摘要:
A semiconductor memory device that operates in various modes such as in a normal operation mode and a disturb accelerated test mode in which two word lines are activated simultaneously, includes a boosting power supply circuit, a boosted voltage supply line, and an input terminal connected to the boosted voltage supply line. In a disturb accelerated test mode or in a burn-in test mode, an external voltage is supplied from an external power supply to the input terminal. A word line is reliably boosted in voltage in a disturb accelerated test mode.
摘要:
A semiconductor memory device operates switched between a first readout mode in which data readout according to a specified activation of a column address strobe signal /CAS that shows a transition in synchronization with an external clock signal is output during a period including the specified activation of signal /CAS, and a second readout mode in which the readout data is output during a subsequent predetermined period of signal /CAS. A control circuit for controlling the data output timing from an output buffer activates the output buffer at an elapse of a predetermined time following the specified activation of signal /CAS in the first readout mode. In the second readout mode, the control circuit activates the output buffer according to activation of signal /CAS at a predetermined period.
摘要:
A semiconductor memory device includes a memory cell array, peripheral circuits including a column decoder for connecting a word line, and a VDC circuit for peripherals, for generating an internal power supply voltage based on an external power supply voltage. VDC circuit for peripherals supplies the internal power supply voltage to peripheral circuits including the column decoder, other than the sense amplifier, output buffer and internal initial stage. The supplying capability of the VDC circuit for peripherals is increased in response to a VDCE signal which is output from a clock generation circuit when column decoder is activated. Therefore, even when power consumption in the peripheral circuit is increased as the column decoder is activated, sufficient power can be supplied to the peripheral circuit.
摘要:
In a predetermined multibit test mode, a multibit test circuit 114 issues determination result data pairs RDM0 and /RDM0 to RDM3 and /RDM3, each of which corresponds to match/mismatch of logics of data read from memory cells selected by one column select line in corresponding one of memory cell plane blocks. In each memory cell plane block, memory cell columns selected by one single column select line can be replaced as a unit. The unit of memory cell columns containing a defective memory cell is replaced in accordance with determination result data RDM0 and /RDM0 to RDM3 and /RDM3.
摘要:
An input first stage is used for inputting both addresses and address keys. A test mode setting circuit and a function setting circuit are disposed between the input first stage and an address buffer. Each function setting mode buffer latches an internal address signal when a signal/RAS falls. Further, a function signal generating circuit is initialized by a power-on reset signal when a power supply is turned on.
摘要:
In a predetermined multibit test mode, a multibit test circuit 114 issues determination result data pairs RDM0 and /RDM0 to RDM3 and /RDM3, each of which corresponds to match/mismatch of logics of data read from memory cells selected by one column select line in corresponding one of memory cell plane blocks. In each memory cell plane block, memory cell columns selected by one single column select line can be replaced as a unit. The unit of memory cell columns containing a defective memory cell is replaced in accordance with determination result data RDM0 and /RDM0 to RDM3 and /RDM3.
摘要:
A semiconductor device comprises an MOS transistor, as a capacitive element, formed at the surface of a semiconductor substrate. A first power supply interconnection, above the substrate, applies a first power supply potential to the source and drain of the transistor. A second power supply interconnection, above the first interconnection, applies a second potential to the gate of the transistor. A third power supply interconnection is formed above, in parallel with and connected to the second power supply interconnection. An externally sourced potential is down-converted to be applied appropriately to the first, second and third power supply interconnections. This configuration achieves a semiconductor device that is less susceptible to power supply noise.
摘要:
A shot region includes a device region for forming a semiconductor device therein and a dicing region used for dicing. A portion of the peripheral edge portion of the shot region is defined by a portion of the peripheral edge portion of the device region. An alignment mark is arranged within the device region, and additional alignment marks are arranged within the dicing region. Thus, the number of the devices manufactured per wafer can be increased without degrading precision of alignment.
摘要:
A semiconductor device comprises an MOS transistor, as a capacitive element, formed at the surface of a semiconductor substrate. A first power supply interconnection, above the substrate, applies a first power supply potential to the source and drain of the transistor. A second power supply interconnection, above the first interconnection, applies a second potential to the gate of the transistor. A third power supply interconnection is formed above, in parallel with and connected to the second power supply interconnection. An externally sourced potential is down-converted to be applied appropriately to the first, second and third power supply interconnections. This configuration achieves a semiconductor device that is less susceptible to power supply noise.
摘要:
A semiconductor memory device includes a memory cell array, peripheral circuits including a column decoder for connecting a word line, and a VDC circuit for peripherals, for generating an internal power supply voltage based on an external power supply voltage. VDC circuit for peripherals supplies the internal power supply voltage to peripheral circuits including the column decoder, other than the sense amplifier, output buffer and internal initial stage. The supplying capability of the VDC circuit for peripherals is increased in response to a VDCE signal which is output from a clock generation circuit when column decoder is activated. Therefore, even when power consumption in the peripheral circuit is increased as the column decoder is activated, sufficient power can be supplied to the peripheral circuit.