公开(公告)号：US08651465B2

公开(公告)日：2014-02-18

申请号：US12996472

申请日：2010-01-29

申请人： Tatsuya Ito ,  Noboru Arakawa

发明人： Tatsuya Ito ,  Noboru Arakawa

IPC分类号： F16F1/38

CPC分类号： F16F1/3842

摘要： A method of manufacturing a bushing assembly that includes a vibration damping rubber bushing having a round cylindrical resin outer cylinder, which is assembled by press fitting an outside peripheral face of the outer cylinder in an axial direction into a cylindrical metal mated component having a circular inside peripheral face. The vibration damping rubber bushing is press fit into the mated component with a rigid powder composed of material harder than the outer cylinder deposited in a section of the resin outer cylinder that is situated on the outside peripheral face and that mates with the inside peripheral face of the mated component, and the outer cylinder and the mated component are assembled in a mated condition such that the rigid powder intervenes between the outside peripheral face of the outer cylinder and the inside peripheral face of the mated component.

摘要翻译： 一种衬套组件的制造方法，其包括：具有圆筒形树脂外筒的减振橡胶衬套，其通过将外筒的外周面沿轴向压配合到具有圆形内侧的圆筒形的金属配合部件 外围脸。 减震橡胶衬套用刚性粉末压配合到配合部件中，该刚性粉末由位于外周面上的树脂外筒的一部分中沉积的外圆柱体以上的材料组成，并与外周面相配合 配合部件和外筒和配合部件以配合状态组装，使得刚性粉末介入外筒的外周面和配合部件的内周面之间。

公开(公告)号：US20110109027A1

公开(公告)日：2011-05-12

申请号：US12996472

申请日：2010-01-29

申请人： Tatsuya Ito ,  Noboru Arakawa

发明人： Tatsuya Ito ,  Noboru Arakawa

IPC分类号： F16F1/38 ,  B23P11/02 ,  F16F7/00

CPC分类号： F16F1/3842

摘要： A method of manufacturing a bushing assembly that includes a vibration damping rubber bushing having a round cylindrical resin outer cylinder, which is assembled by press fitting an outside peripheral face of the outer cylinder in an axial direction into a cylindrical metal mated component having a circular inside peripheral face. The vibration damping rubber bushing is press fit into the mated component with a rigid powder composed of material harder than the outer cylinder deposited in a section of the resin outer cylinder that is situated on the outside peripheral face and that mates with the inside peripheral face of the mated component, and the outer cylinder and the mated component are assembled in a mated condition such that the rigid powder intervenes between the outside peripheral face of the outer cylinder and the inside peripheral face of the mated component.

摘要翻译： 一种衬套组件的制造方法，其包括：具有圆筒形树脂外筒的减振橡胶衬套，其通过将外筒的外周面沿轴向压配合到具有圆形内侧的圆筒形的金属配合部件 外围脸。 减震橡胶衬套用刚性粉末压配合到配合部件中，该刚性粉末由位于外周面上的树脂外筒的一部分中沉积的外圆柱体以上的材料组成，并与外周面相配合 配合部件和外筒和配合部件以配合状态组装，使得刚性粉末介入外筒的外周面和配合部件的内周面之间。

公开(公告)号：US08581388B2

公开(公告)日：2013-11-12

申请号：US12976427

申请日：2010-12-22

申请人： Shinnosuke Maeda ,  Tetsuo Suzuki ,  Atsuhiko Sugimoto ,  Tatsuya Ito ,  Takuya Hando ,  Satoshi Hirano

发明人： Shinnosuke Maeda ,  Tetsuo Suzuki ,  Atsuhiko Sugimoto ,  Tatsuya Ito ,  Takuya Hando ,  Satoshi Hirano

IPC分类号： H01L23/053 ,  H01L21/4763

CPC分类号： H05K3/3452 ,  H01L23/49811 ,  H01L23/49822 ,  H01L2924/0002 ,  H05K1/113 ,  H05K3/205 ,  H05K3/383 ,  H05K3/4682 ,  H05K2201/068 ,  H05K2201/094 ,  H05K2201/09527 ,  H05K2201/099 ,  H05K2203/0346 ,  H05K2203/0369 ,  H01L2924/00

摘要： A multilayered wiring substrate, comprising: a plurality of first main surface side connecting terminals arranged in a first main surface of a stack structure; and a plurality of second main surface side connecting terminals being arranged in a second main surface of the stack structure; wherein a plurality of conductor layers are alternately formed in a plurality of stacked resin insulation layers and are operably connected to each other through via conductors tapered such that diameters thereof are widened toward the first or the second main surface, wherein a plurality of openings are formed in an exposed outermost resin insulation layer in the second main surface, and terminal outer surfaces of the second main surface side connecting terminals arranged to match with the plurality of the openings are positioned inwardly from an outer main surface of the exposed outermost resin insulation layer, and edges of terminal inner surfaces are rounded.

