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    METAL-FILM-COATED MATERIAL AND PROCESS FOR PRODUCING THE SAME, METALLIC-PATTERN-BEARING MATERIAL AND PROCESS FOR PRODUCING THE SAME, COMPOSITION FOR POLYMER LAYER FORMATION, NITRILE GROUP-CONTAINING POLYMER AND METHOD OF SYNTHESIZING THE SAME, COMPOSITION CONTAINING NITRILE GROUP-CONTAINING POLYMER, AND LAMINATE
    3.
    发明申请
    METAL-FILM-COATED MATERIAL AND PROCESS FOR PRODUCING THE SAME, METALLIC-PATTERN-BEARING MATERIAL AND PROCESS FOR PRODUCING THE SAME, COMPOSITION FOR POLYMER LAYER FORMATION, NITRILE GROUP-CONTAINING POLYMER AND METHOD OF SYNTHESIZING THE SAME, COMPOSITION CONTAINING NITRILE GROUP-CONTAINING POLYMER, AND LAMINATE 有权
    金属薄膜包覆材料及其制造方法，金属图案承载材料及其制造方法，聚合物层形成用组合物，含氮聚合物聚合物及其合成方法，包含含氮基团的组合物 聚合物和层压材料

    公开(公告)号：US20090214876A1

    公开(公告)日：2009-08-27

    申请号：US12433034

    申请日：2009-04-30

    申请人： Takeyoshi Kano ,  Hideo Nagasaki ,  Masataka Sato

    发明人： Takeyoshi Kano ,  Hideo Nagasaki ,  Masataka Sato

    IPC分类号： B32B27/08 ,  C08F22/30 ,  C08K5/07 ,  C08K5/16

    CPC分类号： B32B27/08 ,  C08F22/32 ,  C08F220/28 ,  C08F220/36 ,  C08F220/50 ,  C09D133/18 ,  C23C18/1603 ,  C23C18/1653 ,  C23C18/2086 ,  C23C18/30 ,  C23C18/31 ,  C23C18/405 ,  H05K3/387 ,  H05K2203/121 ,  Y10T428/31551 ,  Y10T428/31681 ,  Y10T428/31786 ,  Y10T428/31855

    摘要： A process for producing a metal film-coated material, the process including: (a1) forming, on a substrate, a polymer layer formed from a polymer which has a functional group capable of interacting with a plating catalyst or a precursor thereof, and is directly chemically bonded to the substrate; (a2) providing a plating catalyst or a precursor thereof to the polymer layer; and (a3) performing plating with respect to the plating catalyst or a precursor thereof. The polymer layer satisfies all of the following requirements (1) to (4): (1) the saturated water absorption coefficient of the polymer layer as measured in an environment of temperature of 25° C. and relative humidity of 50% is 0.01 to 10% by mass; (2) the saturated water absorption coefficient of the polymer layer as measured in an environment of temperature of 25° C. and relative humidity of 95% is 0.05 to 20% by mass; (3) the water absorption coefficient of the polymer layer as measured after 1 hour of immersion in boiling water at 100° C. is 0.1 to 30% by mass; and (4) the surface contact angle of the polymer layer as measured after dropping 5 μL of distilled water thereonto and leaving to stand for 15 seconds in an environment of temperature of 25° C. and relative humidity of 50% is 50 to 150 degrees.

