公开(公告)号：US06556384B1

公开(公告)日：2003-04-29

申请号：US09590659

申请日：2000-06-07

申请人： Hiroo Inoue ,  Tatsushi Yoshida ,  Tatsumi Tsuchiya ,  Yurika Shimozawa

发明人： Hiroo Inoue ,  Tatsushi Yoshida ,  Tatsumi Tsuchiya ,  Yurika Shimozawa

IPC分类号： G11B2124

CPC分类号： G11B5/4853 ,  G11B5/4826

摘要： The present invention provides a head supporting arm that allows for laser tacking while having a merging lip and limiters for loading/unloading respectively. A head supporting arm according to the present invention includes a load beam, and a flexure connecting the load beam to a slider. The load beam having a dimple for generating a gimbal motion between the flexure and the slider. The slider having a head connected to its one end. The head supporting arm of the present invention further including an exposure opening formed in the load beam. The exposure opening allowing for the exposing of the bonding portion of the flexure that is bonded to the other end of the slider. The exposure opening further providing an opening to extend the limiters formed unitarily with the flexure 36 onto a surface of the load beam that is opposite to the surface on which the flexure 36 is provided. The extended limiters are hooked to the load beam at the opposite surface.

摘要翻译： 本发明提供了一种头部支撑臂，其允许在具有合并唇缘和分别用于装载/卸载的限制器的情况下进行激光粘贴。 根据本发明的头部支撑臂包括负载梁和将负载梁连接到滑块的挠曲件。 负载梁具有用于在挠曲件和滑块之间产生万向运动的凹坑。 滑块具有连接到其一端的头部。 本发明的头支撑臂还包括形成在负载梁中的曝光开口。 曝光开口允许暴露粘合到滑块另一端的挠曲件的粘合部分。 曝光开口还提供一个开口，用于将与弯曲部36一体形成的限制器延伸到与设置挠曲件36的表面相反的负载梁的表面上。 扩展的限制器被钩在相对表面的负载梁上。

公开(公告)号：US06459549B1

公开(公告)日：2002-10-01

申请号：US09586830

申请日：2000-06-05

申请人： Tatsumi Tsuchiya ,  Tatsushi Yoshida ,  Hiroyasu Tsuchida ,  Hiroo Inoue ,  Surya Pattanaik ,  Hiromi Ishikawa ,  Masaaki Nanba

发明人： Tatsumi Tsuchiya ,  Tatsushi Yoshida ,  Hiroyasu Tsuchida ,  Hiroo Inoue ,  Surya Pattanaik ,  Hiromi Ishikawa ,  Masaaki Nanba

IPC分类号： G11B2116

CPC分类号： G11B5/4853 ,  G11B5/4826

摘要： Apertures are formed in the portion of a flexure adjacent to the soldered portions between the bonding pads of the slider and the lead pads of lead end portions. With this, an adhesive agent for bonding the slider to a flexure tongue is moved downward from the apertures so there is no fear that the adhesive agent will contact the lead pads and the bonding pads. This design prevents the protrusion of an adhesive agent from short-circuiting the flexure, and absorbs a warp produced by shrinkage of a soldered portion by decreasing rigidity of the flexure. When both the bonding pad formed on the slider and the lead pad of a lead fixed to the platform of the flexure are disposed and soldered, the quality of the soldered portion is improved by locating the pads as close to each other as possible.

摘要翻译： 在与滑块的接合焊盘和引线端部的引线焊盘之间的焊接部分相邻的挠曲部分中形成有孔。 由此，用于将滑块结合到挠曲舌的粘合剂从孔向下移动，因此不用担心粘合剂将接触引线焊盘和焊盘。 这种设计防止了粘合剂的突起使挠曲变短，并且通过降低挠曲的刚度来吸收由焊接部分的收缩产生的翘曲。 当形成在滑块上的接合焊盘和固定到弯曲部的平台的引线的引线焊盘都被布置和焊接时，通过将焊盘尽可能靠近地定位来改善焊接部分的质量。