摘要翻译： 一种多层布线基板，包括：布置在堆叠结构的第一主表面中的多个第一主表面侧连接端子; 并且多个第二主表面侧连接端子布置在所述堆叠结构的第二主表面中; 其中多个导体层交替地形成在多个堆叠的树脂绝缘层中，并且通过锥形的通孔导体可操作地连接，使得其直径朝向第一或第二主表面加宽，其中形成多个开口 在第二主表面中暴露的最外层树脂绝缘层中，并且布置成与多个开口相匹配的第二主表面侧连接端子的端子外表面从暴露的最外层树脂绝缘层的外主表面位于内侧， 并且端子内表面的边缘是圆形的。

公开(公告)号：US08162636B2

公开(公告)日：2012-04-24

申请号：US12465270

申请日：2009-05-13

申请人： Kenji Yokoi ,  Masao Iguchi ,  Kazuhiro Kuroki ,  Tatsuya Ito

发明人： Kenji Yokoi ,  Masao Iguchi ,  Kazuhiro Kuroki ,  Tatsuya Ito

IPC分类号： F04C18/00 ,  F04C2/00

CPC分类号： F04C18/0215 ,  F04C29/02 ,  F04C29/026 ,  F04C2240/30 ,  Y10S418/01

摘要： A scroll type compressor has a fixed scroll member, a movable scroll member, an oil reservoir, a back-pressure chamber, an oil extraction passage, a flow passage, and a partition wall. The back-pressure chamber disposed behind the movable scroll member is in communication with a discharge chamber. The oil extraction passage having a regulating valve or a throttle connects the back-pressure chamber to the oil reservoir. The oil return passage and the flow passage connect the oil reservoir to a suction chamber, respectively. The flow passage introduces excess lubricating oil into the suction chamber when the level of lubricating oil in the oil reservoir becomes higher than a predetermined level. The partition wall disposed between the openings of the oil extraction passage for restricting lubricating oil from the oil extraction passage other than the excess lubricating oil collected in the oil reservoir from flowing to the flow passage.

摘要翻译： 涡旋式压缩机具有固定涡旋构件，可动涡旋构件，储油器，背压室，抽油通道，流路和分隔壁。 设置在动涡旋件后面的背压室与排出室连通。 具有调节阀或节气门的抽油通道将背压室连接到储油器。 回油通道和流路将储油器分别连接到吸入室。 当油箱中的润滑油水平高于预定水平时，流路将多余的润滑油引入吸入室。 所述分隔壁设置在所述抽油通道的开口之间，用于限制从所述油层中收集的过剩润滑油以外的所述除油通道的润滑油流入所述流动通道。

公开(公告)号：US07429779B2

公开(公告)日：2008-09-30

申请号：US11189134

申请日：2005-07-26

申请人： Kazuhisa Itoi ,  Masakazu Sato ,  Tatsuya Ito

发明人： Kazuhisa Itoi ,  Masakazu Sato ,  Tatsuya Ito

IPC分类号： H01L43/00

CPC分类号： H01L28/10 ,  Y10T29/49117

摘要： A semiconductor device includes a semiconductor substrate having an electrode formed above a surface thereof; a first insulating resin layer that is provided over the semiconductor substrate and has a first opening defined at a position corresponding to the electrode; a first wiring layer that is provided on the first insulating resin layer and is connected to the electrode through the first opening; a second insulating resin layer provided over the first insulating resin layer and the first wiring layer, the second insulating resin layer having a second opening that is defined at a position different from the position of the first opening in a direction of the surface of the semiconductor substrate; and a second wiring layer that is provided on the second insulating resin layer and is connected to the first wiring layer through the second opening, wherein the second wiring layer includes an induction element, and a sum of a thickness of the first insulating resin layer and a thickness of the second insulating resin layer is not less than 5 μm and not more than 60 μm.

