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14 条记录 (耗时 0.022 秒)

    Thermosetting adhesive and pressure-sensitive adhesive composition, thermosetting adhesive and pressure-sensitive adhesive tape or sheet, and wiring circuit board
    1.
    发明申请
    Thermosetting adhesive and pressure-sensitive adhesive composition, thermosetting adhesive and pressure-sensitive adhesive tape or sheet, and wiring circuit board 审中-公开
    热固性粘合剂和压敏粘合剂组合物，热固性粘合剂和压敏胶带或片材和布线电路板

    公开(公告)号：US20070036953A1

    公开(公告)日：2007-02-15

    申请号：US11502376

    申请日：2006-08-11

    申请人： Takahiro Nonaka ,  Miyoko Ikishima ,  Kanji Nishida ,  Masahiro Ooura

    发明人： Takahiro Nonaka ,  Miyoko Ikishima ,  Kanji Nishida ,  Masahiro Ooura

    IPC分类号： B32B3/00

    CPC分类号： H05K3/386 ,  C08L61/06 ,  C08L2666/02 ,  C09J133/08 ,  C09J2201/606 ,  H05K3/0032 ,  H05K3/0058 ,  H05K3/281 ,  H05K2201/0112 ,  H05K2201/0355 ,  Y10T428/24917

    摘要： A thermosetting adhesive and pressure-sensitive adhesive composition containing 100 parts by weight of an acrylic polymer (X) containing, as monomer components, a (meth)acrylic acid alkyl ester (a) where the alkyl group has 2 to 14 carbon atoms in an amount of 60 to 75% by weight relative to the total amount of monomer components, a cyano group-containing monomer (b) in an amount of 20 to 35% by weight relative to the total amount of monomer components, and a carboxyl group-containing monomer (c) in an amount of 0.5 to 10% by weight relative to the total amount of monomer components and 1 to 20 parts by weight of a carbolic acid-based resorcinol-type phenol resin (Y) represented by the following formula (1), and further containing an ultraviolet absorbent (Z). wherein R1 represents —CH2— or —CH2—O—CH2—, n is a positive integer, and m is an integer of 1 to 4.

    摘要翻译： 含有100重量份丙烯酸类聚合物（X）的热固性粘合剂和压敏粘合剂组合物，其含有（甲基）丙烯酸烷基酯（a）作为单体组分，其中烷基具有2至14个碳原子 相对于单体成分的总量为60〜75重量％的含氰基单体（b），相对于单体成分的总量为20〜35重量％ 含有单体（c）的量相对于单体成分的总量为0.5〜10重量％，和1〜20重量份由下式表示的碳酸间苯二酚型酚醛树脂（Y） 1），并且还含有紫外线吸收剂（Z）。 其中R 1表示-CH 2 - 或-CH 2 -O-CH 2 - ，n是 正整数，m为1〜4的整数。

    Laser processing method and land laser processed product
    5.
    发明授权
    Laser processing method and land laser processed product 有权
    激光加工方法和陆地激光加工产品

    公开(公告)号：US09566663B2

    公开(公告)日：2017-02-14

    申请号：US12663185

    申请日：2008-06-05

    申请人： Kanji Nishida ,  Naoyuki Matsuo ,  Atsushi Hino

    发明人： Kanji Nishida ,  Naoyuki Matsuo ,  Atsushi Hino

    IPC分类号： B23K26/00 ,  B23K26/02 ,  B23K26/38 ,  B23K26/40

    CPC分类号： B23K26/02 ,  B23K26/38 ,  B23K26/402 ,  B23K2103/42 ,  B23K2103/50 ,  B29C2791/009 ,  B29C2793/00

    摘要： There is provided a laser beam processing method in which generation of foreign substances from cut can be suppressed and contamination of a surface of a work can be decreased when performing the processing method using a laser beam on the work made of a polymer material, and a laser processed product. Further, the present invention is to provide a laser beam processing apparatus that is used in the laser beam processing method. The present invention relates to a laser beam processing method for processing the work made of a polymer material using a laser beam, wherein the work is irradiated with a laser beam in a state that the optical axis of the laser beam is tilted in the advancing direction of processing by a prescribed angle with respect to the vertical direction of the work.

