公开(公告)号：US20070103939A1

公开(公告)日：2007-05-10

申请号：US11383753

申请日：2006-05-16

申请人： Teng-Huei Huang ,  Chu-Ping Fan ,  Chien-Lung Lee

发明人： Teng-Huei Huang ,  Chu-Ping Fan ,  Chien-Lung Lee

IPC分类号： F21V7/04

CPC分类号： G02B6/0078 ,  G02B6/0068 ,  G02F1/133603 ,  G02F1/133608 ,  G02F2001/133612

摘要： A sectional light emitting diode backlight unit comprising a circuit board, a frame disposed on the circuit board, a plurality of light emitting diode dies disposed on the circuit board inside the frame, each light emitting diode die being electrically connected to a circuit on the circuit board, a plurality of connecting pads disposed on a first side of the circuit board outside the frame, the connecting pads being electrically connected to a circuit on the circuit board, and an encapsulating material positioned on the circuit board inside the frame to cover the light emitting diode dies; wherein at least one second side of the circuit board has a connection means for connecting to another sectional light emitting diode backlight unit.

摘要翻译： 一种分段发光二极管背光单元，包括电路板，设置在电路板上的框架，设置在框架内的电路板上的多个发光二极管管芯，每个发光二极管管芯电连接到电路上的电路 多个连接焊盘，其设置在所述电路板外部的所述第一侧上，所述连接焊盘电连接到所述电路板上的电路;以及密封材料，位于所述电路板内部以覆盖所述光 发光二极管管芯; 其中所述电路板的至少一个第二侧具有用于连接到另一分段发光二极管背光单元的连接装置。

公开(公告)号：US07288798B2

公开(公告)日：2007-10-30

申请号：US10908977

申请日：2005-06-02

申请人： Chih-Chin Chang ,  Teng-Huei Huang ,  Chien-Lung Lee

发明人： Chih-Chin Chang ,  Teng-Huei Huang ,  Chien-Lung Lee

IPC分类号： H01L29/22

CPC分类号： H01L33/648 ,  F21K9/00 ,  H01L25/0753 ,  H01L33/50 ,  H01L2224/48247 ,  H01L2924/181 ,  H01L2924/00012

摘要： Disclosed herein is a light module comprising a substrate, at least one light-emitting element on the substrate, a sealing cap on the substrate and covering the light-emitting elements, and a fluid in the space formed among the sealing cap, the light-emitting elements, and the substrate, such that heat dissipation is fast and yellowing of the encapsulating material is retarded.

摘要翻译： 这里公开了一种光模块，其包括基板，基板上的至少一个发光元件，基板上的密封盖和覆盖发光元件，以及形成在密封盖之间的空间中的流体， 发光元件和基板，使得散热快速且封装材料变黄延迟。

公开(公告)号：US20060091403A1

公开(公告)日：2006-05-04

申请号：US10906573

申请日：2005-02-24

申请人： Chih-Chin Chang ,  Teng-Huei Huang ,  Chien-Lung Lee

发明人： Chih-Chin Chang ,  Teng-Huei Huang ,  Chien-Lung Lee

IPC分类号： H01L33/00 ,  H01L29/06 ,  H01L23/02 ,  H01L31/12 ,  H01L29/22

CPC分类号： H01L33/642 ,  H01L33/486 ,  H01L33/641 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2924/181 ,  H01L2924/00012

摘要： An LED module and method of packing the same are provided. The LED module includes a substrate with at least one cavity therein, at least one LED unit positioned on portions of the substrate in the cavity, a circuit positioned above the LED unit and electrically connected to the LED unit, and a first capsulation material filling within the cavity.

摘要翻译： 提供LED模块及其包装方法。 LED模块包括其中具有至少一个空腔的衬底，位于空腔中的衬底的部分上的至少一个LED单元，位于LED单元上方并电连接到LED单元的电路，以及填充在LED单元内的第一封装材料 空腔。

公开(公告)号：US07270446B2

公开(公告)日：2007-09-18

申请号：US10908339

申请日：2005-05-09

申请人： Chih-Chin Chang ,  Teng-Huei Huang ,  Chien-Lung Lee

发明人： Chih-Chin Chang ,  Teng-Huei Huang ,  Chien-Lung Lee

IPC分类号： F21V29/00

CPC分类号： F21V29/70 ,  F21K9/00 ,  F21S45/47 ,  F21V29/51 ,  F21V29/763 ,  F21V29/77 ,  F21V29/773 ,  F21V29/85 ,  F21V29/89 ,  F21Y2115/10 ,  H01L33/642 ,  H01L33/648 ,  Y10S362/80

