公开(公告)号：US06382499B1

公开(公告)日：2002-05-07

申请号：US09140361

申请日：1998-08-26

申请人： Takuya Satoh ,  Tatsushi Yoshida ,  Tatsumi Tsuchiya ,  Naoki Kurosu

发明人： Takuya Satoh ,  Tatsushi Yoshida ,  Tatsumi Tsuchiya ,  Naoki Kurosu

IPC分类号： B21D3900

CPC分类号： G11B5/484 ,  Y10T29/49025 ,  Y10T29/4903

摘要： An integrated suspension for a slider in a magnetic record system has a simplified structure relatively easy to manufacture. This new integrated suspension is assembled from separate pieces including a load beam a flexure and a mount plate. The flexure includes a flexible member and a conductive lead integrally formed thereon. Since the flexible member is of super-thin type, the flexion of the flexure is minimized by the support using a platform support in an ultrasonic bonding of its conductive lead with a bonding pad of the slider. Besides, to minimize the deflection, an ultrasonic bonding is executed in close order of distance to support portion. Furthermore, a tab extending from the tip of the load beam is used so as not to affect the flexure regarded as a fine piece.

摘要翻译： 用于磁记录系统中的滑块的集成悬架具有相对容易制造的简化结构。 这种新的集成悬架由单独的部件组装，包括负载梁弯曲件和安装板。 挠性件包括柔性构件和一体地形成在其上的导电引线。 由于柔性构件是超薄型的，所以通过在其导电引线与滑块的接合焊盘的超声波接合中使用平台支撑件的支撑件使弯曲的屈曲最小化。 此外，为了最小化偏转，以与支撑部分的距离的紧密顺序执行超声波接合。 此外，使用从负载梁的尖端延伸的突片，以便不影响被认为是微细的挠曲。

公开(公告)号：US07486480B2

公开(公告)日：2009-02-03

申请号：US11355470

申请日：2006-02-15

申请人： Takuya Satoh ,  Tatsushi Yoshida ,  Tatsumi Tsuchiya ,  Yoshio Uematsu

发明人： Takuya Satoh ,  Tatsushi Yoshida ,  Tatsumi Tsuchiya ,  Yoshio Uematsu

IPC分类号： G11B5/40 ,  B23K35/14

CPC分类号： H05K3/3442 ,  G11B5/4853 ,  H01L2224/742 ,  H01L2924/01327 ,  H05K3/3494 ,  H05K2201/10727 ,  H05K2203/0195 ,  H05K2203/041 ,  H05K2203/043 ,  H05K2203/107 ,  Y02P70/613 ,  Y10T29/4903 ,  Y10T29/49211 ,  H01L2924/00

摘要： Embodiments of the invention relate to making reconnection when a soldered connection fails in a head/slider used in a magnetic disk drive. In one embodiment, a solder mass deposited on a slider pad of a head/slider is separated from a lead pad and a solder ball connection is yet to be made between the slider pad and the lead pad. A shaping tip is heated to a temperature near a melting point of a solder. The shaping tip is moved in parallel with a surface of the slider pad toward the side of the lead pad to soften the solder mass. The solder mass is thereafter irradiated with a laser beam so as to form a solder fillet, thereby making a soldered connection between the lead pad and the slider pad.

摘要翻译： 本发明的实施例涉及当在磁盘驱动器中使用的头/滑块中的焊接连接失败时重新连接。 在一个实施例中，沉积在头/滑块的滑块上的焊料块与引线焊盘分离，并且在滑块焊盘和引线焊盘之间尚未形成焊球连接。 将成型尖端加热至接近焊料熔点的温度。 成形尖端与滑块的表面平行地移动到铅焊盘的侧面以软化焊料质量。 然后用激光束照射焊料，以形成焊锡圆角，从而在引线焊盘和滑块之间形成焊接连接​​。

公开(公告)号：US06742694B2

公开(公告)日：2004-06-01

申请号：US10074718

申请日：2002-02-13

申请人： Takuya Satoh ,  Tatsumi Tsuchiya ,  Yasuhiro Mita ,  Lan Shi ,  Hiroyoshi Yokome ,  Tatsushi Yoshida ,  Surya Pattanaik

发明人： Takuya Satoh ,  Tatsumi Tsuchiya ,  Yasuhiro Mita ,  Lan Shi ,  Hiroyoshi Yokome ,  Tatsushi Yoshida ,  Surya Pattanaik

