公开(公告)号：US07633153B2

公开(公告)日：2009-12-15

申请号：US11778516

申请日：2007-07-16

申请人： Kazuo Shimokawa ,  Takashi Koyanagawa ,  Masako Ooishi ,  Tatsuya Yamada ,  Osamu Usuda ,  Yoshiki Endo ,  Taiki Miura ,  Masaki Toyoshima ,  Ichiro Omura ,  Akio Nakagawa ,  Kenichi Matsushita ,  Yusuke Kawaguchi ,  Haruki Arai ,  Hiroshi Takei ,  Tomohiro Kawano ,  Noriaki Yoshikawa ,  Morio Takahashi ,  Yasuhito Saito ,  Masahiro Urase

发明人： Kazuo Shimokawa ,  Takashi Koyanagawa ,  Masako Ooishi ,  Tatsuya Yamada ,  Osamu Usuda ,  Yoshiki Endo ,  Taiki Miura ,  Masaki Toyoshima ,  Ichiro Omura ,  Akio Nakagawa ,  Kenichi Matsushita ,  Yusuke Kawaguchi ,  Haruki Arai ,  Hiroshi Takei ,  Tomohiro Kawano ,  Noriaki Yoshikawa ,  Morio Takahashi ,  Yasuhito Saito ,  Masahiro Urase

IPC分类号： H01L23/10

CPC分类号： H01L23/3121 ,  H01L21/565 ,  H01L23/36 ,  H01L23/367 ,  H01L23/4822 ,  H01L23/49805 ,  H01L23/49844 ,  H01L24/16 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/84 ,  H01L25/0655 ,  H01L25/165 ,  H01L29/4175 ,  H01L29/7802 ,  H01L29/7806 ,  H01L29/7809 ,  H01L29/7813 ,  H01L29/7835 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/371 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/40225 ,  H01L2224/73153 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12032 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A semiconductor module comprises a mounting board. A plurality of power switching device chips are mounted on the mounting board by flip-chip bonding. The chip has an upper surface and a lower surface and is configured to face the upper surface toward the mounting board. A drive IC chip is mounted on the mounting board by flip-chip bonding. The drive IC chip is operative to drive gates of transistors formed in the plurality of power switching device chips. A plurality of heat sink members are located on the lower surfaces of the plurality of power switching device chips, respectively. A resinous member is provided to seal the plurality of power switching device chips and the drive IC chip in a single package.

摘要翻译： 半导体模块包括安装板。 多个电源开关器件芯片通过倒装芯片接合安装在安装板上。 芯片具有上表面和下表面，并且被配置为面向安装板的上表面。 通过倒装芯片接合将驱动IC芯片安装在安装板上。 驱动IC芯片用于驱动形成在多个功率开关器件芯片中的晶体管的栅极。 多个散热构件分别位于多个功率开关器件芯片的下表面上。 提供树脂构件以将单个封装中的多个功率开关器件芯片和驱动IC芯片密封。

公开(公告)号：US20060055432A1

公开(公告)日：2006-03-16

申请号：US11214730

申请日：2005-08-31

申请人： Kazuo Shimokawa ,  Takashi Koyanagawa ,  Masako Ooishi ,  Tatsuya Yamada ,  Osamu Usuda ,  Yoshiki Endo ,  Taiki Miura ,  Masaki Toyoshima ,  Ichiro Omura ,  Akio Nakagawa ,  Kenichi Matsushita ,  Yusuke Kawaguchi ,  Haruki Arai ,  Hiroshi Takei ,  Tomohiro Kawano ,  Noriaki Yoshikawa ,  Morio Takahashi ,  Yasuhito Saito ,  Masahiro Urase

发明人： Kazuo Shimokawa ,  Takashi Koyanagawa ,  Masako Ooishi ,  Tatsuya Yamada ,  Osamu Usuda ,  Yoshiki Endo ,  Taiki Miura ,  Masaki Toyoshima ,  Ichiro Omura ,  Akio Nakagawa ,  Kenichi Matsushita ,  Yusuke Kawaguchi ,  Haruki Arai ,  Hiroshi Takei ,  Tomohiro Kawano ,  Noriaki Yoshikawa ,  Morio Takahashi ,  Yasuhito Saito ,  Masahiro Urase

