lateral direction of a first surface of the dielectric layer, wherein each of the plurality of via holes extends through the dielectric layer and the substrate from the first surface of the dielectric layer to a second surface of the substrate in a vertical direction.
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公开(公告)号：US11407636B2
公开(公告)日：2022-08-09
申请号：US16122180
申请日：2018-09-05
发明人： Shyh-Wei Cheng , Chih-Yu Wang , Hsi-Cheng Hsu , Ji-Hong Chiang , Jui-Chun Weng , Shiuan-Jeng Lin , Wei-Ding Wu , Ching-Hsiang Hu
摘要： The present disclosure, in some embodiments, relates to a method of forming a micro-electromechanical system (MEMS) package. The method includes forming one or more depressions within a capping substrate. A back-side of a MEMS substrate is bonded to the capping substrate after forming the one or more depressions, so that the one or more depressions define one or more cavities between the capping substrate and the MEMS substrate. A front-side of the MEMS substrate is selectively etched to form one or more trenches extending through the MEMS substrate, and one or more polysilicon vias are formed within the one or more trenches. A conductive bonding structure is formed on the front-side of the MEMS substrate at a location contacting the one or more polysilicon vias. The MEMS substrate is bonded to a CMOS substrate having one or more semiconductor devices by way of the conductive bonding structure.
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公开(公告)号：US11305980B2
公开(公告)日：2022-04-19
申请号：US16717862
申请日：2019-12-17
发明人： Jui-Chun Weng , Lavanya Sanagavarapu , Ching-Hsiang Hu , Wei-Ding Wu , Shyh-Wei Cheng , Ji-Hong Chiang , Hsin-Yu Chen , Hsi-Cheng Hsu
摘要： A method for treating a micro electro-mechanical system (MEMS) component is disclosed. In one example, the method includes the steps of providing a first wafer, treating the first wafer to form cavities and at least an oxide layer on a top surface of the first wafer using a first chemical vapor deposition (CVD) process, providing a second wafer, bonding the second wafer on a top surface of the at least one oxide layer, treating the second wafer to form a first plurality of structures, depositing a layer of Self-Assembling Monolayer (SAM) to a surface of the MEMS component using a second CVD process.
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公开(公告)号：US09884758B2
公开(公告)日：2018-02-06
申请号：US15182754
申请日：2016-06-15
发明人： Shyh-Wei Cheng , Hsi-Cheng Hsu , Hsin-Yu Chen , Ji-Hong Chiang , Jui-Chun Weng , Wei-Ding Wu , Yu-Jui Wu , Ching-Hsiang Hu , Ming-Tsung Chen
CPC分类号： B81C1/00285 , B81B7/0038 , B81B2201/0235 , B81B2201/0242 , B81B2207/012 , B81B2207/07 , B81C2203/0118 , B81C2203/0792
摘要： The present disclosure relates to a MEMS package having an outgassing element configured to adjust a pressure within a hermetically sealed cavity by inducing outgassing of into the cavity, and an associated method. In some embodiments, the method is performed by forming an outgassing element within a passivation layer over a CMOS substrate and forming an outgassing resistive layer to cover the outgassing element. The outgassing resistive layer is removed from over the outgassing element, and the MEMS substrate is bonded to a front side of the CMOS substrate to enclose a first MEMS device within a first cavity and a second MEMS device within a second cavity. After removing the outgassing resistive layer, the outgassing element releases a gas into the second cavity to increase a second pressure of the second cavity to be greater than a first pressure of the first cavity.
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公开(公告)号：US20170107097A1
公开(公告)日：2017-04-20
申请号：US14980297
申请日：2015-12-28
发明人： Shyh-Wei Cheng , Chih-Yu Wang , Hsi-Cheng Hsu , Ji-Hong Chiang , Jui-Chun Weng , Shiuan-Jeng Lin , Wei-Ding Wu , Ching-Hsiang Hu
CPC分类号： B81B7/007 , B81B7/0006 , B81B2207/012 , B81B2207/096 , B81C1/00238 , B81C1/00301 , B81C2201/013 , B81C2203/0109 , B81C2203/0118 , B81C2203/037 , B81C2203/0792
摘要： The present disclosure relates to micro-electromechanical system (MEMS) package that uses polysilicon inter-tier connections to provide for a low parasitic capacitance in MEM device signals, and a method of formation. In some embodiments, the MEMS package has a CMOS substrate with one or more semiconductor devices arranged within a semiconductor body. A MEMS substrate having an ambulatory element is connected to the CMOS substrate by a conductive bonding structure. The conductive bonding structure is arranged on a front-side of the MEMS substrate at a location laterally offset from the ambulatory element. One or more polysilicon vias extend through the conductive MEMS substrate to the bonding structure. The one or more polysilicon vias are configured to electrically couple the MEMS substrate to the CMOS substrate. By connecting the MEMS substrate to the CMOS substrate using the polysilicon vias, the parasitic capacitance and form factor of the MEMS package are reduced.
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