IPC分类号： B23K100

CPC分类号： G11B5/486 ,  B23K1/0056 ,  B23K3/0623 ,  B23K3/08 ,  B23K2101/40 ,  B23K2101/42 ,  H05K3/3442 ,  H05K3/3478

摘要： An apparatus joins bonding pads of a slider and lead pads of lead wires in a head gimbals assembly to improve efficiency, downsizing, and maintenance of solder-ball disposing devices, and solder-ball reflow devices for reflowing solder balls. The solder-ball disposing apparatus discharges solder balls from solder-ball discharging holes of a solder-ball feeder unit which are evacuated by a suction pad. An environmental space and an inert-gas supply portion for forming inactive atmosphere are formed on a table to eliminate an inert-gas supply unit from an optical unit, so that converged laser beams are directly radiated onto the solder balls.

摘要翻译： 一种装置将滑块的接合焊盘和引线的引线垫连接在头部万向节组件中，以提高焊球配置装置的效率，小型化和维护，以及用于回流焊球的焊球回流装置。 焊球配置装置从通过吸盘抽真空的焊球供给装置的焊球排出孔排出焊球。 用于形成无活性气氛的环境空间和惰性气体供应部分形成在桌子上以从光学单元消除惰性气体供应单元，使得会聚的激光束直接辐射到焊球上。

公开(公告)号：US20060193084A1

公开(公告)日：2006-08-31

申请号：US11355470

申请日：2006-02-15

申请人： Takuya Satoh ,  Tatsushi Yoshida ,  Tatsumi Tsuchiya ,  Yoshio Uematsu

发明人： Takuya Satoh ,  Tatsushi Yoshida ,  Tatsumi Tsuchiya ,  Yoshio Uematsu

IPC分类号： G11B5/60

CPC分类号： H05K3/3442 ,  G11B5/4853 ,  H01L2224/742 ,  H01L2924/01327 ,  H05K3/3494 ,  H05K2201/10727 ,  H05K2203/0195 ,  H05K2203/041 ,  H05K2203/043 ,  H05K2203/107 ,  Y02P70/613 ,  Y10T29/4903 ,  Y10T29/49211 ,  H01L2924/00

摘要： Embodiments of the invention relate to making reconnection when a soldered connection fails in a head/slider used in a magnetic disk drive. In one embodiment, a solder mass deposited on a slider pad of a head/slider is separated from a lead pad and a solder ball connection is yet to be made between the slider pad and the lead pad. A shaping tip is heated to a temperature near a melting point of a solder. The shaping tip is moved in parallel with a surface of the slider pad toward the side of the lead pad to soften the solder mass. The solder mass is thereafter irradiated with a laser beam so as to form a solder fillet, thereby making a soldered connection between the lead pad and the slider pad.

摘要翻译： 本发明的实施例涉及当在磁盘驱动器中使用的头/滑块中的焊接连接失败时重新连接。 在一个实施例中，沉积在头/滑块的滑块上的焊料块与引线焊盘分离，并且在滑块焊盘和引线焊盘之间尚未形成焊球连接。 将成型尖端加热至接近焊料熔点的温度。 成形尖端与滑块的表面平行地移动到铅焊盘的侧面以软化焊料质量。 然后用激光束照射焊料，以形成焊锡圆角，从而在引线焊盘和滑块之间形成焊接连接​​。

公开(公告)号：US06321974B1

公开(公告)日：2001-11-27

申请号：US09553596

申请日：2000-04-20

申请人： Tatsumi Tsuchiya ,  Tatsushi Yoshida ,  Takuya Satoh ,  Akiko Hayashi

发明人： Tatsumi Tsuchiya ,  Tatsushi Yoshida ,  Takuya Satoh ,  Akiko Hayashi

IPC分类号： B23K106

CPC分类号： B23K20/10

摘要： A plurality of bonding pads formed on a slider are integrally joined to an elastic flexure for a disk drive suspension. The pads are ultrasonically bonded to the slider with leads that are held by the flexure. The bonding portions of the leads face and are pressed against the pads with ultrasonic waves. The leads are plastically deformed during these steps to prevent the flexure from being deformed after the ultrasonic bonding process.

