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    Device and system for heat spreader with controlled thermal expansion
    1.
    发明授权
    Device and system for heat spreader with controlled thermal expansion 失效
    具有受控热膨胀的散热器的装置和系统

    公开(公告)号：US07081669B2

    公开(公告)日：2006-07-25

    申请号：US10726558

    申请日：2003-12-04

    申请人： Thomas J. Fitzgerald ,  Carl Deppisch ,  Fay Hua

    发明人： Thomas J. Fitzgerald ,  Carl Deppisch ,  Fay Hua

    IPC分类号： H01L23/10 ,  H01L23/34

    CPC分类号： H01L23/42 ,  H01L21/563 ,  H01L23/36 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Devices and systems including a heat spreader with possibly controlled thermal expansion. For example, an integral heat spreader may include an insert formed of a high thermal conductivity material with a first coefficient of thermal expansion, and a ring formed of a stiff material with a second coefficient of thermal expansion, wherein the second coefficient of thermal expansion is smaller or significantly smaller than the first coefficient of thermal expansion. An integral heat spreader may optionally include, for example, a plating, a coating, or a patch, and may be included, for example, in a semiconductor device.

    摘要翻译： 装置和系统包括具有可控制的热膨胀的散热器。 例如，整体散热器可以包括由具有第一热膨胀系数的高导热材料形成的插入件和由具有第二热膨胀系数的刚性材料形成的环，其中第二热膨胀系数为 小于或明显小于第一热膨胀系数。 整体散热器可以任选地包括例如电镀，涂层或贴片，并且可以包括在例如半导体器件中。

    COMPOSITE SOLDER TIM FOR ELECTRONIC PACKAGE
    2.
    发明申请
    COMPOSITE SOLDER TIM FOR ELECTRONIC PACKAGE 有权
    电子包装复合焊枪

    公开(公告)号：US20100259890A1

    公开(公告)日：2010-10-14

    申请号：US12822951

    申请日：2010-06-24

    申请人： Tom Fitzgerald ,  Carl Deppisch ,  Fay Hua

    发明人： Tom Fitzgerald ,  Carl Deppisch ,  Fay Hua

    IPC分类号： G06F1/20 ,  H05K7/20 ,  H01B1/02

    CPC分类号： C22C21/00 ,  B23K35/0244 ,  B23K35/24 ,  B23K35/286 ,  B23K35/40 ,  C22C28/00 ,  H01L23/42 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/16152 ,  H01L2924/00 ,  H01L2224/0401

    摘要： A method includes providing a mixture of molten indium and molten aluminum, and agitating the mixture while reducing its temperature until the aluminum changes from liquid phase to solid phase, forming particles distributed within the molten indium. Agitation of the mixture sufficiently to maintain the aluminum substantially suspended in the molten aluminum continues while further reducing the temperature of the mixture until the indium changes from a liquid phase to a solid phase. A metallic composition is formed, including indium and particles of aluminum suspended within the indium, the aluminum particles being substantially free from oxidation.The metallic (solder) composition can be used to form an assembly, including an integrated circuit (IC) device, at least a first thermal component disposed adjacent to the IC device, and a solder TIM interposed between and thermally coupled with each of the IC device and the first thermal component.

    摘要翻译： 一种方法包括提供熔融铟和熔融铝的混合物，并搅拌混合物同时降低其温度，直到铝从液相变成固相，形成分布在熔融铟内的颗粒。 使混合物充分搅拌以保持铝基本上悬浮在熔融铝中，同时进一步降低混合物的温度，直到铟从液相变成固相。 形成金属组合物，其包括铟和悬浮在铟内的铝颗粒，铝颗粒基本上没有氧化。 金属（焊料）组合物可以用于形成包括集成电路（IC）装置的组件，至少设置在IC器件附近的第一热分量，以及夹在每个IC之间并热耦合的焊料TIM 装置和第一热元件。

    Composite solder TIM for electronic package
    3.
    发明申请
    Composite solder TIM for electronic package 有权
    复合焊料TIM用于电子封装

    公开(公告)号：US20080090405A1

    公开(公告)日：2008-04-17

    申请号：US11540027

    申请日：2006-09-29

    申请人： Tom Fitzgerald ,  Carl Deppisch ,  Fay Hua

    发明人： Tom Fitzgerald ,  Carl Deppisch ,  Fay Hua

    IPC分类号： H01L21/44

    CPC分类号： C22C21/00 ,  B23K35/0244 ,  B23K35/24 ,  B23K35/286 ,  B23K35/40 ,  C22C28/00 ,  H01L23/42 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/16152 ,  H01L2924/00 ,  H01L2224/0401

    摘要： A method includes providing a mixture of molten indium and molten aluminum, and agitating the mixture while reducing its temperature until the aluminum changes from liquid phase to solid phase, forming particles distributed within the molten indium. Agitation of the mixture sufficiently to maintain the aluminum substantially suspended in the molten aluminum continues while further reducing the temperature of the mixture until the indium changes from a liquid phase to a solid phase. A metallic composition is formed, including indium and particles of aluminum suspended within the indium, the aluminum particles being substantially free from oxidation.The metallic (solder) composition can be used to form an assembly, including an integrated circuit (IC) device, at least a first thermal component disposed adjacent to the IC device, and a solder TIM interposed between and thermally coupled with each of the IC device and the first thermal component.

