公开(公告)号：US20050284917A1

公开(公告)日：2005-12-29

申请号：US11166534

申请日：2005-06-24

Applicant: Thomas Clare ,  Andre Cote ,  Eric Eckstein

Inventor： Thomas Clare ,  Andre Cote ,  Eric Eckstein

IPC: B21D39/00 ,  B23K20/00 ,  B23K31/02 ,  B23K37/00 ,  G06K19/077

CPC classification number: H01L24/81 ,  B23K20/004 ,  B23K2101/32 ,  B23K2101/40 ,  G06K19/07718 ,  G06K19/07745 ,  G06K19/07749 ,  G06K19/0775 ,  H01L21/67132 ,  H01L23/49855 ,  H01L24/75 ,  H01L24/83 ,  H01L2223/6677 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/75 ,  H01L2224/78 ,  H01L2224/81121 ,  H01L2224/81801 ,  H01L2224/83851 ,  H01L2224/85 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01054 ,  H01L2924/01057 ,  H01L2924/01061 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19043 ,  Y10T156/12 ,  H01L2924/00 ,  H01L2224/29075 ,  H01L2924/00014

Abstract: A method and apparatus for bonding integrated circuits uniquely suited to high volume tag production is described, where conductive material of a substrate at the die-attach-area is cut before an IC chip or transponder is placed on the conductive material over the cut and bonded. The apparatus performs the method of placing a first chip on a substrate having a conductive layer, measuring the location of the first chip on the substrate, cutting the conductive layer at a location of an expected subsequently placed chip to form a cut based on the measured location of the first chip, and placing the subsequently placed chip on the substrate over the cut.

Abstract translation: 描述了用于接合独特地适用于大容量标签生产的集成电路的方法和装置，其中在芯片附着区域之前的基板的导电材料在将IC芯片或应答器放置在切割和粘合的导电材料之前被切割 。 该装置执行将第一芯片放置在具有导电层的基板上的方法，测量基板上的第一芯片的位置，在期望的随后放置的芯片的位置处切割导电层，以基于测量的 第一芯片的位置，并将随后放置的芯片放置在切口上的基板上。

公开(公告)号：US20070018824A1

公开(公告)日：2007-01-25

申请号：US11457890

申请日：2006-07-17

Applicant: Thomas Clare ,  Andre Cote

Inventor： Thomas Clare ,  Andre Cote

IPC: G08B13/14

CPC classification number: G06K19/07718 ,  G06K19/07749 ,  G06K19/07752 ,  G06K19/07779 ,  G06K19/07783 ,  G06K19/07786 ,  H01L2224/16225 ,  H01L2224/16227

Abstract: A method for installing an RFID tag on shipping articles includes applying a strip of conductive material to the surface of the article and providing an RFID chip having a body, a first bottom conductive point, a second bottom conductive point and a nonconductive fin between the first bottom conductive point and the second bottom conductive point. The fin is received in the shipping article. The RFID chip is attached to the shipping article by inserting the chip onto the strip of conductive material on the shipping article such that the fin severs the strip into a first strip and a second strip. The first bottom conductive point is electrically attached to the first strip and the second bottom conductive point is electrically attached to the second strip.

Abstract translation: 一种用于在运送物品上安装RFID标签的方法包括将导电材料条施加到制品的表面，并提供具有主体，第一底部导电点，第二底部导电点和非导电鳍片的RFID芯片，其在第一 底部导电点和第二底部导电点。 散货在货运文章中收到。 将RFID芯片通过将芯片插入到运输制品上的导电材料条上而连接到运输制品，使得翅片将条切割成第一条带和第二条带。 第一底部导电点电连接到第一条带，并且第二底部导电点电连接到第二条带。

公开(公告)号：US20050184872A1

公开(公告)日：2005-08-25

申请号：US10996939

申请日：2004-11-24

Applicant: Thomas Clare ,  Andre Cote

Inventor： Thomas Clare ,  Andre Cote

IPC: G08B13/14

CPC classification number: G06Q30/0283 ,  Y10T29/49004 ,  Y10T29/49117 ,  Y10T29/49133 ,  Y10T156/10

Abstract: A method for processing a surface of an item and providing an association using a surface processing system includes receiving an item having a first identification marking on a surface of the item to provide a received item for providing a first identification signal in response to a first interrogation signal and applying a second identification marking to the surface of the item for providing a second identification signal in response to a second interrogation signal. At least one of the first and second interrogation signals is applied to the item to provide at least one of the first and second identification signals. At least one of the first and second identification signals is received in response to the at least one of the first and second interrogation signals. An association is made is determined in response to the first receiving.

