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    Thermosetting adhesive and pressure-sensitive adhesive composition, thermosetting adhesive and pressure-sensitive adhesive tape or sheet, and wiring circuit board
    1.
    发明申请
    Thermosetting adhesive and pressure-sensitive adhesive composition, thermosetting adhesive and pressure-sensitive adhesive tape or sheet, and wiring circuit board 审中-公开
    热固性粘合剂和压敏粘合剂组合物，热固性粘合剂和压敏胶带或片材和布线电路板

    公开(公告)号：US20070036953A1

    公开(公告)日：2007-02-15

    申请号：US11502376

    申请日：2006-08-11

    申请人： Takahiro Nonaka ,  Miyoko Ikishima ,  Kanji Nishida ,  Masahiro Ooura

    发明人： Takahiro Nonaka ,  Miyoko Ikishima ,  Kanji Nishida ,  Masahiro Ooura

    IPC分类号： B32B3/00

    CPC分类号： H05K3/386 ,  C08L61/06 ,  C08L2666/02 ,  C09J133/08 ,  C09J2201/606 ,  H05K3/0032 ,  H05K3/0058 ,  H05K3/281 ,  H05K2201/0112 ,  H05K2201/0355 ,  Y10T428/24917

    摘要： A thermosetting adhesive and pressure-sensitive adhesive composition containing 100 parts by weight of an acrylic polymer (X) containing, as monomer components, a (meth)acrylic acid alkyl ester (a) where the alkyl group has 2 to 14 carbon atoms in an amount of 60 to 75% by weight relative to the total amount of monomer components, a cyano group-containing monomer (b) in an amount of 20 to 35% by weight relative to the total amount of monomer components, and a carboxyl group-containing monomer (c) in an amount of 0.5 to 10% by weight relative to the total amount of monomer components and 1 to 20 parts by weight of a carbolic acid-based resorcinol-type phenol resin (Y) represented by the following formula (1), and further containing an ultraviolet absorbent (Z). wherein R1 represents —CH2— or —CH2—O—CH2—, n is a positive integer, and m is an integer of 1 to 4.

    摘要翻译： 含有100重量份丙烯酸类聚合物（X）的热固性粘合剂和压敏粘合剂组合物，其含有（甲基）丙烯酸烷基酯（a）作为单体组分，其中烷基具有2至14个碳原子 相对于单体成分的总量为60〜75重量％的含氰基单体（b），相对于单体成分的总量为20〜35重量％ 含有单体（c）的量相对于单体成分的总量为0.5〜10重量％，和1〜20重量份由下式表示的碳酸间苯二酚型酚醛树脂（Y） 1），并且还含有紫外线吸收剂（Z）。 其中R 1表示-CH 2 - 或-CH 2 -O-CH 2 - ，n是 正整数，m为1〜4的整数。

    Double-sided pressure-sensitive adhesive tape or sheet for wiring circuit board and wiring circuit board
    2.
    发明授权
    Double-sided pressure-sensitive adhesive tape or sheet for wiring circuit board and wiring circuit board 失效
    用于布线电路板和布线电路板的双面压敏胶带或片

    公开(公告)号：US07927697B2

    公开(公告)日：2011-04-19

    申请号：US11783631

    申请日：2007-04-11

    申请人： Takahiro Nonaka ,  Miyoko Ikishima ,  Noritsugu Daigaku ,  Masahiro Oura ,  Masahiko Ando

    发明人： Takahiro Nonaka ,  Miyoko Ikishima ,  Noritsugu Daigaku ,  Masahiro Oura ,  Masahiko Ando

    IPC分类号： B32B7/12 ,  B32B27/30

    CPC分类号： H05K3/007 ,  C09J7/21 ,  C09J7/38 ,  C09J7/385 ,  C09J2201/128 ,  C09J2203/326 ,  C09J2433/00 ,  H05K1/0393 ,  H05K2203/0152 ,  H05K2203/0191 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/28 ,  Y10T428/2852 ,  Y10T428/2878 ,  Y10T428/2891