摘要翻译： 形成在滑块上的多个接合焊盘与用于磁盘驱动器悬架的弹性挠曲件一体地接合。 焊盘通过由挠曲件保持的引线超声波地结合到滑块。 引线的接合部分面对并用超声波压在焊盘上。 引线在这些步骤期间发生塑性变形，以防止在超声波接合工艺之后挠曲变形。

公开(公告)号：US06848167B2

公开(公告)日：2005-02-01

申请号：US09879514

申请日：2001-06-12

申请人： Yasuhiro Mita ,  Kohichiroh Naka ,  Takuya Satoh ,  Tatsumi Tsuchiya ,  Tatsushi Yoshida

发明人： Yasuhiro Mita ,  Kohichiroh Naka ,  Takuya Satoh ,  Tatsumi Tsuchiya ,  Tatsushi Yoshida

IPC分类号： G11B21/21 ,  B23K37/04 ,  G11B5/48 ,  G11B5/42

CPC分类号： G11B5/4853 ,  B23K37/0443 ,  B23K2101/38 ,  Y10T29/49023 ,  Y10T29/49027 ,  Y10T29/49815 ,  Y10T29/5397

摘要： A head gimbal assembly, which is a component of a hard disk drive, has a bending portion that has elasticity and is bent at a predetermined angle under an unloaded condition, and a slider is bonded to a holding portion thereof by mounting the head gimbal assembly on a bonding jig in a state in which the bending portion is stretched. When the head gimbal assembly is separated from the bonding jig after bonding, the bending portion is not restored freely, so that the head gimbal assembly is caught by the bonding jig during the separating process and a locked state is sometimes established.

摘要翻译： 作为硬盘驱动器的组件的头万向架组件具有弯曲部分，该弯曲部分具有弹性并且在无负载条件下以预定角度弯曲，并且滑块通过安装头部万向架组件而结合到其保持部分 在弯曲部被拉伸的状态下的接合夹具上。 当磁头万向架组件在接合之后与接合夹具分离时，弯曲部分不能自由地恢复，使得头部万向节组件在分离过程中被接合夹具卡住，并且有时建立锁定状态。

公开(公告)号：US06543677B2

公开(公告)日：2003-04-08

申请号：US09872252

申请日：2001-05-31

申请人： Surya Pattanaik ,  Takuya Satoh ,  Tatsumi Tsuchiya ,  Tatsushi Yoshida

发明人： Surya Pattanaik ,  Takuya Satoh ,  Tatsumi Tsuchiya ,  Tatsushi Yoshida

IPC分类号： B23K3512

CPC分类号： H05K3/3478 ,  B23K3/0623 ,  G11B5/4853 ,  H05K3/3442 ,  H05K3/3494 ,  H05K2201/10727 ,  H05K2203/0195 ,  H05K2203/041 ,  H05K2203/082 ,  H05K2203/086 ,  H05K2203/107

摘要： In devices for solder-ball bonding of a bonding pad of a slider of a head gimbal assembly to a lead pad of a lead, although a device that can perform (1) the supply of solder balls, (2) the positioning of a solder ball, (3) the blowing of nitrogen gas N2, and (4) the melting of the solder ball by laser radiation in one device is available, there are various problems that cannot improve the efficiency of laser radiation, maintenance, or operation efficiency, due to spatial restriction, difficulty of weight reduction, or fixed operation procedures. A solder-ball holder and an optical device are configured separately, and a vacuum pad is provided. A solder ball held in a solder-ball holding hole of the solder-ball holder is transported by the vacuum pad to a connecting portion of a head gimbal assembly, and solder reflow is carried out by the optical device.

公开(公告)号：US06355122B1

公开(公告)日：2002-03-12

申请号：US09603121

申请日：2000-06-22

申请人： Kenji Itoh ,  Naoki Kurosu ,  Yohtaroh Ichimura ,  Tatsushi Yoshida

发明人： Kenji Itoh ,  Naoki Kurosu ,  Yohtaroh Ichimura ,  Tatsushi Yoshida

IPC分类号： B23K106

CPC分类号： G11B5/4853 ,  B23K20/002

摘要： A set of bonding pads are ultrasonically connected to a set of leads. The bonding pads are formed on a predetermined plane of a slider held by a slider holder accessible to the recording plane of a disk in a disk drive. The leads are held by the slider holder and have joints that are formed so as to respectively face each of the bonding pads. A front end plane of a wedge working on the joints is tilted in a direction in which the first sides of the joints correspond to external connection sides. The ultrasonic connection is completed by pressing the joints of the leads against the faced boding pads.