IPC分类号： H03D13/00

CPC分类号： H01L23/3121 ,  H01L21/565 ,  H01L23/36 ,  H01L23/367 ,  H01L23/4822 ,  H01L23/49805 ,  H01L23/49844 ,  H01L24/16 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/84 ,  H01L25/0655 ,  H01L25/165 ,  H01L29/4175 ,  H01L29/7802 ,  H01L29/7806 ,  H01L29/7809 ,  H01L29/7813 ,  H01L29/7835 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/371 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/40225 ,  H01L2224/73153 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12032 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A semiconductor module comprises a mounting board. A plurality of power switching device chips are mounted on the mounting board by flip-chip bonding. The chip has an upper surface and a lower surface and is configured to face the upper surface toward the mounting board. A drive IC chip is mounted on the mounting board by flip-chip bonding. The drive IC chip is operative to drive gates of transistors formed in the plurality of power switching device chips. A plurality of heat sink members are located on the lower surfaces of the plurality of power switching device chips, respectively. A resinous member is provided to seal the plurality of power switching device chips and the drive IC chip in a single package.

公开(公告)号：US07514783B2

公开(公告)日：2009-04-07

申请号：US11214730

申请日：2005-08-31

申请人： Kazuo Shimokawa ,  Takashi Koyanagawa ,  Masako Ooishi ,  Tatsuya Yamada ,  Osamu Usuda ,  Yoshiki Endo ,  Taiki Miura ,  Masaki Toyoshima ,  Ichiro Omura ,  Akio Nakagawa ,  Kenichi Matsushita ,  Yusuke Kawaguchi ,  Haruki Arai ,  Hiroshi Takei ,  Tomohiro Kawano ,  Noriaki Yoshikawa ,  Morio Takahashi ,  Yasuhito Saito ,  Masahiro Urase

发明人： Kazuo Shimokawa ,  Takashi Koyanagawa ,  Masako Ooishi ,  Tatsuya Yamada ,  Osamu Usuda ,  Yoshiki Endo ,  Taiki Miura ,  Masaki Toyoshima ,  Ichiro Omura ,  Akio Nakagawa ,  Kenichi Matsushita ,  Yusuke Kawaguchi ,  Haruki Arai ,  Hiroshi Takei ,  Tomohiro Kawano ,  Noriaki Yoshikawa ,  Morio Takahashi ,  Yasuhito Saito ,  Masahiro Urase

IPC分类号： H01L23/34

CPC分类号： H01L23/3121 ,  H01L21/565 ,  H01L23/36 ,  H01L23/367 ,  H01L23/4822 ,  H01L23/49805 ,  H01L23/49844 ,  H01L24/16 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/84 ,  H01L25/0655 ,  H01L25/165 ,  H01L29/4175 ,  H01L29/7802 ,  H01L29/7806 ,  H01L29/7809 ,  H01L29/7813 ,  H01L29/7835 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/371 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/40225 ,  H01L2224/73153 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12032 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A semiconductor module comprises a mounting board. A plurality of power switching device chips are mounted on the mounting board by flip-chip bonding. The chip has an upper surface and a lower surface and is configured to face the upper surface toward the mounting board. A drive IC chip is mounted on the mounting board by flip-chip bonding. The drive IC chip is operative to drive gates of transistors formed in the plurality of power switching device chips. A plurality of heat sink members are located on the lower surfaces of the plurality of power switching device chips, respectively. A resinous member is provided to seal the plurality of power switching device chips and the drive IC chip in a single package.

公开(公告)号：US20070257708A1

公开(公告)日：2007-11-08

申请号：US11778516

申请日：2007-07-16

申请人： Kazuo Shimokawa ,  Takashi Koyanagawa ,  Masako Ooishi ,  Tatsuya Yamada ,  Osamu Usuda ,  Yoshiki Endo ,  Taiki Miura ,  Masaki Toyoshima ,  Ichiro Omura ,  Akio Nakagawa ,  Kenichi Matsushita ,  Yusuke Kawaguchi ,  Haruki Arai ,  Hiroshi Takei ,  Tomohiro Kawano ,  Noriaki Yoshikawa ,  Morio Takahashi ,  Yasuhito Saito ,  Masahiro Urase

发明人： Kazuo Shimokawa ,  Takashi Koyanagawa ,  Masako Ooishi ,  Tatsuya Yamada ,  Osamu Usuda ,  Yoshiki Endo ,  Taiki Miura ,  Masaki Toyoshima ,  Ichiro Omura ,  Akio Nakagawa ,  Kenichi Matsushita ,  Yusuke Kawaguchi ,  Haruki Arai ,  Hiroshi Takei ,  Tomohiro Kawano ,  Noriaki Yoshikawa ,  Morio Takahashi ,  Yasuhito Saito ,  Masahiro Urase