    摘要翻译： 一种金属薄膜包覆材料的制造方法，其特征在于，包括：（a1）在基材上形成由具有能够与电镀催化剂或其前体相互作用的官能团的聚合物形成的聚合物层， 直接化学键合到基底上; （a2）向聚合物层提供电镀催化剂或其前体; 和（a3）相对于电镀催化剂或其前体进行电镀。 聚合物层满足以下所有要求（1）〜（4）：（1）在温度25℃，相对湿度50％的环境中测定的聚合物层的饱和吸水率为0.01〜 10质量％ （2）在温度25℃，相对湿度95％的环境中测定的聚合物层的饱和吸水系数为0.05〜20质量％ （3）在100℃的沸水中浸渍1小时后测定的聚合物层的吸水系数为0.1〜30质量％ 和（4）将聚合物层的表面接触角在其上滴加5μl蒸馏水并在25℃的温度和50％的相对湿度的环境中放置15秒钟后测量的表面接触角为50至150度 。

    METHODS FOR PREPARING METAL FILM-CARRYING SUBSTRATES, METAL FILM-CARRYING SUBSTRATES, METHODS FOR PREPARING METAL PATTERN MATERIALS, AND METAL PATTERN MATERIALS
    4.
    发明申请
    METHODS FOR PREPARING METAL FILM-CARRYING SUBSTRATES, METAL FILM-CARRYING SUBSTRATES, METHODS FOR PREPARING METAL PATTERN MATERIALS, AND METAL PATTERN MATERIALS 审中-公开
    用于制备金属膜承载基板，金属膜承载基板的方法，用于制备金属图案材料的方法和金属图案材料

    公开(公告)号：US20100323174A1

    公开(公告)日：2010-12-23

    申请号：US12446545

    申请日：2007-10-16

    申请人： Hideo Nagasaki ,  Takeyoshi Kano

    发明人： Hideo Nagasaki ,  Takeyoshi Kano

    IPC分类号： B32B15/00 ,  B05D3/10 ,  B05D1/38

    CPC分类号： H05K3/387 ,  B05D5/067 ,  C23C18/165 ,  C23C18/1653 ,  C23C18/2086 ,  C23C18/28 ,  C23C18/30 ,  C23C18/31 ,  C23C18/405 ,  C25D5/38 ,  C25D5/56 ,  H05K3/181 ,  H05K2203/121 ,  Y10T428/24917 ,  Y10T428/31678

    摘要： There are provided a metal film-carrying substrate including a substrate and a metal film with good adhesion to the substrate and being less dependent on temperature or humidity, and a method for preparation thereof. There are also provided a metal pattern material having a patterned metal portion with good adhesion to a substrate, being less dependent on temperature or humidity, and providing highly reliable insulation for a region where the patterned metal portion is not formed, and a method for preparation thereof. The method for preparing the metal film-carrying substrate includes: (a1) forming a polymer layer on a substrate, the polymer layer including a polymer that has a non-dissociating multidentate functional group capable of interacting with a plating catalyst or a precursor thereof and is directly and chemically bonded to the substrate; (a2) applying a multidentate plating catalyst or a precursor thereof to the polymer layer; and (a4) performing plating on the multidentate plating catalyst or precursor thereof; and (a3) optionally adding a metal to the polymer layer after the step (a2), the metal being different from the multidentate plating catalyst or precursor thereof.

    摘要翻译： 提供了一种带有金属膜的衬底，其包括基底和对基底具有良好粘合性并且对温度或湿度的依赖性低的金属膜及其制备方法。 还提供了一种具有图案化金属部分的金属图案材料，其具有对基底的良好粘附性，对温度或湿度的依赖性较小，并且对未形成图案化金属部分的区域提供高度可靠的绝缘，以及制备方法 其中。 制备载有金属膜的衬底的方法包括：（a1）在衬底上形成聚合物层，所述聚合物层包括具有能够与镀催化剂或其前体相互作用的非解离多齿官能团的聚合物，以及 直接和化学键合到基底上; （a2）将多齿电镀催化剂或其前体施加到聚合物层上; 和（a4）在多齿镀覆催化剂或其前体上进行电镀; 和（a3）任选地在步骤（a2）之后向所述聚合物层中加入金属，所述金属与所述多齿电镀催化剂或其前体不同。

    Method of producing metal plated material
    6.
    发明授权
    Method of producing metal plated material 有权
    金属电镀材料的制造方法