公开(公告)号：US20110132879A1

公开(公告)日：2011-06-09

申请号：US12961989

申请日：2010-12-07

申请人： Yuhsuke Matsumoto ,  Eiki Oosawa ,  Tatsumi Tsuchiya ,  Hideto Imai ,  Tatsushi Yoshida

发明人： Yuhsuke Matsumoto ,  Eiki Oosawa ,  Tatsumi Tsuchiya ,  Hideto Imai ,  Tatsushi Yoshida

IPC分类号： B23K9/04

CPC分类号： B23K1/0016 ,  B23K1/0056 ,  B23K3/0623

摘要： A method for connecting electrical parts The method includes retaining a piece of metal within a nozzle, supplying inert gas to the nozzle, and irradiating the retained piece of metal with a light source while the supplied inert gas flows from apertures in the nozzle. The metal is melted by the light source. The method also includes ejecting the melted metal from the nozzle by the supplied inert gas onto electrical parts.

摘要翻译： 一种用于连接电气部件的方法该方法包括将一块金属保持在喷嘴内，向喷嘴供给惰性气体，并且在所供应的惰性气体从喷嘴中的孔流动的同时用光源照射保留的金属片。 金属被光源熔化。 该方法还包括通过所提供的惰性气体将熔融的金属从喷嘴喷射到电气部件上。

公开(公告)号：US07583475B2

公开(公告)日：2009-09-01

申请号：US11066949

申请日：2005-02-25

申请人： Yuhsuke Matsumoto ,  Tatsumi Tsuchiya ,  Takaaki Murokawa ,  Yoshio Uematsu ,  Tatsushi Yoshida ,  Nobuyuki Hashi ,  Hiroyasu Tsuchida ,  Takuma Muraki

发明人： Yuhsuke Matsumoto ,  Tatsumi Tsuchiya ,  Takaaki Murokawa ,  Yoshio Uematsu ,  Tatsushi Yoshida ,  Nobuyuki Hashi ,  Hiroyasu Tsuchida ,  Takuma Muraki

IPC分类号： G11B5/48

CPC分类号： H05K3/3442 ,  G11B5/4853 ,  H05K1/111 ,  H05K2201/0397 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2201/09745 ,  H05K2201/10727 ,  H05K2203/041 ,  Y02P70/611 ,  Y02P70/613

摘要： Embodiments of the invention provide techniques to prevent, when a bonding pad and a lead wiring pad are to be connected using a solder ball, the solder ball from deviating from a centerline and a soldering problem from occurring. In one embodiment, a head suspension assembly includes a solder ball disposed between a lead wiring pad provided for a flexure and a bonding pad provided for a slider. The solder ball is then melted for making a soldered joint between the lead wiring pad and the bonding pad. A through slot is provided at a position near a centerline on a front surface of the lead wiring pad. The solder ball is dropped into the through slot by gravity from the front surface of the lead wiring pad. A contact area in contact with the solder ball is thereby secured on a side of the slider.

摘要翻译： 本发明的实施例提供了当使用焊球连接接合焊盘和引线接线焊盘时防止焊料球偏离中心线并发生焊接问题的技术。 在一个实施例中，头悬挂组件包括设置在为弯曲提供的引线布线垫和为滑块设置的接合焊盘之间的焊球。 然后将焊球熔化以在引线接线焊盘和焊盘之间形成焊接接头。 在引线配线衬垫的前表面上的中心线附近的位置处设有通槽。 焊球通过重力从引线接线板的前表面落入通槽。 因此，与滑块接触的接触区域被固定在滑块的一侧。

公开(公告)号：US07486480B2

公开(公告)日：2009-02-03

申请号：US11355470

申请日：2006-02-15

申请人： Takuya Satoh ,  Tatsushi Yoshida ,  Tatsumi Tsuchiya ,  Yoshio Uematsu

发明人： Takuya Satoh ,  Tatsushi Yoshida ,  Tatsumi Tsuchiya ,  Yoshio Uematsu

IPC分类号： G11B5/40 ,  B23K35/14

CPC分类号： H05K3/3442 ,  G11B5/4853 ,  H01L2224/742 ,  H01L2924/01327 ,  H05K3/3494 ,  H05K2201/10727 ,  H05K2203/0195 ,  H05K2203/041 ,  H05K2203/043 ,  H05K2203/107 ,  Y02P70/613 ,  Y10T29/4903 ,  Y10T29/49211 ,  H01L2924/00