IPC分类号： H03D13/00

CPC分类号： H01L23/3121 ,  H01L21/565 ,  H01L23/36 ,  H01L23/367 ,  H01L23/4822 ,  H01L23/49805 ,  H01L23/49844 ,  H01L24/16 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/84 ,  H01L25/0655 ,  H01L25/165 ,  H01L29/4175 ,  H01L29/7802 ,  H01L29/7806 ,  H01L29/7809 ,  H01L29/7813 ,  H01L29/7835 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/371 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/40225 ,  H01L2224/73153 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12032 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A semiconductor module comprises a mounting board. A plurality of power switching device chips are mounted on the mounting board by flip-chip bonding. The chip has an upper surface and a lower surface and is configured to face the upper surface toward the mounting board. A drive IC chip is mounted on the mounting board by flip-chip bonding. The drive IC chip is operative to drive gates of transistors formed in the plurality of power switching device chips. A plurality of heat sink members are located on the lower surfaces of the plurality of power switching device chips, respectively. A resinous member is provided to seal the plurality of power switching device chips and the drive IC chip in a single package.

摘要翻译： 半导体模块包括安装板。 多个电源开关器件芯片通过倒装芯片接合安装在安装板上。 芯片具有上表面和下表面，并且被配置为面向安装板的上表面。 通过倒装芯片接合将驱动IC芯片安装在安装板上。 驱动IC芯片用于驱动形成在多个功率开关器件芯片中的晶体管的栅极。 多个散热构件分别位于多个功率开关器件芯片的下表面上。 提供树脂构件以将单个封装中的多个功率开关器件芯片和驱动IC芯片密封。

公开(公告)号：US20070257376A1

公开(公告)日：2007-11-08

申请号：US11778493

申请日：2007-07-16

申请人： Kazuo Shimokawa ,  Takashi Koyanagawa ,  Masako Ooishi ,  Tatsuya Yamada ,  Osamu Usuda ,  Yoshiki Endo ,  Taiki Miura ,  Masaki Toyoshima ,  Ichiro Omura ,  Akio Nakagawa ,  Kenichi Matsushita ,  Yusuke Kawaguchi ,  Haruki Arai ,  Hiroshi Takei ,  Tomohiro Kawano ,  Noriaki Yoshikawa ,  Morio Takahashi ,  Yasuhito Saito ,  Masahiro Urase

发明人： Kazuo Shimokawa ,  Takashi Koyanagawa ,  Masako Ooishi ,  Tatsuya Yamada ,  Osamu Usuda ,  Yoshiki Endo ,  Taiki Miura ,  Masaki Toyoshima ,  Ichiro Omura ,  Akio Nakagawa ,  Kenichi Matsushita ,  Yusuke Kawaguchi ,  Haruki Arai ,  Hiroshi Takei ,  Tomohiro Kawano ,  Noriaki Yoshikawa ,  Morio Takahashi ,  Yasuhito Saito ,  Masahiro Urase

IPC分类号： H01L23/48

CPC分类号： H01L23/3121 ,  H01L21/565 ,  H01L23/36 ,  H01L23/367 ,  H01L23/4822 ,  H01L23/49805 ,  H01L23/49844 ,  H01L24/16 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/84 ,  H01L25/0655 ,  H01L25/165 ,  H01L29/4175 ,  H01L29/7802 ,  H01L29/7806 ,  H01L29/7809 ,  H01L29/7813 ,  H01L29/7835 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/371 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/40225 ,  H01L2224/73153 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12032 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A semiconductor module comprises a mounting board. A plurality of power switching device chips are mounted on the mounting board by flip-chip bonding. The chip has an upper surface and a lower surface and is configured to face the upper surface toward the mounting board. A drive IC chip is mounted on the mounting board by flip-chip bonding. The drive IC chip is operative to drive gates of transistors formed in the plurality of power switching device chips. A plurality of heat sink members are located on the lower surfaces of the plurality of power switching device chips, respectively. A resinous member is provided to seal the plurality of power switching device chips and the drive IC chip in a single package.

公开(公告)号：US20070028955A1

公开(公告)日：2007-02-08

申请号：US11494529

申请日：2006-07-28

申请人： Takahiro Sogou ,  Kazuki Tateyama ,  Hiroyoshi Hanada ,  Yasuhito Saito ,  Masayuki Arakawa ,  Naruhito Kondo ,  Osamu Tsuneoka ,  Naokazu Iwanade

发明人： Takahiro Sogou ,  Kazuki Tateyama ,  Hiroyoshi Hanada ,  Yasuhito Saito ,  Masayuki Arakawa ,  Naruhito Kondo ,  Osamu Tsuneoka ,  Naokazu Iwanade

