EFFICIENT DISSOCIATION OF WATER VAPOR IN ARRAYS OF MICROCHANNEL PLASMA DEVICES
    5.
    发明申请
    EFFICIENT DISSOCIATION OF WATER VAPOR IN ARRAYS OF MICROCHANNEL PLASMA DEVICES 审中-公开
    水蒸汽在微波等离子体装置阵列中的有效分解

    公开(公告)号:US20160327310A1

    公开(公告)日:2016-11-10

    申请号:US15150107

    申请日:2016-05-09

    IPC分类号: F24H1/18 B01J19/08 C01B3/04

    摘要: The invention provides methods and systems for water dissociation with microplasma generated in microchannel plasma arrays or chips. Preferred methods and systems introduce water vapor into a microchannel plasma array. Electrical power is applied to the microchannel plasma array to create a plasma chemical reaction of the water vapor in the micorchannel plasma array. Dissociated hydrogen and/or oxygen gas is collected at an output of the microchannel plasma array. The water vapor can be entrained in a carrier gas, but is preferably introduced without carrier gas. Direct introduction of water vapor has been demonstrated to provide efficiencies at an above 60%. The use of carrier gas reduces efficiency, but still exceeds efficiencies of prior methods discussed in the background.

    摘要翻译: 本发明提供了在微通道等离子体阵列或芯片中产生的用于水解离的微生物的方法和系统。 优选的方法和系统将水蒸气引入微通道等离子体阵列。 将电功率施加到微通道等离子体阵列以产生微通道等离子体阵列中的水蒸气的等离子体化学反应。 在微通道等离子体阵列的输出处收集离解的氢和/或氧气。 水蒸汽可以夹带在载气中,但优选在没有载气的情况下引入。 已经证明直接引入水蒸汽提供了高于60%的效率。 载气的使用降低了效率,但是仍然超过了在背景技术中讨论的现有方法的效率。

    ENCAPSULATED METAL MICROTIP MICROPLASMA DEVICE AND ARRAY FABRICATION METHODS
    9.
    发明申请
    ENCAPSULATED METAL MICROTIP MICROPLASMA DEVICE AND ARRAY FABRICATION METHODS 有权
    包覆金属微孔微波器件和阵列制造方法

    公开(公告)号:US20130337718A1

    公开(公告)日:2013-12-19

    申请号:US13971443

    申请日:2013-08-20

    IPC分类号: H01T21/00

    摘要: Methods of the invention can form microtip microplasma devices having the first and second metal microtips and metal oxide in a monolithic, unitary structure. Methods can form arrays that can be flexible, can be arranged in stacks, and can be formed into cylinders, for example, for gas and liquid processing devices, air filters and other applications. A preferred method of forming an array of microtip microplasma devices provides a metal mesh with an array of micro openings therein. Electrode areas of the metal mesh are masked leaving planned connecting metal oxide areas of the metal mesh unmasked. Planned connecting metal oxide areas are electrochemically etched to convert the planned connecting metal oxide areas to metal oxide that encapsulates opposing metal microtips therein. The mask is removed. The electrode areas are electrochemically etched to encapsulate the electrode areas in metal oxide.

    摘要翻译: 本发明的方法可以形成具有第一和第二金属微尖端和金属氧化物的单片,整体结构的微尖端微型装置。 方法可以形成可以是柔性的阵列,可以堆叠布置,并且可以形成为例如气体和液体处理装置,空气过滤器等应用的气缸。 形成微尖锐微量器件阵列的优选方法提供了金属网,其中具有微孔开口阵列。 金属网的电极区域被掩蔽,留下金属网的计划连接的金属氧化物区域未被掩蔽。 计算的连接金属氧化物区域进行电化学蚀刻,以将计划的连接金属氧化物区域转换成在其中封装相对的金属微尖端的金属氧化物。 去除面具。 电化学蚀刻电极区域以将电极区域包封在金属氧化物中。

    Efficient dissociation of water vapor in arrays of microchannel plasma devices

    公开(公告)号:US10240815B2

    公开(公告)日:2019-03-26

    申请号:US15150107

    申请日:2016-05-09

    摘要: The invention provides methods and systems for water dissociation with microplasma generated in microchannel plasma arrays or chips. Preferred methods and systems introduce water vapor into a microchannel plasma array. Electrical power is applied to the microchannel plasma array to create a plasma chemical reaction of the water vapor in the microchannel plasma array. Dissociated hydrogen and/or oxygen gas is collected at an output of the microchannel plasma array. The water vapor can be entrained in a carrier gas, but is preferably introduced without carrier gas. Direct introduction of water vapor has been demonstrated to provide efficiencies at an above 60%. The use of carrier gas reduces efficiency, but still exceeds efficiencies of prior methods discussed in the background.