摘要翻译： 一组焊盘被超声波连接到一组引线。 接合焊盘形成在由磁盘驱动器中的盘的记录平面可访问的滑块架保持的滑块的预定平面上。 引线由滑块保持器保持并且具有形成为分别面对每个接合焊盘的接头。 在接头处工作的楔的前端面在接头的第一面对应于外部连接侧的方向上倾斜。 超声波连接通过将引线的接头压在面对的焊盘上而完成。

公开(公告)号：US06676005B2

公开(公告)日：2004-01-13

申请号：US10196841

申请日：2002-07-17

申请人： Kenji Itoh ,  Naoki Kurosu ,  Yohtaroh Ichimura ,  Tatsushi Yoshida

发明人： Kenji Itoh ,  Naoki Kurosu ,  Yohtaroh Ichimura ,  Tatsushi Yoshida

IPC分类号： B23K106

CPC分类号： H01L24/85 ,  B23K20/004 ,  H01L24/45 ,  H01L24/78 ,  H01L2224/45015 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/456 ,  H01L2224/45644 ,  H01L2224/4569 ,  H01L2224/78301 ,  H01L2224/78313 ,  H01L2224/78344 ,  H01L2224/85205 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/2075

摘要： The present invention enhances the reliability of wire-bonding strength by reducing a variation in the entire transformation amount of a wire. At point P1, a bonding wedge 21 abuts the wire 71, whereby a load is exerted on the wire 71. The wire 71 transforms by an amount of transformation A, and the transformation stops at point P2. The transformation amount A varies greatly. At point P3 (T1), ultrasonic wave vibration is exerted and the transformation of the wire 71 is restarted. At this stage, a variation in the transformation amount A is absorbed by an amount of transformation B and therefore a variation in the transformation amount A+B becomes small. At point P4 (T1+T2), the transformation amount A+B is maintained substantially constant. At this point P4, the transformation amount of the wire 71 is set to 0 and the measurement of the transformation amount of the wire 71 is started. And until the transformation amount of the wire 71 reaches an amount of transformation C (point P5), a load and ultrasonic wave vibration are given.

摘要翻译： 本发明通过减少线的整个变换量的变化来提高引线接合强度的可靠性。 在点P1处，接合楔21抵接线71，由此在线71上施加负载。线71变换一定量的变换A，并且变形在点P2处停止。 变换量A变化很大。 在点P3（T1），施加超声波振动，重新开始线71的变形。 在这个阶段，变换量A的变化被变换量B吸收，因此变换量A + B的变化变小。 在点P4（T1 + T2），变换量A + B保持基本恒定。 在该点P4处，将线71的变形量设定为0，开始线71的变形量的测定。 并且直到线71的变形量达到变形量C（点P5）为止，给出负载和超声波振动。

公开(公告)号：US20110132879A1

公开(公告)日：2011-06-09

申请号：US12961989

申请日：2010-12-07

申请人： Yuhsuke Matsumoto ,  Eiki Oosawa ,  Tatsumi Tsuchiya ,  Hideto Imai ,  Tatsushi Yoshida

发明人： Yuhsuke Matsumoto ,  Eiki Oosawa ,  Tatsumi Tsuchiya ,  Hideto Imai ,  Tatsushi Yoshida

IPC分类号： B23K9/04

CPC分类号： B23K1/0016 ,  B23K1/0056 ,  B23K3/0623

摘要： A method for connecting electrical parts The method includes retaining a piece of metal within a nozzle, supplying inert gas to the nozzle, and irradiating the retained piece of metal with a light source while the supplied inert gas flows from apertures in the nozzle. The metal is melted by the light source. The method also includes ejecting the melted metal from the nozzle by the supplied inert gas onto electrical parts.

摘要翻译： 一种用于连接电气部件的方法该方法包括将一块金属保持在喷嘴内，向喷嘴供给惰性气体，并且在所供应的惰性气体从喷嘴中的孔流动的同时用光源照射保留的金属片。 金属被光源熔化。 该方法还包括通过所提供的惰性气体将熔融的金属从喷嘴喷射到电气部件上。