    公开(公告)号：US08173220B2

    公开(公告)日：2012-05-08

    申请号：US13081516

    申请日：2011-04-07

    申请人： Takeyoshi Kano ,  Kazuki Yamazaki ,  Masataka Sato

    发明人： Takeyoshi Kano ,  Kazuki Yamazaki ,  Masataka Sato

    IPC分类号： B05D3/02 ,  B05D3/04 ,  B05D1/36 ,  B05D1/18 ,  C23C28/00 ,  C23C28/02

    CPC分类号： C23C28/00 ,  C23C18/1653 ,  C23C18/1689 ,  C23C18/2086 ,  H05K3/387 ,  Y10T428/24917 ,  Y10T428/31692

    摘要： The invention provides a method of producing a metal plated material, the method including: preparing a polymer solution containing a polymer; preparing a composition by mixing the polymer solution with a monomer at an amount of from 30% by mass to 200% by mass with respect to the polymer, and with a compound having a non-dissociative functional group and a reactive group, the non-dissociative functional group being capable of interacting with a plating catalyst or a precursor thereof, and at least one of the polymer or the monomer having a functional group that reacts with the reactive group in the compound; forming a cured layer on a substrate by applying the composition, drying the composition and curing the composition; applying the plating catalyst or the precursor thereof to the cured layer; and conducting plating with respect to the plating catalyst or the precursor thereof to form a plating film on the cured layer.

    摘要翻译： 本发明提供一种金属镀覆材料的制造方法，该方法包括：制备含有聚合物的聚合物溶液; 通过将聚合物溶液与相对于聚合物的30质量％至200质量％的量的单体混合来制备组合物，并且使用具有非解离官能团和反应性基团的化合物， 解离官能团能够与电镀催化剂或其前体相互作用，并且所述聚合物或具有与化合物中的反应性基团反应的官能团的单体中的至少一种; 通过施加组合物在基材上形成固化层，干燥组合物并固化组合物; 将镀催化剂或其前体施加到固化层; 对镀催化剂或其前体进行电镀，在固化层上形成镀膜。

    Method of producing metal plated material, metal plated material, method of producing metal pattern material, and metal pattern material
    8.
    发明授权
    Method of producing metal plated material, metal plated material, method of producing metal pattern material, and metal pattern material 有权
    金属电镀材料的制造方法，金属镀覆材料，金属图案材料的制造方法以及金属图案材料

    公开(公告)号：US07943199B2

    公开(公告)日：2011-05-17

    申请号：US12426293

    申请日：2009-04-20

    申请人： Takeyoshi Kano ,  Kazuki Yamazaki ,  Masataka Sato

    发明人： Takeyoshi Kano ,  Kazuki Yamazaki ,  Masataka Sato

    IPC分类号： B05D3/02 ,  B05D1/36 ,  B05D1/18 ,  C23C28/00 ,  C23C20/02

    CPC分类号： C23C28/00 ,  C23C18/1653 ,  C23C18/1689 ,  C23C18/2086 ,  H05K3/387 ,  Y10T428/24917 ,  Y10T428/31692

    摘要： A method of producing a metal plated material, the method including: preparing a polymer solution containing a polymer; preparing a composition by mixing the polymer solution with a monomer at an amount of from 30% by mass to 200% by mass with respect to the polymer, at least one of the polymer or the monomer having a non-dissociative functional group that interacts with a plating catalyst or a precursor thereof, forming a cured layer on a substrate by applying the composition, drying the composition and curing the composition; applying the plating catalyst or the precursor thereof to the cured layer; and conducting plating with respect to the plating catalyst or the precursor thereof to form a plating film on the cured layer.