公开(公告)号：US20080173096A1

公开(公告)日：2008-07-24

申请号：US11843342

申请日：2007-08-22

申请人： Masakazu SATO ,  Tatsuya Ito ,  Hideto Noguchi

发明人： Masakazu SATO ,  Tatsuya Ito ,  Hideto Noguchi

IPC分类号： G01L9/00 ,  H01L21/02

CPC分类号： G01L9/0054 ,  G01L19/0069

摘要： This invention aims to realize reduction in size without impairing measurement accuracy or connection reliability in a semiconductor pressure sensor in which a glass substrate is adhered to a rear-surface side of a pressure-sensitive chip in which piezoresistive pressure-sensitive gauges have been formed on a front surface of a diaphragm formed of a silicon single crystal to form a space between a rear surface of the diaphragm and the glass substrate, for measuring a pressure applied to the front surface of the diaphragm with reference to a pressure of the first space as a standard pressure. In order to achieve this object, the semiconductor pressure sensor includes resinous projections formed on pressure-sensitive gauge electrodes disposed on a front surface of the pressure-sensitive chip or on wiring from the pressure-sensitive gauge electrodes and bumps formed so as to partially or entirely cover the resinous projections.

摘要翻译： 本发明的目的是在不损害其中玻璃基板粘附在其上形成有压阻压力计的压敏片的背面侧的半导体压力传感器中实现尺寸的减小而不损害测量精度或连接可靠性 由硅单晶形成的隔膜的前表面，以在隔膜的后表面和玻璃基板之间形成空间，用于参照第一空间的压力测量施加到隔膜前表面的压力 标准压力。 为了实现该目的，半导体压力传感器包括形成在压敏表电极上的树脂突起，所述压敏电极设置在压敏芯片的前表面上，或者布置在压敏表电极和凸起上，凸起形成为局部或 完全覆盖树脂突起。

公开(公告)号：US07301721B2

公开(公告)日：2007-11-27

申请号：US11282673

申请日：2005-11-21

申请人： Tatsuya Ito ,  Tadashi Okumura ,  Tsuyoshi Takahashi ,  Masatoshi Ishikawa ,  Yuji Nishimura ,  Tetsuo Yuki

发明人： Tatsuya Ito ,  Tadashi Okumura ,  Tsuyoshi Takahashi ,  Masatoshi Ishikawa ,  Yuji Nishimura ,  Tetsuo Yuki

IPC分类号： G11B21/02 ,  G11B17/00 ,  G01L9/00 ,  G11B5/58

CPC分类号： G01P15/0891 ,  G11B5/54 ,  G11B19/04 ,  G11B21/12

摘要： A falling sensor is provided, which detects a falling of a magnetic disk drive or an information processing device installed with said magnetic disk drive and which is effective for avoiding physical damages of magnetic heads and magnetic disk media. The magnetic disk drive or the information processing device, include an unload mechanism moving or evacuating said magnetic head from a surface of said magnetic disk media, and a falling sensor comprising a conductive flexible beams 9 or members having a compatible function, a conductive weight 10 supported by these beams and a conductive wall 11 arranged to be made contact or non-contact with said weight 10. The sensor can detect a falling of the magnetic disk drive or the information processing device which is typically a notebook personal computer installing with the magnetic disk drive, and evacuate the magnetic head by the unload mechanism. The conductive wall 11 can be formed as a tubular member.

摘要翻译： 提供了一种下降传感器，其检测安装有所述磁盘驱动器的磁盘驱动器或信息处理装置的下落，并且其有效地避免磁头和磁盘介质的物理损坏。 磁盘驱动器或信息处理装置包括从所述磁盘介质的表面移动或抽出所述磁头的卸载机构，以及包括导电柔性梁9或具有兼容功能的构件的下落传感器，导电重量10 由这些梁支撑，导电壁11布置成与所述配重10接触或不接触。 传感器可以检测磁盘驱动器或信息处理装置的掉落，该装置通常是与磁盘驱动器一起安装的笔记本个人计算机，并且通过卸载机构排出磁头。 导电壁11可以形成为管状构件。

