公开(公告)号：US08659147B2

公开(公告)日：2014-02-25

申请号：US12988035

申请日：2009-06-04

申请人： Takao Mitsui ,  Hiroyuki Yoshihara ,  Toru Kimura ,  Masao Kikuchi ,  Yoichi Goto

发明人： Takao Mitsui ,  Hiroyuki Yoshihara ,  Toru Kimura ,  Masao Kikuchi ,  Yoichi Goto

IPC分类号： H01L23/34 ,  H01L21/50

CPC分类号： H01L23/3107 ,  H01L23/3672 ,  H01L23/4334 ,  H01L23/49568 ,  H01L23/49575 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A power semiconductor circuit device and a method for manufacturing the same, both of which are provided with: a base board on which at least a power semiconductor element is mounted; a resin which molds the base board and the power semiconductor element in a state where partial surfaces of the base board, including a base board surface opposite to a surface on which the power semiconductor element is mounted, are exposed; and a heat dissipating fin joined to the base board by a pressing force. A groove is formed in the base board at a portion to be joined to the heat dissipating fin, and the heat dissipating fin is joined by caulking to the groove.

摘要翻译： 一种功率半导体电路器件及其制造方法，它们均设置有：至少安装有功率半导体元件的基板; 在基板的与安装有功率半导体元件的表面相对的基板表面露出的基板的部分表面的状态下模制基板和功率半导体元件的树脂; 以及通过按压力与基板接合的散热翅片。 在基板上形成有与散热片接合的部分的槽，散热片通过铆接而与沟槽接合。

公开(公告)号：US20140035122A1

公开(公告)日：2014-02-06

申请号：US13993348

申请日：2012-07-31

申请人： Shigeyuki Nakazato ,  Yoichi Goto ,  Kiyofumi Kitai ,  Toru Kimura

发明人： Shigeyuki Nakazato ,  Yoichi Goto ,  Kiyofumi Kitai ,  Toru Kimura

IPC分类号： H01L23/34

CPC分类号： H01L23/34 ,  H01L21/4882 ,  H01L23/3121 ,  H01L23/367 ,  H01L2924/0002 ,  H01L2924/00

摘要： A power semiconductor device includes: a mold unit that includes a power semiconductor element, a base plate, and a mold unit, the power semiconductor element being mounted on one surface of the base plate, a convex portion being formed on an other surface of the base plate, the convex portion including a plurality of grooves, the mold unit having a mold resin with which the power semiconductor element is sealed in such a manner as to expose the convex portion; a plurality of radiation fins inserted into the grooves, respectively, and fixedly attached to the base plate by swaging; and a metal plate that includes a opening into which the convex portion is inserted, the metal plate being arranged between the mold unit and the radiation fins with the convex portion inserted into the opening, wherein the metal plate includes a protrusion that protrudes from an edge of the opening and that digs into a side surface of the convex portion when the convex portion is inserted into the opening.

摘要翻译： 功率半导体器件包括：模具单元，其包括功率半导体元件，基板和模具单元，所述功率半导体元件安装在所述基板的一个表面上，凸部形成在所述基板的另一表面上 底板，所述凸部包括多个凹槽，所述模具单元具有模制树脂，所述功率半导体元件以这样的方式被密封以暴露所述凸部; 分别插入槽中的多个辐射翅片，并通过型锻固定地固定到基板上; 以及金属板，其包括插入所述凸部的开口，所述金属板布置在所述模具单元和所述散热片之间，所述凸部插入到所述开口中，其中所述金属板包括突出部， 并且当所述凸部插入到所述开口中时，所述凹部挖入所述凸部的侧表面。

公开(公告)号：US08643171B1

公开(公告)日：2014-02-04

申请号：US13993348

申请日：2012-07-31

申请人： Shigeyuki Nakazato ,  Yoichi Goto ,  Kiyofumi Kitai ,  Toru Kimura

发明人： Shigeyuki Nakazato ,  Yoichi Goto ,  Kiyofumi Kitai ,  Toru Kimura

IPC分类号： H01L23/10 ,  H01L23/043

CPC分类号： H01L23/34 ,  H01L21/4882 ,  H01L23/3121 ,  H01L23/367 ,  H01L2924/0002 ,  H01L2924/00

摘要： A power semiconductor device includes: a mold unit that includes a power semiconductor element, a base plate, and a mold unit, the power semiconductor element being mounted on one surface of the base plate, a convex portion being formed on an other surface of the base plate, the convex portion including a plurality of grooves, the mold unit having a mold resin with which the power semiconductor element is sealed in such a manner as to expose the convex portion; a plurality of radiation fins inserted into the grooves, respectively, and fixedly attached to the base plate by swaging; and a metal plate that includes a opening into which the convex portion is inserted, the metal plate being arranged between the mold unit and the radiation fins with the convex portion inserted into the opening, wherein the metal plate includes a protrusion that protrudes from an edge of the opening and that digs into a side surface of the convex portion when the convex portion is inserted into the opening.