Abstract translation: 一种用于处理物品的表面并使用表面处理系统提供关联的方法包括在物品的表面上接收具有第一标识标记的物品，以提供响应于第一询问提供第一识别信号的接收物品 信号并将第二识别标记应用于物品的表面，以响应于第二询问信号提供第二识别信号。 第一和第二询问信号中的至少一个被施加到该项目以提供第一和第二识别信号中的至少一个。 响应于第一和第二询问信号中的至少一个接收第一和第二识别信号中的至少一个。 响应于首次接收确定关联。

公开(公告)号：US20120286938A1

公开(公告)日：2012-11-15

申请号：US13468759

申请日：2012-05-10

Applicant: Andre Cote ,  Edmund S. Nabrotzky

Inventor： Andre Cote ,  Edmund S. Nabrotzky

IPC: G06K19/073 ,  G06K7/01

CPC classification number: G06K19/07707 ,  G06K19/0702 ,  G06Q10/08

Abstract: RFID driven display system components such as wireless displays (visual RFID tags) and multi-antenna wireless RFID readers that monitor/control the RFID driven displays in order to provide visual real-time information to display viewers and/or provide useful information to a central processing station that monitors the status of and/or updates the RFID driven displays, networks including one or more of the components, and methods for using the RFID driven display system components to monitor assets in applications such as inventory control and manufacturing.

公开(公告)号：USD644590S1

公开(公告)日：2011-09-06

申请号：US29336086

申请日：2009-04-28

Applicant: Andre Cote ,  Steve Tetreault ,  Luc Lapointe ,  Alexandre Curthelet ,  Jacques Mayrand ,  Alex Miklosi

Designer： Andre Cote ,  Steve Tetreault ,  Luc Lapointe ,  Alexandre Curthelet ,  Jacques Mayrand ,  Alex Miklosi

公开(公告)号：USD636323S1

公开(公告)日：2011-04-19

申请号：US29352527

申请日：2009-12-22

Applicant: Andre Cote

Designer： Andre Cote

公开(公告)号：US20100218899A1

公开(公告)日：2010-09-02

申请号：US12759400

申请日：2010-04-13

Applicant: Thomas J. Clare ,  Andre Cote ,  Eric Eckstein

Inventor： Thomas J. Clare ,  Andre Cote ,  Eric Eckstein

IPC: B32B41/00 ,  B32B37/00 ,  B23K37/04 ,  B29C65/00

CPC classification number: H01L24/81 ,  B23K20/004 ,  B23K2101/32 ,  B23K2101/40 ,  G06K19/07718 ,  G06K19/07745 ,  G06K19/07749 ,  G06K19/0775 ,  H01L21/67132 ,  H01L23/49855 ,  H01L24/75 ,  H01L24/83 ,  H01L2223/6677 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/75 ,  H01L2224/78 ,  H01L2224/81121 ,  H01L2224/81801 ,  H01L2224/83851 ,  H01L2224/85 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01054 ,  H01L2924/01057 ,  H01L2924/01061 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19043 ,  Y10T156/12 ,  H01L2924/00 ,  H01L2224/29075 ,  H01L2924/00014

Abstract: A method and apparatus for bonding integrated circuits uniquely suited to high volume tag production is described, where conductive material of a substrate at the die-attach-area is cut before an IC chip or transponder is placed on the conductive material over the cut and bonded. The apparatus performs the method of placing a first chip on a substrate having a conductive layer, measuring the location of the first chip on the substrate, cutting the conductive layer at a location of an expected subsequently placed chip to form a cut based on the measured location of the first chip, and placing the subsequently placed chip on the substrate over the cut.

Abstract translation: 描述了用于接合独特地适用于大容量标签制造的集成电路的方法和装置，其中在芯片附着区域之前的基板的导电材料在将IC芯片或应答器放置在切割和粘合的导电材料之前被切割 。 该装置执行将第一芯片放置在具有导电层的基板上的方法，测量基板上的第一芯片的位置，在预期的随后放置的芯片的位置处切割导电层，以基于测量的 第一芯片的位置，并将随后放置的芯片放置在切口上的基板上。