    摘要： The present invention relates to a double-sided pressure-sensitive adhesive tape or sheet for wiring circuit board, which comprises a pressure-sensitive adhesive layer formed by a pressure-sensitive adhesive composition containing an acrylic polymer and a chain transfer substance, in which the pressure-sensitive adhesive layer has characteristics that a gel fraction in the initial stage is from 40 to 70% by weight, and a difference between a gel fraction (% by weight) of the pressure-sensitive adhesive layer after the following solder reflow step and the gel fraction (% by weight) of the pressure-sensitive adhesive layer in the initial stage is 10 or less. The solder reflow step satisfies the following heat treatment conditions. Surface temperature of the double-sided pressure-sensitive adhesive tape or sheet reaches 175±10° C. within 130 to 180 seconds, the surface temperature reaches 230±10° C. within 200 to 250 seconds, the surface temperature reaches 255±15° C. within 260 to 300 seconds and the solder reflow step finishes within 370 seconds after start of the solder reflow step for the double-sided pressure-sensitive adhesive tape or sheet.

    摘要翻译： 本发明涉及一种用于布线电路板的双面压敏粘合带或片，其包括由含有丙烯酸类聚合物和链转移物质的压敏粘合剂组合物形成的压敏粘合剂层，其中 压敏粘合剂层具有以下特征：初始阶段的凝胶分数为40〜70重量％，以下的回流焊步骤后的粘合剂层的凝胶分数（重量％）与第 初始阶段的粘合剂层的凝胶分数（重量％）为10以下。 回流焊步骤满足以下热处理条件。 表面温度在130〜180秒内达到175±10℃，表面温度在200〜250秒内达到230±10℃，表面温度达到255±15℃ 在260〜300秒钟内，并且焊料回流步骤在对双面压敏粘合带或片材进行的焊料回流步骤开始后的370秒内完成。

    Double-sided pressure-sensitive adhesive tape or sheet for wiring circuit board and wiring circuit board
    3.
    发明申请
    Double-sided pressure-sensitive adhesive tape or sheet for wiring circuit board and wiring circuit board 失效
    用于布线电路板和布线电路板的双面压敏胶带或片

    公开(公告)号：US20070237949A1

    公开(公告)日：2007-10-11

    申请号：US11783631

    申请日：2007-04-11

    申请人： Takahiro Nonaka ,  Miyoko Ikishima ,  Noritsugu Daigaku ,  Masahiro Oura ,  Masahiko Ando

    发明人： Takahiro Nonaka ,  Miyoko Ikishima ,  Noritsugu Daigaku ,  Masahiro Oura ,  Masahiko Ando

    IPC分类号： B32B3/00 ,  B32B18/00 ,  B32B7/12

    CPC分类号： H05K3/007 ,  C09J7/21 ,  C09J7/38 ,  C09J7/385 ,  C09J2201/128 ,  C09J2203/326 ,  C09J2433/00 ,  H05K1/0393 ,  H05K2203/0152 ,  H05K2203/0191 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/28 ,  Y10T428/2852 ,  Y10T428/2878 ,  Y10T428/2891

    摘要： The present invention relates to a double-sided pressure-sensitive adhesive tape or sheet for wiring circuit board, which comprises a pressure-sensitive adhesive layer formed by a pressure-sensitive adhesive composition containing an acrylic polymer and a chain transfer substance, in which the pressure-sensitive adhesive layer has characteristics that a gel fraction in the initial stage is from 40 to 70% by weight, and a difference between a gel fraction (% by weight) of the pressure-sensitive adhesive layer after the following solder reflow step and the gel fraction (% by weight) of the pressure-sensitive adhesive layer in the initial stage is 10 or less. The solder reflow step satisfies the following heat treatment conditions. Surface temperature of the double-sided pressure-sensitive adhesive tape or sheet reaches 175±10° C. within 130 to 180 seconds, the surface temperature reaches 230±10° C. within 200 to 250 seconds, the surface temperature reaches 255±15° C. within 260 to 300 seconds and the solder reflow step finishes within 370 seconds after start of the solder reflow step for the double-sided pressure-sensitive adhesive tape or sheet.