摘要： Embodiments of the invention relate to making reconnection when a soldered connection fails in a head/slider used in a magnetic disk drive. In one embodiment, a solder mass deposited on a slider pad of a head/slider is separated from a lead pad and a solder ball connection is yet to be made between the slider pad and the lead pad. A shaping tip is heated to a temperature near a melting point of a solder. The shaping tip is moved in parallel with a surface of the slider pad toward the side of the lead pad to soften the solder mass. The solder mass is thereafter irradiated with a laser beam so as to form a solder fillet, thereby making a soldered connection between the lead pad and the slider pad.

摘要翻译： 本发明的实施例涉及当在磁盘驱动器中使用的头/滑块中的焊接连接失败时重新连接。 在一个实施例中，沉积在头/滑块的滑块上的焊料块与引线焊盘分离，并且在滑块焊盘和引线焊盘之间尚未形成焊球连接。 将成型尖端加热至接近焊料熔点的温度。 成形尖端与滑块的表面平行地移动到铅焊盘的侧面以软化焊料质量。 然后用激光束照射焊料，以形成焊锡圆角，从而在引线焊盘和滑块之间形成焊接连接​​。

公开(公告)号：US07210221B2

公开(公告)日：2007-05-01

申请号：US10929512

申请日：2004-08-30

申请人： Takao Kidachi ,  Tadaaki Tomiyama ,  Yoshio Uematsu ,  Hiromi Ishikawa Ishikawa ,  Tatsushi Yoshida ,  Hiroyoshi Yokome ,  Yukihiro Nakamura ,  Hisashi Ohyama ,  Tatsumi Tsuchiya

发明人： Takao Kidachi ,  Tadaaki Tomiyama ,  Yoshio Uematsu ,  Hiromi Ishikawa Ishikawa ,  Tatsushi Yoshida ,  Hiroyoshi Yokome ,  Yukihiro Nakamura ,  Hisashi Ohyama ,  Tatsumi Tsuchiya

IPC分类号： B23P19/02

CPC分类号： G11B5/4826 ,  Y10T29/49025 ,  Y10T29/49027 ,  Y10T29/4998 ,  Y10T29/5313 ,  Y10T29/53165 ,  Y10T29/53174 ,  Y10T29/53187 ,  Y10T29/53191 ,  Y10T29/53252 ,  Y10T29/5327

摘要： A base plate and load beam for an HG assembly are formed in series, stacked, and transferred by a transfer system in the form of the stacked-layer series to undergo the necessary assembly processes such as layer joining, slider attachment, and electrical connections between the terminals thereon. When uncompleted HG assemblies are transferred for each of the manufacturing processes, the uncompleted HG assembly is mounted on the assembly jig such as a tray or a block for transference. For this reason, assembling jigs, the number of which is at least equal to the number of the uncompleted HG assemblies remaining at the respective assembly processes would be needed. Accordingly, the efficiency of work space is reduced, and a rise in manufacturing cost is brought about by the need for the assembling jigs.

摘要翻译： 用于HG组件的底板和负载梁通过堆叠层系列形式的传送系统串联，堆叠和传送，以进行必要的组装过程，例如层接合，滑块附接和电连接 其上的端子。 当为每个制造过程转移未完成的HG组件时，未完成的HG组件安装在组装夹具上，例如托盘或用于转移的块。 因此，需要组装夹具的数量至少等于在各个组装过程中保留的未完成的HG组件的数量。 因此，减少了工作空间的效率，并且由于需要组装夹具而引起制造成本的上升。

公开(公告)号：US06742694B2

公开(公告)日：2004-06-01

申请号：US10074718

申请日：2002-02-13

申请人： Takuya Satoh ,  Tatsumi Tsuchiya ,  Yasuhiro Mita ,  Lan Shi ,  Hiroyoshi Yokome ,  Tatsushi Yoshida ,  Surya Pattanaik

