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公开(公告)号：US09685717B2
公开(公告)日：2017-06-20
申请号：US14512705
申请日：2014-10-13
CPC分类号： H01R11/18 , H01R9/05 , H01R13/2414 , H01R2201/20 , Y10T29/49123 , Y10T29/49895
摘要： A method and structure for improving signal integrity probing. A coaxial or a microcoaxial cable is threaded through an optional alignment substrate where the cable is used to support or align the cable or an array of cables. A conductive elastomer is placed on a cable or a microcoaxial cable to improve signal integrity probing.
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公开(公告)号：US20190053375A1
公开(公告)日：2019-02-14
申请号：US16108557
申请日：2018-08-22
摘要： The present invention provides for a method and structure for forming three-dimensionally routed dielectric wires between discrete points on the two or more parallel circuit planes. The wires may be freely routed in three-dimensional space as to create the most efficient routing between the two arbitrarily defined points on the two or more parallel circuit planes. Metalizing the outer surfaces of these three dimensional dielectric wires electrically coupling the discrete wires to their respective discrete contact points. Two or more of these wires may be in intimate contact to one another electrically coupling to each other as well as to two or more discrete contact pads. These electrically coupled contact pads may be on opposite sides or on the same side of the structure and the formed metalized wires may originate on one side and terminate on the other or originate and terminate from the same side.
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公开(公告)号：US20120081867A1
公开(公告)日：2012-04-05
申请号：US13200672
申请日：2011-09-28
CPC分类号： H05K1/0233 , H05K1/113 , H05K1/185 , H05K2201/1053 , H05K2201/10636 , Y02P70/611 , Y10T29/4913
摘要： The present disclosure relates to reducing unwanted RF noise in a printed circuit board (PCB) containing an RF device. An isolation filter is embedded in a PCB containing an RDF device. By placing the isolation filter as close as possible to the RF device in order to dramatically reduce unwanted RF noise due to unavoidable coupling between Vias and planes in the PCB structure.
摘要翻译： 本公开涉及减少包含RF设备的印刷电路板（PCB）中的不期望的RF噪声。 隔离滤波器嵌入在包含RDF设备的PCB中。 通过将隔离滤波器放置在尽可能靠近RF器件的位置，以便显着减少不必要的RF噪声，这是由于通孔和PCB结构中的平面之间的不可避免的耦合。
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公开(公告)号：US09793226B2
公开(公告)日：2017-10-17
申请号：US15055089
申请日：2016-02-26
CPC分类号： H01L23/66 , G01R1/07342 , G01R31/2851 , G01R31/2889 , G01R31/2896 , G01R31/31905 , H01L23/642
摘要： The present invention describes essentially three different embodiments for the implementation of low impedance (over frequency) power delivery to a die. Such low impedance to a high frequency allows the die to operate at package-level speed, thus reducing yield loss at the packaging level. Each embodiment addresses a slightly different aspect of the overall wafer probe application. In each embodiment, however, the critical improvement of this disclosure is the location of the passive components used for supply filtering/decoupling relative to prior art. All three embodiments require a method to embed the passive components in close proximity to the pitch translation substrate or physically in the pitch translation substrate.
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5.发明申请公开(公告)号：US20170250146A1
公开(公告)日：2017-08-31
申请号：US15055089
申请日：2016-02-26
CPC分类号： H01L23/66 , G01R1/07342 , G01R31/2851 , G01R31/2889 , G01R31/2896 , G01R31/31905 , H01L23/642
摘要： The present invention describes essentially three different embodiments for the implementation of low impedance (over frequency) power delivery to a die. Such low impedance to a high frequency allows the die to operate at package-level speed, thus reducing yield loss at the packaging level. Each embodiment addresses a slightly different aspect of the overall wafer probe application. In each embodiment, however, the critical improvement of this disclosure is the location of the passive components used for supply filtering/decoupling relative to prior art. All three embodiments require a method to embed the passive components in close proximity to the pitch translation substrate or physically in the pitch translation substrate.
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公开(公告)号：US20190053374A1
公开(公告)日：2019-02-14
申请号：US16108527
申请日：2018-08-22
摘要： The present invention provides for a method and structure for forming three-dimensionally routed dielectric wires between discrete points on the two or more parallel circuit planes. The wires may be freely routed in three-dimensional space as to create the most efficient routing between the two arbitrarily defined points on the two or more parallel circuit planes. Metalizing the outer surfaces of these three dimensional dielectric wires electrically coupling the discrete wires to their respective discrete contact points. Two or more of these wires may be in intimate contact to one another electrically coupling to each other as well as to two or more discrete contact pads. These electrically coupled contact pads may be on opposite sides or on the same side of the structure and the formed metalized wires may originate on one side and terminate on the other or originate and terminate from the same side.