摘要： A light module comprises a light unit, a heat transferring plate or a plurality of heat transferring pipes, and a plurality of heat dissipating fins. The heat transferring plate or heat transferring pipes are positioned on the bottom surface of the light unit to transfer heat generated by the light unit. When the heat transferring plate is used, the heat dissipating fins are arranged under the heat transferring plate and perpendicular to the bottom surface of the heat transferring plate. The heat dissipating fins have a recess for the accommodation of the heat transferring plate and the light unit. When the heat transferring pipes are used, the heat dissipating fins each contact the heat transferring pipes. Uniform heat dissipation is thus attained.

摘要翻译： 光模块包括光单元，传热板或多个传热管，以及多个散热翅片。 传热板或传热管位于灯单元的底表面上，以传递由光单元产生的热量。 当使用传热板时，散热片布置在传热板的下面并垂直于传热板的底表面。 散热翅片具有用于容纳传热板和灯单元的凹部。 当使用传热管时，散热片各接触传热管。 从而达到均匀散热。

公开(公告)号：US20060250800A1

公开(公告)日：2006-11-09

申请号：US10908339

申请日：2005-05-09

申请人： Chih-Chin Chang ,  Teng-Huei Huang ,  Chien-Lung Lee

发明人： Chih-Chin Chang ,  Teng-Huei Huang ,  Chien-Lung Lee

IPC分类号： F21V29/00

CPC分类号： F21V29/70 ,  F21K9/00 ,  F21S45/47 ,  F21V29/51 ,  F21V29/763 ,  F21V29/77 ,  F21V29/773 ,  F21V29/85 ,  F21V29/89 ,  F21Y2115/10 ,  H01L33/642 ,  H01L33/648 ,  Y10S362/80

摘要： A light module comprises a light unit, a heat transferring plate or a plurality of heat transferring pipes, and a plurality of heat dissipating fins. The heat transferring plate or heat transferring pipes are positioned on the bottom surface of the light unit to transfer heat generated by the light unit. When the heat transferring plate is used, the heat dissipating fins are arranged under the heat transferring plate and perpendicular to the bottom surface of the heat transferring plate. The heat dissipating fins have a recess for the accommodation of the heat transferring plate and the light unit. When the heat transferring pipes are used, the heat dissipating fins each contact the heat transferring pipes. Uniform heat dissipation is thus attained.

摘要翻译： 光模块包括光单元，传热板或多个传热管，以及多个散热翅片。 传热板或传热管位于灯单元的底表面上，以传递由光单元产生的热量。 当使用传热板时，散热片布置在传热板的下面并垂直于传热板的底表面。 散热翅片具有用于容纳传热板和灯单元的凹部。 当使用传热管时，散热片各接触传热管。 从而达到均匀散热。

公开(公告)号：US07115911B2

公开(公告)日：2006-10-03

申请号：US10906573

申请日：2005-02-24

申请人： Chih-Chin Chang ,  Teng-Huei Huang ,  Chien-Lung Lee

发明人： Chih-Chin Chang ,  Teng-Huei Huang ,  Chien-Lung Lee

IPC分类号： H01L27/15

CPC分类号： H01L33/642 ,  H01L33/486 ,  H01L33/641 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2924/181 ,  H01L2924/00012

摘要： An LED module and method of packing the same are provided. The LED module includes a substrate with at least one cavity therein, at least one LED unit positioned on portions of the substrate in the cavity, a circuit positioned above the LED unit and electrically connected to the LED unit, and a first capsulation material filling within the cavity.

摘要翻译： 提供LED模块及其包装方法。 LED模块包括其中具有至少一个空腔的衬底，位于空腔中的衬底的部分上的至少一个LED单元，位于LED单元上方并电连接到LED单元的电路，以及填充在LED单元内的第一封装材料 空腔。

公开(公告)号：US20060274524A1

公开(公告)日：2006-12-07

申请号：US10908977

申请日：2005-06-02

申请人： Chih-Chin Chang ,  Teng-Huei Huang ,  Chien-Lung Lee

发明人： Chih-Chin Chang ,  Teng-Huei Huang ,  Chien-Lung Lee

IPC分类号： F21V9/00

CPC分类号： H01L33/648 ,  F21K9/00 ,  H01L25/0753 ,  H01L33/50 ,  H01L2224/48247 ,  H01L2924/181 ,  H01L2924/00012

摘要： Disclosed herein is a light module comprising a substrate, at least one light-emitting element on the substrate, a sealing cap on the substrate and covering the light-emitting elements, and a fluid in the space formed among the sealing cap, the light-emitting elements, and the substrate, such that heat dissipation is fast and yellowing of the encapsulating material is retarded.

