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公开(公告)号：US20110300326A1
公开(公告)日：2011-12-08
申请号：US13143159
申请日：2010-02-24
申请人： Takashi Tatsuzawa , Takashi Seki , Kouji Kobayashi , Tohru Fujinawa , Motohiro Arifuku , Kotaro Seki
发明人： Takashi Tatsuzawa , Takashi Seki , Kouji Kobayashi , Tohru Fujinawa , Motohiro Arifuku , Kotaro Seki
CPC分类号： H01R4/04 , B65H18/28 , B65H2701/377 , C09J7/22 , C09J7/38 , H05K3/323 , H05K3/361 , H05K2203/0191
摘要： The bonding-material reel according to the present invention includes a tape for circuit connection having a tape-shaped base material and an adhesive layer formed on one surface of the base material, and a core around which the tape for circuit connection is wound, wherein the tape for circuit connection has an end tape which has been bonded to the terminal end, a region in which the adhesive layer is not formed over at least one reel length of the core toward the start end of the tape for circuit connection from the terminal end thereof, and a cover tape which is provided so as to cover the region.
摘要翻译： 根据本发明的接合材料卷轴包括具有带状基材的电路连接带和形成在基材的一个表面上的粘合层，以及缠绕有用于电路连接的带的芯，其中 用于电路连接的带具有已经结合到终端的端带，其中粘合剂层不形成在芯的至少一个卷轴长度上的区域朝向端子的电路连接用带的起始端 以及设置成覆盖该区域的盖带。
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公开(公告)号：US20120015126A1
公开(公告)日：2012-01-19
申请号：US13258960
申请日：2010-03-12
申请人： Takashi Tatsuzawa , Takashi Seki , Kouji Kobayashi , Tohru Fujinawa , Motohiro Arifuku , Kotaro Seki
发明人： Takashi Tatsuzawa , Takashi Seki , Kouji Kobayashi , Tohru Fujinawa , Motohiro Arifuku , Kotaro Seki
CPC分类号： B65H75/28 , B65H2701/377 , H01R4/04 , H01R12/52 , H05K3/323 , Y10T428/14 , Y10T428/266 , Y10T428/28
摘要： A bonding-material reel according to the present invention includes a tape for circuit connection having a tape-shaped base material and an adhesive layer formed on one surface of the base material, and a core around which the tape for circuit connection is wound, wherein the tape for circuit connection has a region in which an adhesive layer is not formed over at least one reel length of the core toward the start end of the tape for circuit connection from the terminal end thereof, and an end tape which is bonded to the terminal end of the tape for circuit connection so as to cover the region, and extends toward the core from the terminal end.
摘要翻译： 根据本发明的接合材料卷轴包括具有带状基材的电路连接带和形成在基材的一个表面上的粘合层，以及缠绕有用于电路连接的带的芯，其中 用于电路连接的磁带具有一个区域，其中在芯的至少一个卷轴长度上不形成粘合剂层，从该端子的端部到达用于电路连接的磁带的起始端，并且粘合层 用于电路连接的磁带的终端，以覆盖该区域，并且从终端朝向磁芯延伸。
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3.发明申请CIRCUIT CONNECTION MATERIAL, CIRCUIT MEMBER CONNECTING STRUCTURE AND METHOD OF CONNECTING CIRCUIT MEMBER 有权电路连接材料，电路部件连接结构及连接电路部件的方法公开(公告)号：US20100208444A1
公开(公告)日：2010-08-19
申请号：US12769925
申请日：2010-04-29
申请人： Motohiro Arifuku , Nichiomi Mochizuki , Takashi Nakazawa , Kouji Kobayashi , Tohru Fujinawa , Takashi Tatsuzawa
发明人： Motohiro Arifuku , Nichiomi Mochizuki , Takashi Nakazawa , Kouji Kobayashi , Tohru Fujinawa , Takashi Tatsuzawa
IPC分类号： H05K1/11 , H01B1/20 , C09J175/04
CPC分类号： H05K3/323 , C08G18/4213 , C08G18/672 , C08L75/06 , C08L2666/20 , C09J175/16 , H01R12/52 , H05K3/361 , Y10T29/49126 , C08G18/42
摘要： The circuit-connecting material for connection between circuit members each having a board and a circuit electrode formed on the primary surface of the board, comprising an adhesive composition that cures in response to light or heat and an organic compound containing a urethane group and an ester group.