公开(公告)号：US07709294B2

公开(公告)日：2010-05-04

申请号：US11166534

申请日：2005-06-24

Applicant: Thomas J. Clare ,  Andre Cote ,  Eric Eckstein

Inventor： Thomas J. Clare ,  Andre Cote ,  Eric Eckstein

IPC: H01L21/00 ,  B23K20/00

CPC classification number: H01L24/81 ,  B23K20/004 ,  B23K2101/32 ,  B23K2101/40 ,  G06K19/07718 ,  G06K19/07745 ,  G06K19/07749 ,  G06K19/0775 ,  H01L21/67132 ,  H01L23/49855 ,  H01L24/75 ,  H01L24/83 ,  H01L2223/6677 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/75 ,  H01L2224/78 ,  H01L2224/81121 ,  H01L2224/81801 ,  H01L2224/83851 ,  H01L2224/85 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01054 ,  H01L2924/01057 ,  H01L2924/01061 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19043 ,  Y10T156/12 ,  H01L2924/00 ,  H01L2224/29075 ,  H01L2924/00014

Abstract: A method and apparatus for bonding integrated circuits uniquely suited to high volume tag production is described, where conductive material of a substrate at the die-attach-area is cut before an IC chip or transponder is placed on the conductive material over the cut and bonded. The apparatus performs the method of placing a first chip on a substrate having a conductive layer, measuring the location of the first chip on the substrate, cutting the conductive layer at a location of an expected subsequently placed chip to form a cut based on the measured location of the first chip, and placing the subsequently placed chip on the substrate over the cut.

Abstract translation: 描述了用于接合独特地适用于大容量标签制造的集成电路的方法和装置，其中在芯片附着区域之前的基板的导电材料在将IC芯片或应答器放置在切割和粘合的导电材料之前被切割 。 该装置执行将第一芯片放置在具有导电层的基板上的方法，测量基板上的第一芯片的位置，在预期的随后放置的芯片的位置处切割导电层，以基于测量的 第一芯片的位置，并将随后放置的芯片放置在切口上的基板上。

公开(公告)号：US07646304B2

公开(公告)日：2010-01-12

申请号：US11400932

申请日：2006-04-10

Applicant: Andre Cote ,  Detlef Duschek

Inventor： Andre Cote ,  Detlef Duschek

IPC: G08B13/14

CPC classification number: G06K19/07749 ,  G06K19/07718 ,  G06K19/0775 ,  G08B13/2414 ,  G08B13/2417 ,  G08B13/2437 ,  H01L21/4853 ,  H01L21/6835 ,  H01L23/49855 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68345 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/838 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01072 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/30105 ,  Y10T29/4913

Abstract: A method for efficiently producing a plurality of EAS or RFID tags or inlays that form a label ready for use. The process utilizes a first web of RFID chip straps or capacitor straps that are releasably secured to a liner using only a low tack adhesive and utilizes a second web of coils or antennas which are secured to a second liner. After indexing these two webs, selective heat and pressure are applied to the chips straps or to the capacitor straps to transfer them and electrically couple them to a corresponding coil or antenna. Where both chip straps and capacitor straps are applied to a common antenna, a third web of the additional strap is used in the process.

Abstract translation: 一种用于有效地生产形成准备使用的标签的多个EAS或RFID标签或嵌体的方法。 该方法利用RFID芯片带或电容器带的第一网片，其可释放地仅使用低粘性粘合剂固定到衬垫，并且利用固定到第二衬垫的线圈或天线的第二腹板。 在分离这两个网之后，将选择性的热和压力施加到芯片带或电容器带上以传送它们并将它们电耦合到相应的线圈或天线。 在将芯片带和电容器带都应用于公共天线的情况下，在该过程中使用附加带的第三网。

公开(公告)号：US07564360B2

公开(公告)日：2009-07-21

申请号：US11679250

申请日：2007-02-27

Applicant: Andre Cote ,  Farrokh Abadi

Inventor： Andre Cote ,  Farrokh Abadi

IPC: G08B13/14

CPC classification number: G01V15/00 ,  E05B73/0017 ,  G08B13/2434

Abstract: A releasable security tag for attachment to an article of merchandise includes: a locking mechanism with a release for attaching the tag to the article of merchandise; an EAS resonant circuit or an RFID circuit for responding to a first RF signal at a predetermined frequency corresponding to the resonant circuit or to the RFID circuit; an ambient RF energy harvesting circuit; a release signal detection circuit coupled to and powered by the ambient RF energy harvesting circuit and an electro-mechanical actuator electrically coupled to the release signal detection circuit. The electro-mechanical actuator releases the locking mechanism whenever the release signal detection circuit receives a release signal.

Abstract translation: 用于附接到商品的可释放的安全标签包括：具有用于将标签附接到商品的释放的锁定机构; 用于响应于对应于谐振电路或RFID电路的预定频率的第一RF信号的EAS谐振电路或RFID电路; 环境RF能量收集电路; 耦合到环境RF能量收集电路并由其供电的释放信号检测电路和电耦合到释放信号检测电路的机电致动器。 每当释放信号检测电路接收释放信号时，机电执行器释放锁定机构。