发明人： Takuya Satoh ,  Tatsumi Tsuchiya ,  Yasuhiro Mita ,  Lan Shi ,  Hiroyoshi Yokome ,  Tatsushi Yoshida ,  Surya Pattanaik

IPC分类号： B23K100

CPC分类号： G11B5/486 ,  B23K1/0056 ,  B23K3/0623 ,  B23K3/08 ,  B23K2101/40 ,  B23K2101/42 ,  H05K3/3442 ,  H05K3/3478

摘要： An apparatus joins bonding pads of a slider and lead pads of lead wires in a head gimbals assembly to improve efficiency, downsizing, and maintenance of solder-ball disposing devices, and solder-ball reflow devices for reflowing solder balls. The solder-ball disposing apparatus discharges solder balls from solder-ball discharging holes of a solder-ball feeder unit which are evacuated by a suction pad. An environmental space and an inert-gas supply portion for forming inactive atmosphere are formed on a table to eliminate an inert-gas supply unit from an optical unit, so that converged laser beams are directly radiated onto the solder balls.

摘要翻译： 一种装置将滑块的接合焊盘和引线的引线垫连接在头部万向节组件中，以提高焊球配置装置的效率，小型化和维护，以及用于回流焊球的焊球回流装置。 焊球配置装置从通过吸盘抽真空的焊球供给装置的焊球排出孔排出焊球。 用于形成无活性气氛的环境空间和惰性气体供应部分形成在桌子上以从光学单元消除惰性气体供应单元，使得会聚的激光束直接辐射到焊球上。

公开(公告)号：US08881967B2

公开(公告)日：2014-11-11

申请号：US12576715

申请日：2009-10-09

申请人： Yuhsuke Matsumoto ,  Tatsumi Tsuchiya ,  Eiki Oosawa ,  Tatsushi Yoshida

发明人： Yuhsuke Matsumoto ,  Tatsumi Tsuchiya ,  Eiki Oosawa ,  Tatsushi Yoshida

IPC分类号： B23K1/00 ,  B23K26/14 ,  B23K3/06 ,  B23K1/005 ,  B23K26/03 ,  H05K3/34

CPC分类号： B23K1/0016 ,  B23K1/0056 ,  B23K3/0623 ,  B23K26/03 ,  B23K26/1476 ,  B23K2101/42 ,  H05K3/3442 ,  H05K3/3478 ,  H05K3/3494 ,  H05K2201/10727 ,  H05K2203/0195 ,  H05K2203/041 ,  H05K2203/107

摘要： An apparatus for interconnecting two connection pads in a head-gimbal assembly. The apparatus includes a conveyer for conveying a metallic slug, and a nozzle for ejecting the metallic slug toward the two connection pads. The nozzle includes a receiving portion for receiving the metallic slug from the conveyer, and a straight guide disposed downstream of the receiving portion. The straight guide has a maximum inner diameter that is smaller than a minimum inner diameter of the receiving portion. The apparatus also includes a laser for applying a laser beam from an inlet side of the nozzle to the metallic slug as the metallic slug passes along a path that includes a first portion through said straight guide and a second portion between the straight guide and the two connection pads. The laser is configured to melt the metallic slug for attaching the metallic slug to the two connection pads.

摘要翻译： 一种用于互连头万向节组件中的两个连接焊盘的装置。 该装置包括用于输送金属块的输送机和用于朝向两个连接垫排出金属块的喷嘴。 喷嘴包括用于从传送器接收金属块的接收部分和设置在接收部分下游的直的引导件。 该直引导件的最大内径小于接收部分的最小内径。 该装置还包括一激光器，用于当金属芯块沿着包括通过所述直引导件的第一部分的路径和直引导件与两者之间的第二部分的路径通过时，将激光束从喷嘴的入口侧施加到金属块 连接垫 激光器被配置为熔化用于将金属块塞附接到两个连接焊盘的金属块。

