摘要:
A plate heat exchanger includes a heat exchanger block having a plurality of heat exchange passages. On the heat exchanger block, a header is mounted that extends over at least one part of one side of the heat exchanger block and establishes a flow connection between the heat exchange passages. The plate heat exchanger is provided with a fluid connection, which is formed by the header-side end of a pipeline. The fluid connection is essentially perpendicular to the side of the heat exchanger block over which the header extends. Within the pipeline directly in front of the header, there is a flow guide.
摘要:
A method for providing interlocking strained silicon on a silicon substrate, comprises providing a mask on a surface of the substrate. The mask comprises a first plurality of openings corresponding to a first plurality of holes to be etched and comprises a second plurality of openings corresponding to a second plurality of holes to be etched. The surface of the substrate is etched through the mask to form the first and second pluralities of holes. A first strain type material is deposited into the first plurality of holes to form a plurality of first strain type portions. A plurality of second strain type portions are formed at the second plurality of holes.
摘要:
In a plate heat exchanger having a heat exchanger block (1) with a number of heat exchange passages and a header (2) attached to the heat exchanger block, the header providing a flow connection between a portion of the heat exchange passages and a fluid connection (3), the header is defined by a cylinder jacket segment-shaped wall (7) and by a flat surface (12), which runs parallel to the axis of the cylinder (13) on a side (5) of the heat exchanger block. The length of the header extends over at least one portion of a side (5) of the heat exchanger block. At least one wall (7) of the header is connected to the side (5) of the heat exchanger block. The header is designed so that the axis (13) of the cylinder runs inside the header spaced at a distance (11) from the flat surface (12).
摘要:
In a method for producing a semiconductor structure a substrate is provided, a dielectric layer comprising at least one metal oxide is formed on the substrate, and a nitrided layer is formed from the dielectric layer. The nitrided layer comprises either at least one metal nitride corresponding to the metal oxide or a metal oxynitride. The nitrided layer is removed selectively with respect to the dielectric layer in a predetermined etching medium.
摘要:
A method for producing a dielectric layer on a substrate made of a conductive substrate material includes reducing a leakage current that flows through defects of the dielectric layer at least by a self-aligning and self-limiting electrochemical conversion of the conductive substrate material into a nonconductive substrate follow-up material in sections of the substrate that are adjacent to the defects. Also provided is a configuration including a dielectric layer with defects, a substrate made of a conductive substrate material, and reinforcement regions made of the nonconductive substrate follow-up material in sections adjacent to the defects.
摘要:
An electrical component, such as a DRAM semiconductor memory or a field-effect transistor is fabricated. At least one capacitor having a dielectric (130) and at least one connection electrode (120, 140) are fabricated. To enable the capacitors fabricated to have optimum storage properties even for very small capacitor structures, the dielectric (130) or the connection electrode (120, 140) are formed in such a manner that transient polarization effects are prevented or at least reduced.
摘要:
The invention relates to a method for producing a plate heat exchanger from a plurality of heat exchanger blocks (1a, 1b). Each heat exchanger block (1a, 1b) has mounted on it a header (6a, 7a, 6b, 7b) which extends over at least part of one side of the heat exchanger block (1a, 1b). The heat exchanger blocks (1a, 1b) are arranged next to one another, and the headers (6a, 6b; 7a, 7b) of two adjacent heat exchanger blocks (1a, 1b) are provided on their mutually confronting sides with orifices and are connected to one another in such a way that a flow connection occurs between the two headers (6a, 6b; 7a, 7b).
摘要:
In a process chamber of a process reactor, a sequential gas phase deposition (ALD, atomic layer deposition) of two or more precursors fed in by means of process gases is controlled. The process chamber is connected to an auxiliary chamber for a change of precursor and so the precursor to be removed is rarefied in the process chamber, so that a process duration of the sequential gas phase deposition that is determined by a change of precursor is reduced.
摘要:
The invention provides a method for fabricating a memory cell, a substrate (101) being provided, a trench-type depression (102) being etched into the substrate (101), a barrier layer (103) being deposited non-conformally in the trench-type depression (102), grain elements (104) being grown on the inner areas of the trench-type depression (102), a dielectric layer (202) being deposited on the surfaces of the grain elements and the inner areas of the trench-type depression, and a conduction layer being deposited on the dielectric layer, the grain elements (104) growing selectively on the inner areas (105) of the trench-type depression (102) in an electrode region (301) forming a lower region of the trench-type depression (102) and an amorphous silicon layer continuing to grow in a collar region (302) forming an upper region of the trench-type depression (102).
摘要:
The invention relates to a bath condenser with a condenser block (1) that has evaporation passages (8) for a liquid and liquefaction passages (2) for a heating medium. The condenser block (1) has at least two circulation sections (7) that are located on top of one another, the evaporation passages (8) each having on the lower end of a circulation section (7) at least one entry opening (9) for the liquid and on the upper end of the circulation section (7) at least one exit opening (10). Only exit openings (10) and entry openings (9) that are located on the same side (12) of the condenser block (1) are connected via means (17, 30) for routing the liquid.