摘要翻译： 用于连接电路构件的电路连接材料，每个电路构件具有形成在基板的主表面上的基板和电路电极，包括响应于光或热而固化的粘合剂组合物和含有氨基甲酸酯基团和酯的有机化合物 组。
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4.发明授权Circuit connection material, circuit member connecting structure and method of connecting circuit member 有权电路连接材料，电路构件的连接结构和连接电路构件的方法公开(公告)号：US08558118B2
公开(公告)日：2013-10-15
申请号：US12769953
申请日：2010-04-29
申请人： Motohiro Arifuku , Nichiomi Mochizuki , Takashi Nakazawa , Kouji Kobayashi , Tohru Fujinawa , Takashi Tatsuzawa
发明人： Motohiro Arifuku , Nichiomi Mochizuki , Takashi Nakazawa , Kouji Kobayashi , Tohru Fujinawa , Takashi Tatsuzawa
CPC分类号： H05K3/323 , C08G18/4213 , C08G18/672 , C08L75/06 , C08L2666/20 , C09J175/16 , H01R12/52 , H05K3/361 , Y10T29/49126 , C08G18/42
摘要： The circuit-connecting material for connection between circuit members each having a board and a circuit electrode formed on the primary surface of the board, comprising an adhesive composition that cures in response to light or heat and an organic compound containing a urethane group and an ester group.
摘要翻译： 用于连接电路构件的电路连接材料，每个电路构件具有形成在基板的主表面上的基板和电路电极，包括响应于光或热而固化的粘合剂组合物和含有氨基甲酸酯基团和酯的有机化合物 组。
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公开(公告)号：US20100108365A1
公开(公告)日：2010-05-06
申请号：US12374628
申请日：2006-07-21
申请人： Motohiro Arifuku , Nichiomi Mochizuki , Takashi Nakazawa , Kouji Kobayashi , Tohru Fujinawa , Takashi Tatsuzawa
发明人： Motohiro Arifuku , Nichiomi Mochizuki , Takashi Nakazawa , Kouji Kobayashi , Tohru Fujinawa , Takashi Tatsuzawa
IPC分类号： H05K1/09 , C08K5/29 , C09J133/12
CPC分类号： H05K3/323 , C08G18/4213 , C08G18/672 , C08L75/06 , C08L2666/20 , C09J175/16 , H01R12/52 , H05K3/361 , Y10T29/49126 , C08G18/42
摘要： The circuit-connecting material for connection between circuit members each having a board and a circuit electrode formed on the primary surface of the board, comprising an adhesive composition that cures in response to light or heat and an organic compound containing a urethane group and an ester group.
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公开(公告)号：US08541688B2
公开(公告)日：2013-09-24
申请号：US12769925
申请日：2010-04-29
申请人： Motohiro Arifuku , Nichiomi Mochizuki , Takashi Nakazawa , Kouji Kobayashi , Tohru Fujinawa , Takashi Tatsuzawa
发明人： Motohiro Arifuku , Nichiomi Mochizuki , Takashi Nakazawa , Kouji Kobayashi , Tohru Fujinawa , Takashi Tatsuzawa
CPC分类号： H05K3/323 , C08G18/4213 , C08G18/672 , C08L75/06 , C08L2666/20 , C09J175/16 , H01R12/52 , H05K3/361 , Y10T29/49126 , C08G18/42
摘要： The circuit-connecting material for connection between circuit members each having a board and a circuit electrode formed on the primary surface of the board, comprising an adhesive composition that cures in response to light or heat and an organic compound containing a urethane group and an ester group.