公开(公告)号：US20060193084A1

公开(公告)日：2006-08-31

申请号：US11355470

申请日：2006-02-15

申请人： Takuya Satoh ,  Tatsushi Yoshida ,  Tatsumi Tsuchiya ,  Yoshio Uematsu

发明人： Takuya Satoh ,  Tatsushi Yoshida ,  Tatsumi Tsuchiya ,  Yoshio Uematsu

IPC分类号： G11B5/60

CPC分类号： H05K3/3442 ,  G11B5/4853 ,  H01L2224/742 ,  H01L2924/01327 ,  H05K3/3494 ,  H05K2201/10727 ,  H05K2203/0195 ,  H05K2203/041 ,  H05K2203/043 ,  H05K2203/107 ,  Y02P70/613 ,  Y10T29/4903 ,  Y10T29/49211 ,  H01L2924/00

摘要： Embodiments of the invention relate to making reconnection when a soldered connection fails in a head/slider used in a magnetic disk drive. In one embodiment, a solder mass deposited on a slider pad of a head/slider is separated from a lead pad and a solder ball connection is yet to be made between the slider pad and the lead pad. A shaping tip is heated to a temperature near a melting point of a solder. The shaping tip is moved in parallel with a surface of the slider pad toward the side of the lead pad to soften the solder mass. The solder mass is thereafter irradiated with a laser beam so as to form a solder fillet, thereby making a soldered connection between the lead pad and the slider pad.

摘要翻译： 本发明的实施例涉及当在磁盘驱动器中使用的头/滑块中的焊接连接失败时重新连接。 在一个实施例中，沉积在头/滑块的滑块上的焊料块与引线焊盘分离，并且在滑块焊盘和引线焊盘之间尚未形成焊球连接。 将成型尖端加热至接近焊料熔点的温度。 成形尖端与滑块的表面平行地移动到铅焊盘的侧面以软化焊料质量。 然后用激光束照射焊料，以形成焊锡圆角，从而在引线焊盘和滑块之间形成焊接连接​​。

公开(公告)号：US20130063839A1

公开(公告)日：2013-03-14

申请号：US13229631

申请日：2011-09-09

申请人： Yuhsuke Matsumoto ,  Tatsumi Tsuchiya ,  Eiki Oosawa ,  Tatsushi Yoshida

发明人： Yuhsuke Matsumoto ,  Tatsumi Tsuchiya ,  Eiki Oosawa ,  Tatsushi Yoshida

IPC分类号： G11B5/60 ,  G11B17/02

CPC分类号： G11B5/4826

摘要： A head-gimbal assembly (HGA) with a suspension-lead pad having a form that is configured to inhibit formation of an inter-pad solder bridge. The HGA includes a gimbal, a head-slider and a plurality of suspension-lead pads. The head-slider is coupled with the gimbal, and includes a plurality of head-slider pads. The plurality of suspension-lead pads is coupled with the plurality of head-slider pads by a plurality of solder bonds. A suspension-lead pad comprises a first lateral side, a second lateral side, a proximal side, disposed in proximity to a respective head-slider pad, and a distal side. A first width of the suspension-lead pad closer to the proximal side is substantially larger than a second width of the suspension-lead pad further from the proximal side than the first width. A disk drive including the HGA, and a head-slider with a head-slider pad having similar form to the suspension-lead pad are also provided.

摘要翻译： 一种具有悬挂铅焊盘的头部万向节组件（HGA），其具有禁止形成垫间焊接桥的形式。 HGA包括万向节，头滑块和多个悬挂引线板。 头滑块与万向节连接，并且包括多个头滑块垫。 多个悬挂引线板通过多个焊接接合与多个头部 - 滑动器垫片连接。 悬挂引线垫包括设置在相应的头部 - 滑动器垫附近的第一侧面，第二侧面，近侧，以及远侧。 靠近近侧的悬挂引线焊盘的第一宽度比从第一宽度近的侧面的悬挂引线焊盘的第二宽度大得多。 还提供了包括HGA的磁盘驱动器和具有与悬挂引线板相似形式的磁头滑块的磁头滑块。