公开(公告)号：US07175022B2

公开(公告)日：2007-02-13

申请号：US11171367

申请日：2005-07-01

申请人： Tatsuya Ito

发明人： Tatsuya Ito

IPC分类号： B65D85/10 ,  B65D43/16 ,  A24F15/12

CPC分类号： B65D5/606 ,  B65D85/1045

摘要： A hinged-lid pack includes a case (2), and contents (14) contained in the case (2) and fit with an inner frame (16). The case (2) has a transverse cutting line (22) formed in a front wall (4) thereof, oblique cutting lines (24) respectively formed in right and left side walls (12) thereof, and a self-hinge (26) formed at a rear wall (6) thereof. When the case (2) is split apart along the transverse cutting line (22) and the oblique cutting lines (24), the case (2) is divided into a box (30) and a recloseable lid (28).

摘要翻译： 铰链盖组件包括壳体（2）和容纳在壳体（2）中并与内框架（16）配合的内容物（14）。 壳体（2）具有形成在其前壁（4）上的横向切割线（22），分别形成在其左右侧壁（12）中的倾斜切割线（24）和自铰链（26） 形成在其后壁（6）上。 当壳体（2）沿着横切线（22）和倾斜切割线（24）分开时，壳体（2）被分成箱（30）和可再封闭盖（28）。

公开(公告)号：US07136332B2

公开(公告)日：2006-11-14

申请号：US10650782

申请日：2003-08-29

申请人： Tatsuya Ito

发明人： Tatsuya Ito

IPC分类号： G11B7/00

CPC分类号： G11B7/1275 ,  G11B7/08 ,  G11B7/0901 ,  G11B7/0909 ,  G11B7/131 ,  G11B7/1374 ,  G11B7/1376 ,  G11B7/1378 ,  G11B7/13922 ,  G11B2007/0006

摘要： An optical pickup device has a semiconductor in which 2 light emitters laser emitting laser beams having different wavelengths for a DVD and CD are mounted on one package and disposes optical-system lenses with reference to a main beam for a DVD such that a long axis of an elliptic beam which is emitted from each light emitter for a CD and DVD and irradiated onto a disc is tilted at about 35° to the radius direction of a disc. This prevents an aberration from being generated in a converging spot at the DVD side due to image height and exhibits sufficient performance of lens to keep all CT, MTF and jitter in comparatively favorable conditions.

摘要翻译： 一种光拾取装置具有半导体，其中2个发光体激光发射具有不同波长的激光束用于DVD和CD安装在一个封装上，并且参照DVD的主光束配置光学系统透镜，使得长轴 从用于CD和DVD的每个光发射器发射并照射到盘上的椭圆形光束相对于盘的半径方向倾斜约35°。 这防止了由于图像高度在DVD侧的会聚点中产生像差，并且表现出足够的透镜性能以将所有CT，MTF和抖动保持在相对有利的条件下。

公开(公告)号：US20060165897A1

公开(公告)日：2006-07-27

申请号：US11329139

申请日：2006-01-11

申请人： Tatsuya Ito

发明人： Tatsuya Ito

IPC分类号： B05D5/00 ,  B05C5/00 ,  B05D1/36 ,  B05C11/00

CPC分类号： G02B5/201 ,  B05B1/14 ,  B05B17/0615

摘要： A pattern forming method is for forming a pattern on a substrate that has a pattern forming region on its one surface. The pattern forming method includes scanning in a first direction the substrate provided with the pattern forming region; and discharging droplets containing pattern forming material into the pattern forming region from a droplet discharge head that is provided with a droplet discharge nozzle. The droplet discharge head is relatively oscillated relative to the one surface of the substrate by oscillating one of the droplet discharge head and the one surface relative to the other of the droplet discharge head and the one surface of the substrate in a direction different from the first direction, such that the droplets are discharged from the droplet discharge nozzle when the droplet discharge head faces the pattern forming region.

摘要翻译： 图案形成方法是在其表面上具有图案形成区域的基板上形成图案。 图案形成方法包括：在第一方向上扫描设置有图案形成区域的基板; 并且从设置有液滴喷射喷嘴的液滴喷射头将含有图案形成材料的液滴排出到图案形成区域中。 液滴喷射头相对于基板的一个表面相对振荡，通过相对于液滴喷射头中的另一个和基板的一个表面在不同于第一 方向，使得当液滴喷射头面向图案形成区域时，液滴从液滴排出喷嘴排出。