    摘要翻译： 一种方法包括提供熔融铟和熔融铝的混合物，并搅拌混合物同时降低其温度，直到铝从液相变成固相，形成分布在熔融铟内的颗粒。 使混合物充分搅拌以保持铝基本上悬浮在熔融铝中，同时进一步降低混合物的温度，直到铟从液相变成固相。 形成金属组合物，其包括铟和悬浮在铟内的铝颗粒，铝颗粒基本上没有氧化。 金属（焊料）组合物可以用于形成包括集成电路（IC）装置的组件，至少设置在IC器件附近的第一热分量，以及夹在每个IC之间并热耦合的焊料TIM 装置和第一热元件。

    DEVICE AND SYSTEM FOR HEAT SPREADER WITH CONTROLLED THERMAL EXPANSION
    4.
    发明申请
    DEVICE AND SYSTEM FOR HEAT SPREADER WITH CONTROLLED THERMAL EXPANSION 失效
    具有受控热膨胀的散热器的装置和系统

    公开(公告)号：US20050121775A1

    公开(公告)日：2005-06-09

    申请号：US10726558

    申请日：2003-12-04

    申请人： Thomas Fitzgerald ,  Carl Deppisch ,  Fay Hua

    发明人： Thomas Fitzgerald ,  Carl Deppisch ,  Fay Hua

    IPC分类号： H01L21/56 ,  H01L23/10 ,  H01L23/36 ,  H01L23/42

    CPC分类号： H01L23/42 ,  H01L21/563 ,  H01L23/36 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Devices and systems including a heat spreader with possibly controlled thermal expansion. For example, an integral heat spreader may include an insert formed of a high thermal conductivity material with a first coefficient of thermal expansion, and a ring formed of a stiff material with a second coefficient of thermal expansion, wherein the second coefficient of thermal expansion is smaller or significantly smaller than the first coefficient of thermal expansion. An integral heat spreader may optionally include, for example, a plating, a coating, or a patch, and may be included, for example, in a semiconductor device.

    摘要翻译： 装置和系统包括具有可控制的热膨胀的散热器。 例如，整体散热器可以包括由具有第一热膨胀系数的高热导率材料形成的插入件和由具有第二热膨胀系数的刚性材料形成的环，其中第二热膨胀系数为 小于或明显小于第一热膨胀系数。 整体散热器可以任选地包括例如电镀，涂层或贴片，并且可以包括在例如半导体器件中。

    DEVICE AND METHOD FOR PACKAGE WARP COMPENSATION IN AN INTEGRATED HEAT SPREADER
    5.
    发明申请
    DEVICE AND METHOD FOR PACKAGE WARP COMPENSATION IN AN INTEGRATED HEAT SPREADER 有权
    一体化热交换器中的包装温度补偿的装置和方法

    公开(公告)号：US20070020813A1

    公开(公告)日：2007-01-25

    申请号：US11470209

    申请日：2006-09-05

    申请人： Thomas Fitzgerald ,  Carl Deppisch ,  Fay Hua

    发明人： Thomas Fitzgerald ,  Carl Deppisch ,  Fay Hua

    IPC分类号： H01L21/00

    CPC分类号： H01L23/42 ,  H01L21/563 ,  H01L23/367 ,  H01L23/3735 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/16152 ,  H01L2924/3511 ,  Y10T29/49 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144

    摘要： A device and method for designing and manufacturing an integrated heat spreader so that the integrated heat spreader will have a flat surface on which to mount a heat sink after being assembled into a package and exposed to the heat of a die. This device and method for designing and manufacturing an integrated heat spreader would generate a heat spreader that would be built compensate for deformations resulting from (1) physical manipulation during assembly (2) thermal gradients during operation and (3) differing rates of expansion and contraction of the package materials coupled with multiple package assembly steps at elevated temperatures so that one surface of the integrated heat spreader would have a flat shape.

