公开(公告)号：US08552460B2

公开(公告)日：2013-10-08

申请号：US13227703

申请日：2011-09-08

申请人： Thomas Murphy ,  Andreas Hase ,  Matthias Heschel

发明人： Thomas Murphy ,  Andreas Hase ,  Matthias Heschel

IPC分类号： H01L33/00

CPC分类号： H01L23/60 ,  H01L24/48 ,  H01L25/167 ,  H01L33/486 ,  H01L33/58 ,  H01L33/60 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16195 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A high-brightness LED module includes a substrate with a recess in which a light emitting element is mounted. The recess is defined by a sidewalls and a relatively thin membrane. At least two micro-vias are provided in the membrane and include conductive material that passes through the membrane. A p-contact of the light emitting element is coupled to a first micro-via and an n-contact of the light emitting element is coupled to a second micro-via.

摘要翻译： 高亮度LED模块包括具有安装有发光元件的凹部的基板。 凹槽由侧壁和相对薄的膜限定。 在膜中提供至少两个微通孔并且包括穿过膜的导电材料。 发光元件的p接触耦合到第一微通孔，并且发光元件的n接触件耦合到第二微通孔。

公开(公告)号：US20070063336A1

公开(公告)日：2007-03-22

申请号：US11521828

申请日：2006-09-15

申请人： Andreas Hase

发明人： Andreas Hase

IPC分类号： H01L23/04

CPC分类号： H01L24/11 ,  B81C1/00333 ,  H01L23/04 ,  H01L23/10 ,  H01L23/13 ,  H01L23/481 ,  H01L23/49805 ,  H01L23/49811 ,  H01L24/03 ,  H01L24/48 ,  H01L24/49 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/11614 ,  H01L2224/291 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/81801 ,  H01L2224/83801 ,  H01L2224/83851 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1532 ,  H01L2924/161 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/166 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A leadless package and method for manufacturing silicon based leadless QFN/SON compatible packages are described. In addition the package allows for hermetic sealing of devices while maintaining electrical and optical access. Micro-vias with feed-through metallization through a silicon structure facilitates a surface mount technology-compatible silicon package with bottom SMT pads and top surface device integration. Sloped edges on the SMT side enable solder filleting for post solder inspection. Hermetic seal can be attained for example using anodic bonding of a glass lid or using metal soldering. Metal soldering enables the use of solder bumps to provide electrical connections for the package to the lid with integrated device functionality used for sealing. Hermetically sealed silicon packages eliminates the need for an extra packaging layer required in plastic packages and provides a standard interface for enclosing one or more discrete devices.

摘要翻译： 描述了一种用于制造基于硅的无引脚QFN / SON兼容封装的无引线封装和方法。 此外，该封装允许在保持电和光学访问的同时对器件进行气密密封。 通过硅结构进行直通金属化的微通孔有利于具有底部SMT焊盘和顶部表面器件集成的表面贴装技术兼容的硅封装。 SMT侧边缘的边缘可以进行焊锡切割以进行焊后检测。 例如使用玻璃盖的阳极接合或使用金属焊接可以实现密封。 金属焊接使得可以使用焊料凸块为封装提供电连接，并具有用于密封的集成器件功能。 密封硅封装不需要塑料封装所需的额外封装层，并提供用于封装一个或多个分立器件的标准接口。