公开(公告)号：US4528223A

公开(公告)日：1985-07-09

申请号：US315057

申请日：1981-10-26

申请人： Tetsuo Kumazawa ,  Hiroaki Doi ,  Yasuo Miyadera ,  Atsushi Fujioka ,  Tadashi Nagai

发明人： Tetsuo Kumazawa ,  Hiroaki Doi ,  Yasuo Miyadera ,  Atsushi Fujioka ,  Tadashi Nagai

IPC分类号： D04B1/14 ,  D02G3/04 ,  D02G3/18 ,  D02G3/44 ,  D03D15/12 ,  D04B1/16 ,  D07B1/02 ,  D03D15/00

CPC分类号： D02G3/447 ,  D02G3/047 ,  D10B2101/06 ,  Y10S428/902 ,  Y10T428/1314 ,  Y10T428/2929 ,  Y10T428/2964 ,  Y10T428/2969 ,  Y10T428/298 ,  Y10T442/438 ,  Y10T442/604 ,  Y10T442/608

摘要： Composite fibrous products such as composite cloth, composite strings, composite knitted goods, etc., produced by using combination yarns obtained by twisting one or more aromatic polyamide continuous filament yarns and one or more continuous glass yarns have high rigidity and excellent reinforcing effects.

摘要翻译： 通过使用通过加捻一种或多种芳族聚酰胺连续长丝纱线和一种或多种连续玻璃纱线而获得的组合纱线制成的复合纤维制品，例如复合布，复合线，复合针织物等具有高刚性和优异的增强效果。

公开(公告)号：US07230320B2

公开(公告)日：2007-06-12

申请号：US10628443

申请日：2003-07-29

申请人： Hiroaki Doi ,  Noriyoshi Urushiwara ,  Akira Matsushita

发明人： Hiroaki Doi ,  Noriyoshi Urushiwara ,  Akira Matsushita

IPC分类号： H01L23/498 ,  H01L25/16 ,  H01L23/48 ,  H01L23/495

CPC分类号： H01L23/49861 ,  H01L23/49531 ,  H01L23/49568 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/165 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： In an electronic circuit device including a substrate including a front surface on which an electronic circuit element is mounted and a reverse surface opposite to the front surface in a thickness direction of the substrate, an electrically conductive terminal member electrically connected to the electronic circuit element, a lead frame extending perpendicular to the thickness direction to face the reverse surface in the thickness direction, and a sealing resin covering at least partially the electronic circuit element, substrate and lead frame while at least a part of the electrically conductive terminal member is prevented from being covered by the sealing resin, the substrate extends to project outward from an end of the lead frame in a transverse direction perpendicular to the thickness direction while the end of the lead frame is covered by the sealing resin.

摘要翻译： 在包括基板的电子电路装置中，所述基板包括安装有电子电路元件的前表面和在所述基板的厚度方向上与所述前表面相对的反面，所述导电端子构件电连接到所述电子电路元件， 引导框架，其垂直于厚度方向延伸以在厚度方向上面向反面;以及密封树脂，其至少部分地覆盖电子电路元件，基板和引线框架，同时防止导电端子构件的至少一部分 被密封树脂​​覆盖的情况下，基板从垂直于厚度方向的横向方向从引线框架的端部向外突出，同时引线框架的端部被密封树脂​​覆盖。

公开(公告)号：US06889516B2

公开(公告)日：2005-05-10

申请号：US10625640

申请日：2003-07-24

申请人： Kaname Sasaki ,  Hiroaki Doi ,  Haruki Hamada ,  Masaaki Hayashi ,  Ryuichi Saito

发明人： Kaname Sasaki ,  Hiroaki Doi ,  Haruki Hamada ,  Masaaki Hayashi ,  Ryuichi Saito

IPC分类号： H05K7/20 ,  B60L3/00 ,  F01P1/06 ,  F01P3/12 ,  F01P3/20 ,  H02K9/02 ,  H02K9/04 ,  H02K9/19 ,  H02M7/48 ,  F25D23/12

CPC分类号： F01P3/20 ,  F01P1/06 ,  F01P3/12 ,  F01P2025/46 ,  F01P2050/24 ,  F01P2050/30 ,  H02K9/04 ,  H02K9/19

摘要： A cooling system for a motor is prevented from exhibiting a thermal fatigue failure due to a temperature cycle. The operation or stopping of the cooling motor fan 6 of the forced cooling system is controlled using the difference between the temperature thereof and the operation start temperature Tis of the power converter 3. Thus expansion of the temperature range is suppressed.

摘要翻译： 防止电动机的冷却系统由于温度循环而发生热疲劳失效。 强制冷却系统的冷却电动机风扇6的运转或停止，是利用电力转换器3的温度和运转开始温度Tis的差来控制的。 因此抑制了温度范围的膨胀。

公开(公告)号：US06265784B1

公开(公告)日：2001-07-24

申请号：US09437266

申请日：1999-11-10

申请人： Kenya Kawano ,  Hiroaki Doi ,  Akio Yasukawa ,  Hideo Miura

发明人： Kenya Kawano ,  Hiroaki Doi ,  Akio Yasukawa ,  Hideo Miura

IPC分类号： H01L2300

CPC分类号： H01L21/563 ,  H01L24/32 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/83859 ,  H01L2224/83951 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/05599

摘要： A resin sealed semiconductor device is provided with an organic resin wiring substrate, an LSI chip having a semiconductor integrated circuit and mounted in a bare chip package form to the organic resin wiring substrate through a plurality of electrical bonding members, and a resin charged into a gap portion between the organic resin wiring substrate and the LSI chip. In this resin sealed semiconductor device, a modulus of longitudinal elasticity of the resin to be charged, its coefficient of linear thermal expansion and its fillet shape are optimized. The resin charged is also preferably colored in black to minimize adverse effects of visible rags on the LSI chip.

摘要翻译： 树脂密封半导体器件具有有机树脂布线基板，具有半导体集成电路的LSI芯片，并且通过多个电接合部件以裸芯片封装形式安装到有机树脂布线基板，并且将树脂装入 有机树脂布线基板和LSI芯片之间的间隙部分。 在这种树脂密封半导体器件中，优化被充电树脂的纵向弹性模量，线性热膨胀系数和圆角形状。 充电的树脂还优选用黑色着色，以尽可能减少LSI芯片上的可见抹布的不良影响。