    摘要翻译： 本发明涉及一种用于布线电路板的双面压敏粘合带或片，其包括由含有丙烯酸类聚合物和链转移物质的压敏粘合剂组合物形成的压敏粘合剂层，其中 压敏粘合剂层具有以下特征：初始阶段的凝胶分数为40〜70重量％，以下的回流焊步骤后的粘合剂层的凝胶分数（重量％）与第 初始阶段的粘合剂层的凝胶分数（重量％）为10以下。 回流焊步骤满足以下热处理条件。 表面温度在130〜180秒内达到175±10℃，表面温度在200〜250秒内达到230±10℃，表面温度达到255±15℃ 在260〜300秒钟内，并且焊料回流步骤在对双面压敏粘合带或片材进行的焊料回流步骤开始后的370秒内完成。

    DOUBLE-COATED PRESSURE SENSITIVE ADHESIVE SHEET FOR FIXING HARD DISK DRIVE COMPONENT AND HARD DISK DRIVE
    4.
    发明申请
    DOUBLE-COATED PRESSURE SENSITIVE ADHESIVE SHEET FOR FIXING HARD DISK DRIVE COMPONENT AND HARD DISK DRIVE 审中-公开
    用于固定硬盘驱动器组件和硬盘驱动器的双层压敏敏感胶片

    公开(公告)号：US20100124627A1

    公开(公告)日：2010-05-20

    申请号：US12452734

    申请日：2008-08-20

    申请人： Takahiro Nonaka ,  Noritsugu Daigaku ,  Masahiro Ooura

    发明人： Takahiro Nonaka ,  Noritsugu Daigaku ,  Masahiro Ooura

    IPC分类号： C09J7/02 ,  B32B33/00

    CPC分类号： C09D123/0815 ,  C08F2220/1825 ,  C08K5/0025 ,  C08L23/16 ,  C08L63/00 ,  C08L2666/16 ,  C09J7/385 ,  C09J133/066 ,  C09J2201/128 ,  C09J2201/606 ,  C09J2205/102 ,  Y10T428/1476 ,  C08L2666/06 ,  C08F220/06 ,  C08F2220/281

    摘要： Disclosed is a double-coated pressure-sensitive adhesive sheet adopted to fix a hard disk drive component, which includes a pressure-sensitive adhesive unit including a plastic film base having a thickness of 20 μm or less and pressure-sensitive adhesive layers arranged on or above both sides of the plastic film base; and non-silicone release liners arranged on both surfaces of the pressure-sensitive adhesive unit. The pressure-sensitive adhesive unit has a thickness of 60 μm or less, and the double-coated pressure-sensitive adhesive sheet shows an outgassing of 1 μg/cm2 or less when the double-coated pressure-sensitive adhesive sheet is heated at a temperature of 120° C. for 10 minutes. The double-coated pressure-sensitive adhesive sheet is free from silicone, thereby causes less contamination, evolves less outgas, and is superior in workability. It has further improved followability to difference in level by controlling the thickness of the plastic film base to 13 μm or less. Additionally, it becomes resistant to “lifting” from an adherend even when subjected to a heating process after affixation, by specifying the gel fraction of the pressure-sensitive adhesive layer within a range of 10% to 60%.

    摘要翻译： 公开了一种用于固定硬盘驱动部件的双面压敏粘合片，其包括具有厚度为20μm或更小的塑料膜基底的压敏粘合单元和布置在其上的压敏粘合剂层 塑料薄膜底座两侧; 以及布置在压敏粘合剂单元的两个表面上的非硅氧烷剥离衬垫。 压敏粘合剂单元的厚度为60μm以下，当双面压敏粘合片在温度加热时，双面压敏粘合片的脱气量为1μg/ cm 2以下 120℃下10分钟。 双面压敏粘合片不含有机硅，因此污染少，排出量少，加工性优异。 通过将塑料膜基材的厚度控制在13μm以下，进一步提高了水平差的追随性。 此外，即使在固定后进行加热处理，也可以通过将粘合剂层的凝胶分数规定在10〜60％的范围内，从被粘物“提升”。

    DOUBLE-SIDED PRESSURE-SENSITIVE ADHESIVE TAPE AND WIRING CIRCUIT BOARD
    5.
    发明申请
    DOUBLE-SIDED PRESSURE-SENSITIVE ADHESIVE TAPE AND WIRING CIRCUIT BOARD 审中-公开
    双面压敏胶带和接线电路板