    摘要翻译： 一种金属镀覆材料的制造方法，其包括：制备含有聚合物的聚合物溶液; 通过将聚合物溶液与相对于聚合物的30质量％至200质量％的量的单体混合来制备组合物，至少一种具有非离解官能团的聚合物或单体与 电镀催化剂或其前体，通过施加组合物在基材上形成固化层，干燥组合物并固化组合物; 将镀催化剂或其前体施加到固化层; 对镀催化剂或其前体进行电镀，在固化层上形成镀膜。

    Method of making multi-layer circuit board
    9.
    发明授权
    Method of making multi-layer circuit board 失效
    制作多层电路板的方法

    公开(公告)号：US07849593B2

    公开(公告)日：2010-12-14

    申请号：US11628478

    申请日：2005-05-31

    申请人： Koichi Kawamura ,  Takeyoshi Kano

    发明人： Koichi Kawamura ,  Takeyoshi Kano

    IPC分类号： H05K3/02

    CPC分类号： H05K3/386 ,  H05K3/381 ,  H05K3/4644 ,  H05K3/4652 ,  H05K2203/1163 ,  H05K2203/1168 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49165

    摘要： The invention provides a multi-layer circuit board sequentially having an insulating substrate, a first electrically conductive pattern arbitrarily formed, an insulating material layer and a second electrically conductive pattern formed by providing an electrically conductive material on a graft polymer pattern formed on the insulating material layer, and having an electrically conductive path which electrically connects the first electrically conductive pattern present on the insulating substrate and the second electrically conductive pattern. The graft polymer pattern includes a combination of a region where a graft polymer is present and a region where no graft polymer is present, or a combination of a region where a hydrophilic graft polymer is present and a region where a hydrophobic graft polymer is present.

    摘要翻译： 本发明提供一种多层电路板，其顺序地具有绝缘基板，任意形成的第一导电图案，绝缘材料层和通过在形成于绝缘材料上的接枝聚合物图案上提供导电材料而形成的第二导电图案 并且具有将存在于绝缘基板上的第一导电图案与第二导电图案电连接的导电路径。 接枝聚合物图案包括存在接枝聚合物的区域和不存在接枝聚合物的区域的组合，或存在亲水接枝聚合物的区域和存在疏水接枝聚合物的区域的组合。

    Multi-Layer Circuit Board And Production Method Thereof
    10.
    发明申请
    Multi-Layer Circuit Board And Production Method Thereof 失效
    多层电路板及其制作方法

    公开(公告)号：US20080029294A1

    公开(公告)日：2008-02-07

    申请号：US11628478

    申请日：2005-05-31

    申请人： Koichi Kawamura ,  Takeyoshi Kano

    发明人： Koichi Kawamura ,  Takeyoshi Kano

    IPC分类号： H05K1/11 ,  H05K3/10

    CPC分类号： H05K3/386 ,  H05K3/381 ,  H05K3/4644 ,  H05K3/4652 ,  H05K2203/1163 ,  H05K2203/1168 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49165

    摘要： The invention provides a multi-layer circuit board sequentially having an insulating substrate, a first electrically conductive pattern arbitrarily formed, an insulating material layer and a second electrically conductive pattern formed by providing an electrically conductive material on a graft polymer pattern formed on the insulating material layer, and having an electrically conductive path which electrically connects the first electrically conductive pattern present on the insulating substrate and the second electrically conductive pattern. The graft polymer pattern includes a combination of a region where a graft polymer is present and a region where no graft polymer is present, or a combination of a region where a hydrophilic graft polymer is present and a region where a hydrophobic graft polymer is present.

    摘要翻译： 本发明提供一种多层电路板，其顺序地具有绝缘基板，任意形成的第一导电图案，绝缘材料层和通过在形成于绝缘材料上的接枝聚合物图案上提供导电材料而形成的第二导电图案 并且具有将存在于绝缘基板上的第一导电图案与第二导电图案电连接的导电路径。 接枝聚合物图案包括存在接枝聚合物的区域和不存在接枝聚合物的区域的组合，或存在亲水接枝聚合物的区域和存在疏水接枝聚合物的区域的组合。