IPC分类号： H01L35/00

CPC分类号： H01L35/32 ,  H01L35/10 ,  H05K1/0204 ,  H05K1/0373 ,  H05K1/056 ,  H05K2201/066 ,  H05K2201/10219

摘要： There is provided a thermoelectric device capable of improving a power generation performance while keeping a hermetic sealing after a heat cycle is applied, and also achieving simplification of a structure and improvement in productivity and reliability of a device by reducing the number of articles, and a method of manufacturing the same. A thermoelectric device, includes a metal substrate 2, a thermoelectric element 3 mounted on a center portion of a surface of the metal substrate 2, a metal lid 4 for covering an upper surface and side surfaces of the thermoelectric element 3, and a joining metal member 5 provided to a peripheral portion of a surface of the metal substrate 2 to hermetically seal a space between the metal substrate 2 and the lid 4.

摘要翻译： 提供了一种能够在施加热循环之后保持气密密封的同时提高发电性能的热电装置，并且通过减少物品的数量也实现了结构的简化和设备的生产率和可靠性的提高，并且 制造方法 热电装置包括金属基板2，安装在金属基板2的表面的中心部分的热电元件3，用于覆盖热电元件3的上表面和侧面的金属盖4和接合金属 构件5设置在金属基板2的表面的周边部分，以密封金属基板2和盖4之间的空间。

公开(公告)号：US20050211288A1

公开(公告)日：2005-09-29

申请号：US11069952

申请日：2005-03-03

申请人： Kazuki Tateyama ,  Takahiro Sogou ,  Tomohiro Iguchi ,  Hiroyoshi Hanada ,  Yasuhito Saito ,  Masayuki Arakawa ,  Naruhito Kondo ,  Osamu Tsuneoka

发明人： Kazuki Tateyama ,  Takahiro Sogou ,  Tomohiro Iguchi ,  Hiroyoshi Hanada ,  Yasuhito Saito ,  Masayuki Arakawa ,  Naruhito Kondo ,  Osamu Tsuneoka

IPC分类号： H01L35/06 ,  H01L35/04 ,  H01L35/32 ,  H02N11/00 ,  H01L35/28 ,  H01L35/34 ,  H01L37/00

CPC分类号： H01L35/32 ,  H01L35/04

摘要： In a thermoelectric device, metal fiber nets as conductive members having elasticity are placed between first electrodes and thermoelectric elements, in order to increase productivity and make it possible to reduce variations in performance without impairing the reliability of a slidable structure even if each component is heated to be thermally deformed. This placement prevents the temperature of the metal fiber nets from becoming high in the operation of the thermoelectric device and prevents the elasticity of the metal fiber nets from being lost. Further, this constitution eliminates the necessity for bonding the first electrodes to the thermoelectric elements using solder. Moreover, the elasticity of the metal fiber nets makes it possible to accommodate variations in height among the respective thermoelectric elements when the thermoelectric device is assembled.

摘要翻译： 在热电装置中，作为具有弹性的导电构件的金属纤维网设置在第一电极和热电元件之间，以便提高生产率，并且即使各组件被加热，也可能降低可滑动结构的可靠性而降低性能的变化 被热变形。 该布置防止金属纤维网的温度在热电装置的操作中变高，并且防止金属纤维网的弹性损失。 此外，该结构消除了使用焊料将第一电极与热电元件接合的必要性。 此外，当组装热电装置时，金属纤维网的弹性使得可以适应各热电元件之间的高度变化。

公开(公告)号：US20100101619A1

公开(公告)日：2010-04-29

申请号：US12652063

申请日：2010-01-05

申请人： Takahiro SOGOU ,  Kazuki Tateyama ,  Hiroyoshi Hanada ,  Yasuhito Saito ,  Masayuki Arakawa ,  Naruhito Kondo ,  Osamu Tsuneoka ,  Naokazu Iwanade

发明人： Takahiro SOGOU ,  Kazuki Tateyama ,  Hiroyoshi Hanada ,  Yasuhito Saito ,  Masayuki Arakawa ,  Naruhito Kondo ,  Osamu Tsuneoka ,  Naokazu Iwanade

IPC分类号： H01L35/00

CPC分类号： H01L35/32 ,  H01L35/10 ,  H05K1/0204 ,  H05K1/0373 ,  H05K1/056 ,  H05K2201/066 ,  H05K2201/10219

摘要： There is provided a thermoelectric device capable of improving a power generation performance while keeping a hermetic sealing after a heat cycle is applied, and also achieving simplification of a structure and improvement in productivity and reliability of a device by reducing the number of articles, and a method of manufacturing the same.A thermoelectric device, includes a metal substrate 2, a thermoelectric element 3 mounted on a center portion of a surface of the metal substrate 2, a metal lid 4 for covering an upper surface and side surfaces of the thermoelectric element 3, and a joining metal member 5 provided to a peripheral portion of a surface of the metal substrate 2 to hermetically seal a space between the metal substrate 2 and the lid 4.