    摘要翻译： 提供了一种激光束处理方法，其中当使用激光束对由聚合物材料制成的工件执行加工方法时，可以抑制来自切割的异物的产生并且可以减少工件的表面的污染，并且 激光加工产品。 此外，本发明提供一种激光束处理方法中使用的激光束处理装置。 激光束处理方法技术领域本发明涉及一种用于使用激光束处理由聚合物材料制成的工件的激光束处理方法，其中在激光束的光轴沿前进方向倾斜的状态下用激光束照射工件 相对于工件的垂直方向进行规定的角度的处理。

    LASER BEAM PROCESSING METHOD AND LASER PROCESSED PRODUCT
    6.
    发明申请
    LASER BEAM PROCESSING METHOD AND LASER PROCESSED PRODUCT 有权
    激光束加工方法和激光加工产品

    公开(公告)号：US20100167076A1

    公开(公告)日：2010-07-01

    申请号：US12663185

    申请日：2008-06-05

    申请人： Kanji Nishida ,  Naoyuki Matsuo ,  Atsushi Hino

    发明人： Kanji Nishida ,  Naoyuki Matsuo ,  Atsushi Hino

    IPC分类号： B23K26/00 ,  B29C35/08

    CPC分类号： B23K26/02 ,  B23K26/38 ,  B23K26/402 ,  B23K2103/42 ,  B23K2103/50 ,  B29C2791/009 ,  B29C2793/00

    摘要： There is provided a laser beam processing method in which generation of foreign substances from cut can be suppressed and contamination of a surface of a work can be decreased when performing the processing method using a laser beam on the work made of a polymer material, and a laser processed product. Further, the present invention is to provide a laser beam processing apparatus that is used in the laser beam processing method. The present invention relates to a laser beam processing method for processing the work made of a polymer material using a laser beam, wherein the work is irradiated with a laser beam in a state that the optical axis of the laser beam is tilted in the advancing direction of processing by a prescribed angle with respect to the vertical direction of the work.

    摘要翻译： 提供了一种激光束处理方法，其中当使用激光束对由聚合物材料制成的工件执行加工方法时，可以抑制来自切割的异物的产生并且可以减少工件的表面的污染，并且 激光加工产品。 此外，本发明提供一种激光束处理方法中使用的激光束处理装置。 激光束处理方法技术领域本发明涉及一种用于使用激光束处理由聚合物材料制成的工件的激光束处理方法，其中在激光束的光轴沿前进方向倾斜的状态下用激光束照射工件 相对于工件的垂直方向进行规定的角度的处理。

    OPTICAL FILM CUTTING METHOD AND OPTICAL FILM
    9.
    发明申请
    OPTICAL FILM CUTTING METHOD AND OPTICAL FILM 审中-公开
    光学薄膜切割方法和光学薄膜

    公开(公告)号：US20100028606A1

    公开(公告)日：2010-02-04

    申请号：US12442219

    申请日：2007-09-11

    申请人： Kanji Nishida ,  Atsushi Hino ,  Takaichi Amano ,  Kazuo Kitada

    发明人： Kanji Nishida ,  Atsushi Hino ,  Takaichi Amano ,  Kazuo Kitada

    IPC分类号： B32B3/00 ,  B29D11/00

    CPC分类号： B23K26/0732 ,  B23K26/38 ,  B23K26/40 ,  B23K2103/172 ,  G02B5/3033 ,  Y10T428/24479

    摘要： This invention relates to an optical film cutting method, which includes: a laser beam generation step of performing a waveform shaping of a laser beam to generate a laser beam having a rectangular waveform, and a cutting step of irradiating an optical film with the laser beam obtained by the laser beam generation step and having a rectangular waveform to thereby cut the optical film; as well as to an optical film that is cut by the cutting method and having a size of a raised part generated on a cutting surface thereof of 30 μm or less. According to the optical film cutting method of this invention, it is possible to provide an optical film cutting method for cutting an optical film such as a polarizing film by not using a gaussian beam but using a laser beam of which a waveform is shaped into a rectangular waveform, which is capable of maintaining a raised part size as small as possible in a cutting surface of the optical film and preventing generation of bonding defect and optical defect when the optical film is incorporated into various optical panels.

    摘要翻译： 本发明涉及一种光学膜切割方法，该方法包括：激光束产生步骤，执行激光束的波形整形以产生具有矩形波形的激光束;以及切割步骤，用激光束照射光学膜 通过激光束产生步骤获得并具有矩形波形从而切割光学膜; 以及通过切割方法切割并且具有在其切割表面上产生的凸起部分的尺寸为30μm或更小的光学膜。 根据本发明的光学膜切割方法，可以提供一种用于通过不使用高斯光束来切割诸如偏振膜的光学膜的光学膜切割方法，但是使用其波形被形成为 矩形波形，其能够在光学膜的切割表面中保持尽可能小的凸起部分尺寸，并且当将光学膜结合到各种光学面板中时防止粘合缺陷和光学缺陷的产生。