摘要翻译： 功率半导体器件包括：模具单元，其包括功率半导体元件，基板和模具单元，所述功率半导体元件安装在所述基板的一个表面上，凸部形成在所述基板的另一表面上 底板，所述凸部包括多个凹槽，所述模具单元具有模制树脂，所述功率半导体元件以这样的方式被密封以暴露所述凸部; 分别插入槽中的多个辐射翅片，并通过型锻固定地固定到基板上; 以及金属板，其包括插入所述凸部的开口，所述金属板布置在所述模具单元和所述散热片之间，所述凸部插入到所述开口中，其中所述金属板包括突出部， 并且当所述凸部插入到所述开口中时，所述凹部挖入所述凸部的侧表面。

公开(公告)号：US07581940B2

公开(公告)日：2009-09-01

申请号：US12068784

申请日：2008-02-12

申请人： Takashi Hosogane ,  Yoichi Goto

发明人： Takashi Hosogane ,  Yoichi Goto

IPC分类号： A23L1/10

CPC分类号： A21C11/00 ,  A21C3/028 ,  A23L7/196 ,  A23P20/20

摘要： Provided is a cooked rice mold apparatus that can easily adjust the supply amount of sushi rice. The roller spacing of a top rolling roller pair 31 arranged on the exit side of a hopper 2 of a rolling section 4 is variable.

摘要翻译： 提供了可以容易地调整寿司饭的供给量的熟米模具装置。 布置在轧制部4的料斗2的出口侧的顶部滚动辊对31的辊间距是可变的。

公开(公告)号：US08525285B2

公开(公告)日：2013-09-03

申请号：US13408368

申请日：2012-02-29

申请人： Shuji Yoneda ,  Masato Oishi ,  Tamotsu Shinohara ,  Shinji Watanabe ,  Koji Miyata ,  Seiji Fukae ,  Kenji Yamauchi ,  Yoichi Goto ,  Masakazu Baba

发明人： Shuji Yoneda ,  Masato Oishi ,  Tamotsu Shinohara ,  Shinji Watanabe ,  Koji Miyata ,  Seiji Fukae ,  Kenji Yamauchi ,  Yoichi Goto ,  Masakazu Baba

IPC分类号： H01L31/0203

CPC分类号： H01L31/0203 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor device having a substrate including a photodiode; a resin layer formed on an upper surface of the substrate, the resin layer not covering a light receiving region of the photodiode, the resin layer including at least one groove surrounding the light receiving region; and a molding resin portion formed by mold-sealing the photodiode with the resin layer thereon so as not to cover the light receiving region.

摘要翻译： 一种具有包括光电二极管的衬底的半导体器件; 树脂层，形成在所述基板的上表面上，所述树脂层不覆盖所述光电二极管的受光区域，所述树脂层包括围绕所述受光区域的至少一个沟槽; 以及通过将光电二极管与其上的树脂层模制密封而不覆盖光接收区域而形成的模制树脂部分。

公开(公告)号：US20090243015A1

公开(公告)日：2009-10-01

申请号：US12398520

申请日：2009-03-05

申请人： Shuji Yoneda ,  Masato Oishi ,  Tamotsu Shinohara ,  Shinji Watanabe ,  Koji Miyata ,  Seiji Fukae ,  Kenji Yamauchi ,  Yoichi Goto ,  Masakazu Baba

发明人： Shuji Yoneda ,  Masato Oishi ,  Tamotsu Shinohara ,  Shinji Watanabe ,  Koji Miyata ,  Seiji Fukae ,  Kenji Yamauchi ,  Yoichi Goto ,  Masakazu Baba

IPC分类号： H01L31/0203 ,  H01L31/18

CPC分类号： H01L31/0203 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method for manufacturing a semiconductor device, includes the steps of: forming a resin layer on an upper surface of a substrate including a photodiode such that the resin layer does not cover a light receiving region of the photodiode; forming at least one groove in the resin layer so as to surround the light receiving region; and subsequently mold-sealing the photodiode by loading the substrate into a mold and filling the mold with a molding resin.

摘要翻译： 一种制造半导体器件的方法，包括以下步骤：在包括光电二极管的基板的上表面上形成树脂层，使得树脂层不覆盖光电二极管的光接收区域; 在所述树脂层中形成至少一个沟槽以包围所述光接收区域; 然后通过将基板加载到模具中并用模制树脂填充模具来模制密封光电二极管。

公开(公告)号：US5987531A

公开(公告)日：1999-11-16

申请号：US931950

申请日：1997-09-17

申请人： Katsushi Ikeda ,  Yoichi Goto ,  Taro Ando ,  Shigemi Kuriyama

发明人： Katsushi Ikeda ,  Yoichi Goto ,  Taro Ando ,  Shigemi Kuriyama

IPC分类号： H05K1/14 ,  G06F13/10 ,  G06F13/14

CPC分类号： H05K1/142

摘要： A control board includes a plate 7 for the control board including a first printed board for mounting a control section 56 and a first connecter 9; and a removable terminal stand plate 1 including a second printed board for mounting a terminal stand 3, input circuit section 4 and output circuit section 5, and a second connector. The first and second connectors are connected to each other.