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公开(公告)号：US20100212943A1
公开(公告)日：2010-08-26
申请号：US12769953
申请日：2010-04-29
申请人： Motohiro Arifuku , Nichiomi Mochizuki , Takashi Nakazawa , Kouji Kobayashi , Tohru Fujinawa , Takashi Tatsuzawa
发明人： Motohiro Arifuku , Nichiomi Mochizuki , Takashi Nakazawa , Kouji Kobayashi , Tohru Fujinawa , Takashi Tatsuzawa
CPC分类号： H05K3/323 , C08G18/4213 , C08G18/672 , C08L75/06 , C08L2666/20 , C09J175/16 , H01R12/52 , H05K3/361 , Y10T29/49126 , C08G18/42
摘要： The circuit-connecting material for connection between circuit members each having a board and a circuit electrode formed on the primary surface of the board, comprising an adhesive composition that cures in response to light or heat and an organic compound containing a urethane group and an ester group.
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公开(公告)号：US08497431B2
公开(公告)日：2013-07-30
申请号：US12374628
申请日：2006-07-21
申请人： Motohiro Arifuku , Nichiomi Mochizuki , Takashi Nakazawa , Kouji Kobayashi , Tohru Fujinawa , Takashi Tatsuzawa
发明人： Motohiro Arifuku , Nichiomi Mochizuki , Takashi Nakazawa , Kouji Kobayashi , Tohru Fujinawa , Takashi Tatsuzawa
CPC分类号： H05K3/323 , C08G18/4213 , C08G18/672 , C08L75/06 , C08L2666/20 , C09J175/16 , H01R12/52 , H05K3/361 , Y10T29/49126 , C08G18/42
摘要： The circuit-connecting material for connection between circuit members each having a board and a circuit electrode formed on the primary surface of the board, comprising an adhesive composition that cures in response to light or heat and an organic compound containing a urethane group and an ester group.
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公开(公告)号：US07241644B2
公开(公告)日：2007-07-10
申请号：US11074718
申请日：2005-03-09
申请人： Motohiro Arifuku , Itsuo Watanabe , Kouji Motomura , Kouji Kobayashi , Yasushi Gotoh , Tohru Fujinawa
发明人： Motohiro Arifuku , Itsuo Watanabe , Kouji Motomura , Kouji Kobayashi , Yasushi Gotoh , Tohru Fujinawa
CPC分类号： H01L24/83 , C09J4/06 , H01L24/29 , H01L2224/16225 , H01L2224/2919 , H01L2224/83192 , H01L2224/838 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01052 , H01L2924/01073 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/09701 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H05K3/323 , H05K3/361 , H05K2201/0162 , H05K2201/0212 , Y10T428/2826 , Y10T428/2852 , H01L2924/00
摘要： This invention provides a wiring-terminal-connecting adhesive comprising a curing agent capable of generating a free radical upon heating, a radically polymerizable substance and silicone particles, and a wiring-terminal-connecting method and a wiring structure which make use of such an adhesive.
摘要翻译： 本发明提供了一种接线端子连接粘合剂，其包括在加热时能够产生自由基的固化剂，可自由基聚合的物质和硅氧烷颗粒，以及使用这种粘合剂的接线端子连接方法和布线结构 。
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公开(公告)号：US20050178502A1
公开(公告)日：2005-08-18
申请号：US11074718
申请日：2005-03-09
申请人： Motohiro Arifuku , Itsuo Watanabe , Kouji Motomura , Kouji Kobayashi , Yasushi Gotoh , Tohru Fujinawa
发明人： Motohiro Arifuku , Itsuo Watanabe , Kouji Motomura , Kouji Kobayashi , Yasushi Gotoh , Tohru Fujinawa
CPC分类号： H01L24/83 , C09J4/06 , H01L24/29 , H01L2224/16225 , H01L2224/2919 , H01L2224/83192 , H01L2224/838 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01052 , H01L2924/01073 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/09701 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H05K3/323 , H05K3/361 , H05K2201/0162 , H05K2201/0212 , Y10T428/2826 , Y10T428/2852 , H01L2924/00
摘要： This invention provides a wiring-terminal-connecting adhesive comprising a curing agent capable of generating a free radical upon heating, a radically polymerizable substance and silicone particles, and a wiring-terminal-connecting method and a wiring structure which make use of such an adhesive.
摘要翻译： 本发明提供了一种接线端子连接粘合剂，其包括在加热时能够产生自由基的固化剂，可自由基聚合的物质和硅氧烷颗粒，以及使用这种粘合剂的接线端子连接方法和布线结构 。
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