    摘要翻译： 一种用于设计和制造集成散热器的装置和方法，使得集成的散热器将具有平坦表面，在将其组装成封装件并暴露于模具的热量之后，将散热器安装在该平面上。 这种用于设计和制造集成散热器的装置和方法将产生散热器，该散热器将补偿由（1）装配期间的物理操作（2）运行期间的热梯度和（3）不同的膨胀和收缩速率导致的变形 的包装材料在高温下与多个包装组装步骤相结合，使得一体式散热器的一个表面将具有平坦的形状。

    Composite solder TIM for electronic package
    6.
    发明授权
    Composite solder TIM for electronic package 有权
    复合焊料TIM用于电子封装

    公开(公告)号：US07816250B2

    公开(公告)日：2010-10-19

    申请号：US11540027

    申请日：2006-09-29

    申请人： Tom Fitzgerald ,  Carl Deppisch ,  Fay Hua

    发明人： Tom Fitzgerald ,  Carl Deppisch ,  Fay Hua

    IPC分类号： H01L21/208 ,  H01L33/62

    CPC分类号： C22C21/00 ,  B23K35/0244 ,  B23K35/24 ,  B23K35/286 ,  B23K35/40 ,  C22C28/00 ,  H01L23/42 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/16152 ,  H01L2924/00 ,  H01L2224/0401

    摘要： A method includes providing a mixture of molten indium and molten aluminum, and agitating the mixture while reducing its temperature until the aluminum changes from liquid phase to solid phase, forming particles distributed within the molten indium. Agitation of the mixture sufficiently to maintain the aluminum substantially suspended in the molten aluminum continues while further reducing the temperature of the mixture until the indium changes from a liquid phase to a solid phase. A metallic composition is formed, including indium and particles of aluminum suspended within the indium, the aluminum particles being substantially free from oxidation.The metallic (solder) composition can be used to form an assembly, including an integrated circuit (IC) device, at least a first thermal component disposed adjacent to the IC device, and a solder TIM interposed between and thermally coupled with each of the IC device and the first thermal component.

    摘要翻译： 一种方法包括提供熔融铟和熔融铝的混合物，并搅拌混合物同时降低其温度，直到铝从液相变成固相，形成分布在熔融铟内的颗粒。 使混合物充分搅拌以保持铝基本上悬浮在熔融铝中，同时进一步降低混合物的温度，直到铟从液相变成固相。 形成金属组合物，其包括铟和悬浮在铟内的铝颗粒，铝颗粒基本上没有氧化。 金属（焊料）组合物可以用于形成包括集成电路（IC）装置的组件，至少设置在IC器件附近的第一热分量，以及夹在每个IC之间并热耦合的焊料TIM 装置和第一热元件。

    Composite solder TIM for electronic package
    9.
    发明授权
    Composite solder TIM for electronic package 有权
    复合焊料TIM用于电子封装

    公开(公告)号：US08242602B2

    公开(公告)日：2012-08-14

    申请号：US12822951

    申请日：2010-06-24

    申请人： Tom Fitzgerald ,  Carl Deppisch ,  Fay Hua

    发明人： Tom Fitzgerald ,  Carl Deppisch ,  Fay Hua

    IPC分类号： H01L23/488

    CPC分类号： C22C21/00 ,  B23K35/0244 ,  B23K35/24 ,  B23K35/286 ,  B23K35/40 ,  C22C28/00 ,  H01L23/42 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/16152 ,  H01L2924/00 ,  H01L2224/0401

    摘要： A method includes providing a mixture of molten indium and molten aluminum, and agitating the mixture while reducing its temperature until the aluminum changes from liquid phase to solid phase, forming particles distributed within the molten indium. Agitation of the mixture sufficiently to maintain the aluminum substantially suspended in the molten aluminum continues while further reducing the temperature of the mixture until the indium changes from a liquid phase to a solid phase. A metallic composition is formed, including indium and particles of aluminum suspended within the indium, the aluminum particles being substantially free from oxidation.The metallic (solder) composition can be used to form an assembly, including an integrated circuit (IC) device, at least a first thermal component disposed adjacent to the IC device, and a solder TIM interposed between and thermally coupled with each of the IC device and the first thermal component.

    摘要翻译： 一种方法包括提供熔融铟和熔融铝的混合物，并搅拌混合物同时降低其温度，直到铝从液相变成固相，形成分布在熔融铟内的颗粒。 使混合物充分搅拌以保持铝基本上悬浮在熔融铝中，同时进一步降低混合物的温度，直到铟从液相变成固相。 形成金属组合物，其包括铟和悬浮在铟内的铝颗粒，铝颗粒基本上没有氧化。 金属（焊料）组合物可以用于形成包括集成电路（IC）装置的组件，至少设置在IC器件附近的第一热分量，以及夹在每个IC之间并热耦合的焊料TIM 装置和第一热元件。