LOW TEMPERATURE SEGMENTED COPOLYMER COMPOSITIONS AND METHODS
    6.
    发明申请
    LOW TEMPERATURE SEGMENTED COPOLYMER COMPOSITIONS AND METHODS 有权
    低温SEGMENTED共聚物组合物和方法

    公开(公告)号:US20150133602A1

    公开(公告)日:2015-05-14

    申请号:US14602279

    申请日:2015-01-22

    IPC分类号: C08G18/61 C08L83/10 C08G18/73

    摘要: There is provided a method of synthesizing a segmented copolymer that includes mixing one or more α,ω (alpha, omega) amine or α,ω (alpha, omega) hydroxyl terminated polysiloxane first soft segments having an average molecular weight of between about 2500 grams per mole to about 10,000 grams per mole, and one or more diisocyanate species, together to form a first reaction product; mixing the first reaction product and one or more low molecular weight diol or diamine chain extenders each having an average molecular weight of less than 400 grams per mole, together in a solvent to form a segmented copolymer; and, removing the solvent.

    摘要翻译: 提供了一种合成分段共聚物的方法,其包括混合一种或多种α,ω(α,ω)胺或α,ω(α,ω)羟基封端的聚硅氧烷,平均分子量为约2500克 每摩尔至约10,000克/摩尔,和一种或多种二异氰酸酯物质一起形成第一反应产物; 将第一反应产物和平均分子量小于400克/摩尔的一种或多种低分子量二醇或二胺增链剂一起在溶剂中混合以形成分段共聚物; 并除去溶剂。

    Electromagnetic interference shielding panels and associated methods

    公开(公告)号:US10856455B1

    公开(公告)日:2020-12-01

    申请号:US16562303

    申请日:2019-09-05

    IPC分类号: H05K9/00 B64D47/00

    摘要: Electromagnetic interference (EMI) shielding panels and associated methods. An EMI shielding panel includes a binding matrix material and electrically conductive elements distributed throughout the binding matrix material. The electrically conductive elements are aligned such that conductive element longitudinal axes of the electrically conductive elements are at least substantially parallel to a shielding axis of the EMI shielding panel. The electrically conductive elements are configured to at least partially attenuate an incident electromagnetic wave that is incident upon the EMI shielding panel. A method of forming an EMI shielding panel includes providing a shielding mixture that includes electrically conductive elements distributed throughout an uncured binding matrix material, magnetically aligning the electrically conductive elements, and curing the binding matrix material to form the EMI shielding panel.