摘要:
A semiconductor module comprises a mounting board. A plurality of power switching device chips are mounted on the mounting board by flip-chip bonding. The chip has an upper surface and a lower surface and is configured to face the upper surface toward the mounting board. A drive IC chip is mounted on the mounting board by flip-chip bonding. The drive IC chip is operative to drive gates of transistors formed in the plurality of power switching device chips. A plurality of heat sink members are located on the lower surfaces of the plurality of power switching device chips, respectively. A resinous member is provided to seal the plurality of power switching device chips and the drive IC chip in a single package.
摘要:
A semiconductor module comprises a mounting board. A plurality of power switching device chips are mounted on the mounting board by flip-chip bonding. The chip has an upper surface and a lower surface and is configured to face the upper surface toward the mounting board. A drive IC chip is mounted on the mounting board by flip-chip bonding. The drive IC chip is operative to drive gates of transistors formed in the plurality of power switching device chips. A plurality of heat sink members are located on the lower surfaces of the plurality of power switching device chips, respectively. A resinous member is provided to seal the plurality of power switching device chips and the drive IC chip in a single package.
摘要:
A semiconductor module comprises a mounting board. A plurality of power switching device chips are mounted on the mounting board by flip-chip bonding. The chip has an upper surface and a lower surface and is configured to face the upper surface toward the mounting board. A drive IC chip is mounted on the mounting board by flip-chip bonding. The drive IC chip is operative to drive gates of transistors formed in the plurality of power switching device chips. A plurality of heat sink members are located on the lower surfaces of the plurality of power switching device chips, respectively. A resinous member is provided to seal the plurality of power switching device chips and the drive IC chip in a single package.
摘要:
A semiconductor module comprises a mounting board. A plurality of power switching device chips are mounted on the mounting board by flip-chip bonding. The chip has an upper surface and a lower surface and is configured to face the upper surface toward the mounting board. A drive IC chip is mounted on the mounting board by flip-chip bonding. The drive IC chip is operative to drive gates of transistors formed in the plurality of power switching device chips. A plurality of heat sink members are located on the lower surfaces of the plurality of power switching device chips, respectively. A resinous member is provided to seal the plurality of power switching device chips and the drive IC chip in a single package.
摘要:
A semiconductor module comprises a mounting board. A plurality of power switching device chips are mounted on the mounting board by flip-chip bonding. The chip has an upper surface and a lower surface and is configured to face the upper surface toward the mounting board. A drive IC chip is mounted on the mounting board by flip-chip bonding. The drive IC chip is operative to drive gates of transistors formed in the plurality of power switching device chips. A plurality of heat sink members are located on the lower surfaces of the plurality of power switching device chips, respectively. A resinous member is provided to seal the plurality of power switching device chips and the drive IC chip in a single package.
摘要:
There is provided a test apparatus that tests a device under test. The test apparatus includes a pattern memory that stores a test instruction stream determining a test sequence for testing the device under test, an interval register that stores a repeated interval in response to the fact that the repeated interval showing at least one instruction to be repeatedly executed in the test instruction stream has been specified, an instruction cache that caches the test instruction stream read from the pattern memory, a memory control section that reads the test instruction stream from the pattern memory and writes the read stream into the instruction cache, a pattern generating section that sequentially reads and executes instructions included in the test instruction stream from the instruction cache and generates a test pattern corresponding to the executed instruction, and a signal output section that generates a test signal based on the test pattern and supplies the generated signal to the device under test. The pattern generating section repeatedly executes an instruction stream within the repeated interval in the test instruction stream when the repeated interval is stored on the interval register.
摘要:
A test apparatus that tests a device under test is provided. The test apparatus includes: a pattern memory that stores in a compression format a test instruction sequence to define a test sequence for testing the device under test; an expanding section mat expands in a non-compression format the test instruction sequence read from the pattern memory; an instruction cache that caches the test instruction sequence which is expanded by the expanding section; a pattern generating section that sequentially reads instructions stored in the instruction cache and executes the same to generate a test pattern for the executed instruction; and a signal output section that generate a test signal based on the test pattern and provides the same to the device under test.
摘要:
The electrical connector housing contains a power distributor panel including a printed circuit board, one face of which carries conductors and semiconductor switching elements and the other face of which is adhered with a busbar. The electrical connector housing further contains a laminated-busbar unit connected to a power source circuit. A first tab is formed from one end of the busbar fixed to the power distributor panel, or by welding with the conductors, and is protruded beyond a first sidewall of the power distributor panel, while a second tab is formed from a busbar extending from the laminated-busbar unit. These tabs are connected by a relay system. The electrical connector housing thus manufactured can be assembled efficiently, its maintenance is easy, and the semiconductor switching elements used therein can be replaced easily.