摘要翻译： 控制板包括用于控制板的板7，包括用于安装控制部分56和第一连接器9的第一印刷板; 以及包括用于安装终端支架3的第二印刷电路板，输入电路部分4和输出电路部分5以及第二连接器的可移除终端支架板1。 第一和第二连接器彼此连接。

公开(公告)号：US08153467B2

公开(公告)日：2012-04-10

申请号：US12398520

申请日：2009-03-05

申请人： Shuji Yoneda ,  Masato Oishi ,  Tamotsu Shinohara ,  Shinji Watanabe ,  Koji Miyata ,  Seiji Fukae ,  Kenji Yamauchi ,  Yoichi Goto ,  Masakazu Baba

发明人： Shuji Yoneda ,  Masato Oishi ,  Tamotsu Shinohara ,  Shinji Watanabe ,  Koji Miyata ,  Seiji Fukae ,  Kenji Yamauchi ,  Yoichi Goto ,  Masakazu Baba

IPC分类号： H01L21/00

CPC分类号： H01L31/0203 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method for manufacturing a semiconductor device, includes the steps of: forming a resin layer on an upper surface of a substrate including a photodiode such that the resin layer does not cover a light receiving region of the photodiode; forming at least one groove in the resin layer so as to surround the light receiving region; and subsequently mold-sealing the photodiode by loading the substrate into a mold and filling the mold with a molding resin.

摘要翻译： 一种制造半导体器件的方法，包括以下步骤：在包括光电二极管的基板的上表面上形成树脂层，使得树脂层不覆盖光电二极管的光接收区域; 在所述树脂层中形成至少一个凹槽以围绕所述光接收区域; 然后通过将基板加载到模具中并用模制树脂填充模具来模制密封光电二极管。

公开(公告)号：US20080202353A1

公开(公告)日：2008-08-28

申请号：US12068785

申请日：2008-02-12

申请人： Takashi Hosogane ,  Yoichi Goto

发明人： Takashi Hosogane ,  Yoichi Goto

IPC分类号： A23P1/10

CPC分类号： A21C11/00 ,  A23P20/20 ,  A23P30/10

摘要： Provided is a cooked rice mold apparatus that can mold rolled sushi having a stable shape and has good maintainability. Cam members 56, 57 provided on a rear surface of a rolling-up bamboo plate and lift plates 61, 62 that act on the cam members are connected by magnetically attaching means composed of a magnetic body and a magnet.

摘要翻译： 提供一种可以成型具有稳定形状且具有良好维护性的轧制寿司的熟米模设备。 设置在卷起的竹板的后表面上的凸轮部件56,57和作用在凸轮部件上的升降板61,62由磁性体和磁体构成的磁性连接机构连接。

公开(公告)号：US20140195573A1

公开(公告)日：2014-07-10

申请号：US13814270

申请日：2013-01-07

申请人： Hirotaka Nakagawa ,  Hideo Saito ,  Nobuhito Mori ,  Tomohiro Kawaguchi ,  Abhishek Johri ,  Naoko Ikegaya ,  Yoichi Goto ,  Kunihiko Nashimoto ,  Akira Yamamoto

发明人： Hirotaka Nakagawa ,  Hideo Saito ,  Nobuhito Mori ,  Tomohiro Kawaguchi ,  Abhishek Johri ,  Naoko Ikegaya ,  Yoichi Goto ,  Kunihiko Nashimoto ,  Akira Yamamoto

IPC分类号： G06F17/30

CPC分类号： G06F17/30194 ,  G06F3/0605 ,  G06F3/0659 ,  G06F3/0665 ,  G06F3/067

摘要： An example of the present invention is a storage system comprising a first real storage apparatus including a plurality of real resources. The first real storage apparatus includes: real resource groups allocated to a plurality of virtual storage apparatuses; first management information for associating virtual resource identifiers individually assigned to real resources in a namespace independently defined for each of the plurality of virtual storage apparatuses with real resource identifiers individually assigned to the real resources in a namespace defined for the first real storage apparatus; and a controller for receiving a command including a designation with a virtual resource identifier, converting the virtual resource identifier in the command into a real resource identifier with reference to the first management information, and processing the command with the converted real resource identifier.

摘要翻译： 本发明的一个实例是一种存储系统，其包括包括多个实际资源的第一真实存储装置。 第一实际存储装置包括：分配给多个虚拟存储装置的实际资源组; 第一管理信息，用于将在多个虚拟存储设备中为每个虚拟存储设备独立地定义的命名空间中分别分配的虚拟资源标识符分别分配给在为第一真实存储设备定义的命名空间中分配给实际资源的实际资源标识符; 以及控制器，用于接收包括具有虚拟资源标识符的指定的命令，参考所述第一管理信息将所述命令中的虚拟资源标识符转换为真实资源标识符，以及用所转换的真实资源标识符处理所述命令。