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公开(公告)号：US08848385B2
公开(公告)日：2014-09-30
申请号：US13200672
申请日：2011-09-28
CPC分类号： H05K1/0233 , H05K1/113 , H05K1/185 , H05K2201/1053 , H05K2201/10636 , Y02P70/611 , Y10T29/4913
摘要： The present disclosure relates to reducing unwanted RF noise in a printed circuit board (PCB) containing an RF device. An isolation filter is embedded in a PCB containing an RDF device. By placing the isolation filter as close as possible to the RF device in order to dramatically reduce unwanted RF noise due to unavoidable coupling between Vias and planes in the PCB structure.
摘要翻译： 本公开涉及减少包含RF设备的印刷电路板（PCB）中的不期望的RF噪声。 隔离滤波器嵌入在包含RDF设备的PCB中。 通过将隔离滤波器放置在尽可能靠近RF器件的位置，以便显着减少不必要的RF噪声，这是由于通孔和PCB结构中的平面之间的不可避免的耦合。
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公开(公告)号：US20130280929A1
公开(公告)日：2013-10-24
申请号：US13815737
申请日：2013-03-15
CPC分类号： H01R13/03 , H01R12/52 , H01R13/2414 , H01R43/26 , Y10T29/49208 , Y10T29/4921
摘要： A method and an electrical interconnect mechanism in which elastomeric pins are printed onto metal retainer tabs having at least one protrusion or tab extending laterally therefrom to engage a catch or recess of the laminated housing so as to locate each of the elastomeric pins and secure them within the housing. In one embodiment a champher may be employed with a catch or recess to engagely secure a second protrusion or tab extending laterally from another side of said elastomeric pin. In another embodiment the elastomeric pin may have a solid metal ring or a slide collar around the center of the pin wherein the ring has one or two tabs for engaging the recess in the housing and if preferred also the recess of a champfer.
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公开(公告)号：US09373452B2
公开(公告)日：2016-06-21
申请号：US14048246
申请日：2013-10-08
CPC分类号： H01H1/403 , H01H1/0036 , H01H1/365 , H01H45/02
摘要： A shuttle board relay is provided that is scalable to a specific pitch or routing density. The shuttle board relay provides a path with different sets of electrical components that allows this via by allowing the integration of components and other types of customization. The shuttle board relay provides a minimally disruptive path to the signal. This minimizes loss and signal distortion, isolation and crosstalk are a function of pitch. Since pitch can be set, grounds included, etc., a design may be fully optimized for low cross talk.
摘要翻译： 提供穿梭板继电器，其可扩展到特定的音调或路由密度。 穿梭板继电器提供具有不同组电气部件的路径，通过允许组件和其他类型的定制的集成来允许该通路。 穿梭板继电器为信号提供了最小的破坏性路径。 这最大限度地减少损耗和信号失真，隔离和串扰是音调的函数。 由于可以设置音高，包括等等，所以可以针对低串扰来完全优化设计。
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10.发明申请公开(公告)号：US20150319863A1
公开(公告)日：2015-11-05
申请号：US14700438
申请日：2015-04-30
CPC分类号： H05K1/188 , H05K1/144 , H05K1/183 , H05K1/186 , H05K3/0026 , H05K3/0094 , H05K3/321 , H05K3/366 , H05K3/4655 , H05K3/4679 , H05K2201/032 , H05K2201/0355 , H05K2201/042 , H05K2201/09509 , H05K2201/09536 , H05K2201/09545 , H05K2201/09572 , H05K2203/0485 , H05K2203/063 , H05K2203/11 , Y10T29/49128 , Y10T29/4914
摘要： A method and electrical interconnect structure internal to a printed circuit board for the purposes of creating a reliable, high performing connection method between embedded component terminals, signal traces and or power/ground planes which may occupy the same vertical space as the embedded components, such as a capacitor or resistor. Further easing the assembly and reliability through the manufacturing process of said embedded component structures. In one structure castellated drilled, plated vias connect the trace or plane within the printed circuit board to the electrical terminals of the embedded component using a permanent and highly conductive attach material. In another structure, the trace or plane connect by selective side-wall plating, which surrounds the electrical terminal of the component. This structure also uses a permanent and highly conductive attach material to electrically connect the component terminal to the plated side-wall and in a final embodiment the terminals are connected through a conductive attach material through a via in the z axis to a conductive pad.
摘要翻译： 印刷电路板内部的方法和电互连结构，用于在嵌入式组件端子，信号迹线和/或电源/接地平面之间建立可靠的，高性能的连接方法，其可能占据与嵌入式组件相同的垂直空间，例如 作为电容器或电阻器。 通过所述嵌入式组件结构的制造过程进一步减轻组装和可靠性。 在一种结构化的钻孔中，电镀通孔使用永久且高度导电的附着材料将印刷电路板中的迹线或平面连接到嵌入式部件的电气端子。 在另一种结构中，迹线或平面通过选择性侧壁电镀连接，该电镀围绕部件的电端子。 该结构还使用永久且高度导电的附着材料将组件端子电连接到电镀侧壁，并且在最终实施例中，端子通过导电附着材料通过z轴上的通孔连接到导电焊盘。
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