摘要翻译： 提供了一种能够在施加热循环之后保持气密密封的同时提高发电性能的热电装置，并且通过减少物品的数量也实现了结构的简化和设备的生产率和可靠性的提高，并且 制造方法 热电装置包括金属基板2，安装在金属基板2的表面的中心部分的热电元件3，用于覆盖热电元件3的上表面和侧面的金属盖4和接合金属 构件5设置在金属基板2的表面的周边部分，以密封金属基板2和盖4之间的空间。

公开(公告)号：US20080163916A1

公开(公告)日：2008-07-10

申请号：US11876399

申请日：2007-10-22

申请人： Osamu Tsuneoka ,  Naruhito Kondo ,  Akihiro Hara ,  Kazuki Tateyama ,  Takahiro Sogou ,  Yasuhito Saito ,  Masayuki Arakawa

发明人： Osamu Tsuneoka ,  Naruhito Kondo ,  Akihiro Hara ,  Kazuki Tateyama ,  Takahiro Sogou ,  Yasuhito Saito ,  Masayuki Arakawa

IPC分类号： H01L35/28 ,  H01L35/02 ,  F25B21/02

CPC分类号： H01L35/32

摘要： According to one embodiment, a thermoelectric conversion module includes a thermoelectric conversion portion, a first external electrode, and a second external electrode. The thermoelectric conversion portion includes a single thermoelectric conversion portion element, or electrically connected thermoelectric conversion portion elements. The thermoelectric conversion portion element includes a high temperature electrode, low temperature electrodes, and an n-type and a p-type thermoelectric conversion semiconductor layer disposed between the high temperature electrode and the low temperature electrodes. The first and the second external electrode are electrically connected to one of the low temperature electrode and another one of the low temperature electrode respectively. The first external electrode and the second external electrode are disposed opposite each other with the thermoelectric conversion portion therebetween in such a manner that the centerlines of the first and second external electrodes are aligned substantially in line with each other.

摘要翻译： 根据一个实施例，热电转换模块包括热电转换部分，第一外部电极和第二外部电极。 热电转换部包括单个热电转换部元件或电连接的热电转换部元件。 热电转换部元件包括高温电极，低温电极以及设置在高温电极和低温电极之间的n型和p型热电转换半导体层。 第一外部电极和第二外部电极分别电连接到低温电极和低温电极中的一个。 第一外部电极和第二外部电极以其中的热电转换部分彼此相对设置，使得第一和第二外部电极的中心线基本上彼此对齐。

公开(公告)号：US20070256427A1

公开(公告)日：2007-11-08

申请号：US11694073

申请日：2007-03-30

申请人： Kazuki Tateyama ,  Takahiro Sogou ,  Tomohiro Iguchi ,  Yasuhito Saito ,  Masayuki Arakawa ,  Naruhito Kondo ,  Osamu Tsuneoka ,  Akihiro Hara

发明人： Kazuki Tateyama ,  Takahiro Sogou ,  Tomohiro Iguchi ,  Yasuhito Saito ,  Masayuki Arakawa ,  Naruhito Kondo ,  Osamu Tsuneoka ,  Akihiro Hara

IPC分类号： F25B21/02

CPC分类号： H01L35/06 ,  H01L35/30 ,  H01L35/32 ,  H01L35/34 ,  H05K1/0204 ,  H05K2201/10219 ,  Y10T29/49002 ,  Y10T29/4913 ,  Y10T29/49144

摘要： In order to provide a highly reliable thermoelectric device, in a thermoelectric device, a plurality of heat-radiating-side electrodes, arranged in accordance with positions where respective thermoelectric elements are to be arranged, are arrayed in an array fashion on a planer surface of a heat-radiating-side board. Heat-radiating-side end surfaces of the plurality of p-type thermoelectric elements and n-type thermoelectric elements and the heat-radiating-side electrodes are joined together by solders. Heat-absorbing-side electrodes are brought into sliding contact with heat-absorbing-side end surfaces of these thermoelectric elements.

摘要翻译： 为了提供高度可靠的热电装置，在热电装置中，按照各个热电元件的位置排列的多个散热侧电极排列成阵列方式在平面的 散热侧板。 多个p型热电元件和n型热电元件和散热侧电极的散热侧端面通过焊料接合在一起。 吸热侧电极与这些热电元件的吸热侧端面滑动接触。