    公开(公告)号：US20110061923A1

    公开(公告)日：2011-03-17

    申请号：US12736803

    申请日：2009-04-24

    申请人： Takahiro Nonaka ,  Noritsugu Daigaku ,  Masahiro Ooura

    发明人： Takahiro Nonaka ,  Noritsugu Daigaku ,  Masahiro Ooura

    IPC分类号： H05K1/02 ,  B32B7/12

    CPC分类号： H05K3/0061 ,  C09J7/21 ,  C09J2201/128 ,  C09J2400/263 ,  H05K1/0393 ,  H05K3/386 ,  H05K2203/0191 ,  Y10T428/265

    摘要： A double-sided pressure-sensitive adhesive tape includes a nonwoven fabric substrate and pressure-sensitive adhesive layers present on both sides of the substrate, in which the nonwoven fabric substrate contains at least Manila hemp, has a thickness of 18 μm or less, and has a tensile strength in a machine direction of 4 N/15 mm or more. The double-sided pressure-sensitive adhesive tape is thin and is effective for the reduction in size and thickness of products to be fixed through the tape. The tape has a high strength in the machine direction and does not break during production and processing processes. In addition, the tape has a nonwoven fabric substrate and thereby excels also in punching quality. The tape is therefore particularly useful as a double-sided pressure-sensitive adhesive tape for fixing a wiring circuit board.

    摘要翻译： 双面压敏粘合带包括无纺布基材和存在于基材两侧的压敏粘合剂层，其中非织造织物基材至少含有马尼拉麻，厚度为18μm以下，和 在纵向的拉伸强度为4N / 15mm以上。 双面压敏粘合带薄，对于通过带固定的产品的尺寸和厚度的减小是有效的。 胶带在机器方向上具有高强度，在生产和加工过程中不会破裂。 此外，胶带具有非织造织物基材，从而在冲压质量上也优异。 因此，胶带作为用于固定布线电路板的双面压敏胶粘带是特别有用的。

    OPTICAL PRESSURE-SENSITIVE ADHESIVE SHEET
    7.
    发明申请
    OPTICAL PRESSURE-SENSITIVE ADHESIVE SHEET 审中-公开
    光敏压敏粘合片

    公开(公告)号：US20120189835A1

    公开(公告)日：2012-07-26

    申请号：US13357709

    申请日：2012-01-25

    申请人： Shou Takarada ,  Hiroaki Kishioka ,  Takahiro Nonaka ,  Hirofumi Katami ,  Masato Fujita

    发明人： Shou Takarada ,  Hiroaki Kishioka ,  Takahiro Nonaka ,  Hirofumi Katami ,  Masato Fujita

    IPC分类号： B32B3/00 ,  C08F220/10 ,  C08F220/26

    CPC分类号： B32B7/12 ,  B32B2405/00 ,  C09J7/10 ,  C09J7/385 ,  C09J2201/622 ,  C09J2203/318 ,  C09J2205/31 ,  C09J2433/00

    摘要： The present invention provides an optical pressure-sensitive adhesive sheet excellent in the productivity, and is reduced in the remaining of an air bubble after an autoclave treatment or the generation of a delayed bubble when laminating the optical pressure-sensitive adhesive sheet to an optical member. The present invention relates to an optical pressure-sensitive adhesive sheet, which comprises an acrylic pressure-sensitive adhesive layer, wherein the acrylic pressure-sensitive adhesive layer is formed by an active energy ray polymerization, a gel fraction of the acrylic pressure-sensitive adhesive layer is 80 wt % or less, and a content of a component having a molecular weight of 50,000 or less in a sol matter of the acrylic pressure-sensitive adhesive layer is 20 wt % or less.

    摘要翻译： 本发明提供了一种生产率优异的光学压敏粘合片，并且在将压光胶粘剂层压到光学部件上之后，在高压釜处理之后的气泡剩余部分或延迟气泡的产生中减少 。 本发明涉及一种光学压敏粘合片，其包含丙烯酸类压敏粘合剂层，其中丙烯酸类压敏粘合剂层通过活性能量射线聚合形成，丙烯酸类压敏粘合剂的凝胶分数 层的比例为80重量％以下，丙烯酸类粘合剂层的溶胶物质中分子量为50,000以下的成分的含量为20重量％以下。