Abstract:
A multilayer printed circuit board, including: a signal interconnection which transmits and receives an electrical signal between electronic components; a ground interconnection connected to a ground of a circuit; a power interconnection connected to a power layer to supply power to electronic components; at least one ground layer installed in an inner layer; at least one clearance which passes through the ground layer; and a ground via which connects the ground interconnection with the ground layer. The signal interconnection and the ground interconnection or the signal interconnection and the power interconnection are installed in a pair, and a pair of interconnection vias for interlayer connection are inserted through the clearance installed in the ground layer so that one of the pair of interconnection vias is connected to the ground layer by the ground interconnection.
Abstract:
A calculation method of electromagnetic interference reduction through spectrum diffusion that is a means for reducing the electromagnetic interference, in which, when a center frequency of a measurement bandwidth is changed so that a spectrum having the maximum amplitude is included in the measurement bandwidth, of a plurality of spectra generated from the frequency spectrum of an electromagnetic interference signal through the spectrum diffusion, the amplitudes of all spectra included in the measurement bandwidth are added up and the maximum total sum of the amplitudes is divided by the amplitude of the electromagnetic interference signal, hence to estimate the electromagnetic interference reduction.
Abstract:
In a method of applying a cavity forming material onto vibrating electrode parts provided on front and back surfaces by supplying the cavity forming material from above an uprightly arranged piezoelectric substrate, a cavity is defined not only around the vibrating electrode parts but also along the upper edge portion of the piezoelectric substrate upon sealing with armoring resin, since the cavity forming material partially remains on the upper edge portion of the piezoelectric substrate. Thus, necessary damping is not performed and spurious vibration is increased. According to the present invention, a solder damping electrode is provided at least on one of front and back surface portions of the piezoelectric substrate close to the upper edge portion supplied with the cavity forming member and solder is provided on this electrode, whereby spurious vibration of the upper edge portion of the piezoelectric substrate is damped by additional mass of the solder.
Abstract:
In a plasma display panel having a discharge gas sealed in a gap between a front side substrate and a rear side substrate opposed to each other and having ribs partitioning a gas-sealed space into a discharge cell array arranged above an inner surface of one of the substrates, the rib includes an upper-layer rib and a lower-layer rib, and the upper-layer rib and the lower-layer rib are made of rib materials different from each other in resistance to etching, thereby allowing for formation of high ribs to enlarge the discharge space without affecting the upper-layer ribs when forming the lower-layer ribs.
Abstract:
An EMI (ElectroMagnetic Interference) shield filter for a display unit has a conductive mesh in which a plurality of first and second conductors are arranged in horizontal and vertical directions. A gap in one of the first and second conductors is set larger than that in the other one of the first and second conductors that attenuate a field strength of higher one of horizontal and vertical polarized components of EMI of the display unit, so that the horizontal and vertical polarized components have substantially the same field strength after attenuation. A display apparatus having this EMI shield filter is also disclosed.
Abstract:
It is an object of the present invention to establish a method of establishing a cell with a remarkably high hERG channel expression level for use in predicting adverse effects based on hERG channel inhibition in research and development of drugs, and to thereby establish a highly sensitive and high throughput evaluation method.By inserting a hERG gene into a retrovirus vector plasmid or lentivirus vector plasmid to thereby prepare a virus vector, concentrating the vector by ultracentrifugation if necessary, transferring the hERG gene into cells and expressing hERG channels therein, it has become possible to secure an expression level effective in measurements using a fully automated high throughput patch clamp system or dyes.
Abstract:
A method of forming barrier ribs includes the following steps. The first step is to form a barrier rib material layer on a substrate. The second step is to form a resist film on the barrier rib material layer. The third step is to form the barrier rib material layer into a barrier rib pattern material layer. The fourth step is to remove the resist film from the barrier rib pattern material layer. The fifth step is to fire the barrier rib pattern material layer to form barrier ribs. In the above steps, a bonding layer is formed between the substrate and the barrier rib material layer. The bonding layer has such a bonding strength that sufficiently maintains the barrier rib pattern material layer on the substrate upon removing the resist film from the barrier rib pattern material, and is made from a thermally burning-out material that is burned out upon firing the barrier rib pattern material layer.
Abstract:
A non-human animal in which a gene coding for the N-type calcium channel is disrupted to lack functional N-type calcium channel, and a method for screening for a substance having a pharmacological action on blood pressure control, transmission of pain, blood sugar level control and so forth by using the animal.
Abstract:
A multilayer printed circuit board, including: a signal interconnection which transmits and receives an electrical signal between electronic components; a ground interconnection connected to a ground of a circuit; a power interconnection connected to a power layer to supply power to electronic components; at least one ground layer installed in an inner layer; at least one clearance which passes through the ground layer; and a ground via which connects the ground interconnection with the ground layer. The signal interconnection and the ground interconnection or the signal interconnection and the power interconnection are installed in a pair, and a pair of interconnection vias for interlayer connection are inserted through the clearance installed in the ground layer so that one of the pair of interconnection vias is connected to the ground layer by the ground interconnection.
Abstract:
In the portable electronic device of the present invention, charging electrodes exposed to the exterior of a casing are electrically connected to a pair of charging terminals mounted upright on the printed circuit board, and a charging terminal (negative electrode, or ground) that is one of the pair of charging terminals is connected to the ground of the printed circuit board. A high-frequency current suppression part is mounted in a series connection on the charging terminal (negative electrode, or ground). The high-frequency current suppression part is a ferrite core, ferrite beads, or another low resistance part. In such a configuration, a secondary electric discharge occurs via the externally exposed charging electrodes and the like when electrostatic discharge noise is applied from the exterior of the portable electronic device and when the ground current of the printed circuit board oscillates due to the discharge electric current that flows at this time, whereby circuit malfunctions are prevented.