摘要翻译： 这里公开了一种光模块，其包括基板，基板上的至少一个发光元件，基板上的密封盖和覆盖发光元件，以及形成在密封盖之间的空间中的流体， 发光元件和基板，使得散热快速且封装材料变黄延迟。

公开(公告)号：US20070284605A1

公开(公告)日：2007-12-13

申请号：US11518936

申请日：2006-09-12

申请人： Ying-Tso Chen ,  Teng-Huei Huang

发明人： Ying-Tso Chen ,  Teng-Huei Huang

IPC分类号： H01L33/00

CPC分类号： H01L25/167 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49113 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： A casting adapted to carry a light emitting diode die and an anti-static die is disclosed. The casting comprises two electrodes for opposite electrodes and a wall. The light emitting diode die is mounted one of electrodes and the anti-static die is mounted on the other electrode. The wall is arranged between the light emitting diode die and the anti-static die. Further, the height of the wall is larger than that of the anti-static die to shade the anti-static die, whereby reflecting the light emitted from the light emitting diode die. Therefore, the reflection ratio of the light emitting diode die is improved, and the intensity generated by the whole light emitting diode is also improved.

摘要翻译： 公开了一种适用于承载发光二极管管芯和抗静电管芯的铸件。 铸件包括用于相对电极和壁的两个电极。 发光二极管管芯安装在电极之一中，防静电管芯安装在另一个电极上。 壁布置在发光二极管管芯和防静电管芯之间。 此外，壁的高度大于防静电模具的高度以遮蔽防静电模具，从而反射从发光二极管管芯发射的光。 因此，发光二极管管芯的反射率提高，并且由整个发光二极管产生的强度也得到改善。

公开(公告)号：US20060012988A1

公开(公告)日：2006-01-19

申请号：US10710265

申请日：2004-06-30

申请人： Hsiang-Cheng Hsieh ,  Teng-Huei Huang

发明人： Hsiang-Cheng Hsieh ,  Teng-Huei Huang

IPC分类号： F21V9/00

CPC分类号： H01L25/167 ,  H01L25/0753 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/00

摘要： A fine-tunable RGB mixing LED has a red LED unit electrically connected to a first embedded variable resistor, a green LED unit electrically connected to a second embedded variable resistor, and a blue LED unit electrically connected to a third embedded variable resistor. The spectrum of the RGB mixing LED can be fine-tuned using a laser to trim the first, second and/or third embedded variable resistors.

摘要翻译： 微调RGB混合LED具有电连接到第一嵌入式可变电阻器的红色LED单元，电连接到第二嵌入式可变电阻器的绿色LED单元和电连接到第三嵌入式可变电阻器的蓝色LED单元。 可以使用激光器对RGB混合LED的频谱进行微调，以修整第一，第二和/或第三嵌入式可变电阻器。

公开(公告)号：US20070063213A1

公开(公告)日：2007-03-22

申请号：US11230574

申请日：2005-09-21

申请人： Hsiang-Cheng Hsieh ,  Teng-Huei Huang ,  Wen-Lung Su

发明人： Hsiang-Cheng Hsieh ,  Teng-Huei Huang ,  Wen-Lung Su

IPC分类号： H01L33/00

CPC分类号： H01L25/0753 ,  H01L33/50 ,  H01L33/58 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49113 ,  H01L2924/00014 ,  H01L2924/00

摘要： A package allowing agile deployment of the location of each LED chip includes a heat slug to secure multiple LED chips, two lead frames, a conducting area extending along the edge of the heat slug, and a non-conductive material that connects the heat slug and the lead frame for those multiple LED chips to connect to the conducting area by means of a gold wire without being subject to the presence of the lead frame.

摘要翻译： 允许敏捷地部署每个LED芯片的位置的包装包括散热块以固定多个LED芯片，两个引线框架，沿着热块的边缘延伸的导电区域以及将热段和 这些多个LED芯片的引线框架通过金线连接到导电区域而不会引起引线框架的存在。