摘要:
An example of the present invention is a storage system comprising a first real storage apparatus including a plurality of real resources. The first real storage apparatus includes: real resource groups allocated to a plurality of virtual storage apparatuses; first management information for associating virtual resource identifiers individually assigned to real resources in a namespace independently defined for each of the plurality of virtual storage apparatuses with real resource identifiers individually assigned to the real resources in a namespace defined for the first real storage apparatus; and a controller for receiving a command including a designation with a virtual resource identifier, converting the virtual resource identifier in the command into a real resource identifier with reference to the first management information, and processing the command with the converted real resource identifier.
摘要:
A semiconductor device having a substrate including a photodiode; a resin layer formed on an upper surface of the substrate, the resin layer not covering a light receiving region of the photodiode, the resin layer including at least one groove surrounding the light receiving region; and a molding resin portion formed by mold-sealing the photodiode with the resin layer thereon so as not to cover the light receiving region.
摘要:
Provided is a cooked rice mold apparatus that can easily adjust the supply amount of sushi rice. The roller spacing of a top rolling roller pair 31 arranged on the exit side of a hopper 2 of a rolling section 4 is variable.
摘要:
A platen has an impact surface positioned to oppose a printhead so that a part of a printhead strikes paper loaded on the impact surface. The platen includes a first impact surface having a curved surface, a second impact surface having a curved surface, and an opening formed between the first and second impact surfaces. The platen is rotatable about an axis such that the first and second impact surfaces are selectively positioned to oppose the printhead. Paper advances into the platen and passes through the opening from an inside of the platen to outside of the platen so that the paper extends to cover the first impact surface, and another paper advances to the second impact surface. The impact surfaces may have different curvatures with respect to the axis. A projection may be formed on the impact surface and extends transversely of the paper advancement. The projection is substantially configured to the flection of the paper.
摘要:
A bacteria-free foamable oil-in-water emulsion including chocolate is prepared by forming an emulsion containing (1) 5-35 wt % of oil, (2) 3-30 wt % of chocolate component, (3) 10-30 wt % of sugar component, (4) 0.5-4 wt % of sodium caseinate, (5) 0.02-0.1 wt % of phosphoric acid salt, (6) 0.05-3 wt % of stabilizer, (7) 2-6 wt % of defatted milk solid, (8) 3-10 wt % of emulsifier based on the oil and (9) 40-60 wt % of all solid components in the emulsion and by sterilizing the said emulsion by heating at ultra high temperature. The bacteria-free foamable oil-in-water emulsion including chocolate has long time stability and high foamability, and it meets the current demand for baking or confectionary products having softness and wetness.
摘要:
A power semiconductor circuit device and a method for manufacturing the same, both of which are provided with: a base board on which at least a power semiconductor element is mounted; a resin which molds the base board and the power semiconductor element in a state where partial surfaces of the base board, including a base board surface opposite to a surface on which the power semiconductor element is mounted, are exposed; and a heat dissipating fin joined to the base board by a pressing force. A groove is formed in the base board at a portion to be joined to the heat dissipating fin, and the heat dissipating fin is joined by caulking to the groove.
摘要:
A power semiconductor device includes: a mold unit that includes a power semiconductor element, a base plate, and a mold unit, the power semiconductor element being mounted on one surface of the base plate, a convex portion being formed on an other surface of the base plate, the convex portion including a plurality of grooves, the mold unit having a mold resin with which the power semiconductor element is sealed in such a manner as to expose the convex portion; a plurality of radiation fins inserted into the grooves, respectively, and fixedly attached to the base plate by swaging; and a metal plate that includes a opening into which the convex portion is inserted, the metal plate being arranged between the mold unit and the radiation fins with the convex portion inserted into the opening, wherein the metal plate includes a protrusion that protrudes from an edge of the opening and that digs into a side surface of the convex portion when the convex portion is inserted into the opening.
摘要:
A method for manufacturing a semiconductor device, includes the steps of: forming a resin layer on an upper surface of a substrate including a photodiode such that the resin layer does not cover a light receiving region of the photodiode; forming at least one groove in the resin layer so as to surround the light receiving region; and subsequently mold-sealing the photodiode by loading the substrate into a mold and filling the mold with a molding resin.
摘要:
A control board includes a plate 7 for the control board including a first printed board for mounting a control section 56 and a first connecter 9; and a removable terminal stand plate 1 including a second printed board for mounting a terminal stand 3, input circuit section 4 and output circuit section 5, and a second connector. The first and second connectors are connected to each other.