公开(公告)号：US07279963B2

公开(公告)日：2007-10-09

申请号：US11143398

申请日：2005-06-02

申请人： Thomas Passe ,  Oliver Schilling

发明人： Thomas Passe ,  Oliver Schilling

IPC分类号： H01L23/58 ,  H01L23/50 ,  H01L27/092

CPC分类号： H01L24/49 ,  H01L24/48 ,  H01L25/072 ,  H01L2224/0603 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/4846 ,  H01L2224/48472 ,  H01L2224/49111 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099

摘要： A semiconductor device has first, second, and third connecting leads (1, 2, 3), whose respective base points (1f, 2f, 3f) have centroids (1m, 2m, 3m). The connecting leads are arranged wherein an angle (α) between a first line drawn between the centroids (1m, 3m) of the base points (1f, 3f) of first lead (1) and third lead (3) and a second line drawn between the centroids (2m, 3m) of the base points (2f, 3f) of second lead (2) and third lead (3) is 20° maximum. In addition, a semiconductor module may incorporate two or more semiconductor devices which are connected electrically in parallel.

摘要翻译： 半导体器件具有其各自的基点（1f，2f，3f）具有重心（1m，2m，3m）的第一，第二和第三连接引线（1,2,3）。 布置连接引线，其中在第一引线（1）和第三引线（3）的基点（1f，3f）的质心（1m，3m）之间绘制的第一线之间的角度（α）和 在第二引线（2）和第三引线（3）的基点（2f，3f）的质心（2m，3m）之间绘制的第二条线最大为20°。 此外，半导体模块可以并入两个或更多个并联电连接的半导体器件。

公开(公告)号：US20060001146A1

公开(公告)日：2006-01-05

申请号：US11143398

申请日：2005-06-02

申请人： Thomas Passe ,  Oliver Schilling

发明人： Thomas Passe ,  Oliver Schilling

IPC分类号： H01L23/48

CPC分类号： H01L24/49 ,  H01L24/48 ,  H01L25/072 ,  H01L2224/0603 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/4846 ,  H01L2224/48472 ,  H01L2224/49111 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099

摘要： A semiconductor device has connecting leads, whose base points (1f, 2f, 3f) have centroids (1m, 2m, 3m), wherein the connecting line between the centroids (1m, 3m) of the base points (1f, 3f) of the first (1) and third (3) connecting lead, and the connecting line between the centroids (2m, 3m) of the base points (2f, 3f) of the second (2) and third (3) connecting lead enclose an angle (α) of 20° maximum. In addition, a semiconductor module may incorporate two or more semiconductor devices which are connected electrically in parallel.

摘要翻译： 半导体器件具有连接引线，其基点（1f，2f，3f）具有重心（1m，2m，3m），其中基座的质心（1m，3m） 第一（1）和第三（3）连接引线的点（1f，3f）和第二（1）和第三（3）连接引线的基点（2f，3f）的质心（2m，3m） （2）和第三（3）连接引线包含最大20°的角度（α）。 此外，半导体模块可以并入两个或更多个并联电连接的半导体器件。

公开(公告)号：US08790613B2

公开(公告)日：2014-07-29

申请号：US13034101

申请日：2011-02-24

申请人： John A. Teagle ,  Oliver Schilling ,  Mayra C. Sanchez

发明人： John A. Teagle ,  Oliver Schilling ,  Mayra C. Sanchez

IPC分类号： C01G25/02 ,  C01G45/02 ,  H01M4/13 ,  H01M4/24 ,  H01M4/50 ,  H01M10/0525

CPC分类号： C01G45/02 ,  C01P2006/40 ,  H01M4/13 ,  H01M4/244 ,  H01M4/50 ,  H01M10/0525 ,  Y02E60/122 ,  Y02E60/124

摘要： A method for preparing treated electrolytic manganese dioxide and a battery including the treated electrolytic manganese dioxide as an electrode are provided. The method for treating the electrolytic manganese dioxide includes suspending milled electrolytic manganese dioxide in an aqueous solution heated to a temperature between ambient and boiling, and adjusting an acidity of the aqueous solution to a pH of less than 3.3. The method further includes agitating the suspended milled electrolytic manganese dioxide in the aqueous solution for a predetermined amount of time to dissolve metal-containing particulates in the milled electrolytic manganese dioxide.

摘要翻译： 提供了一种制备经处理的电解二氧化锰的方法和包括处理的电解二氧化锰作为电极的电池。 用于处理电解二氧化锰的方法包括将经研磨的电解二氧化锰悬浮在加热至环境温度和沸点之间的温度的水溶液中，并将水溶液的酸度调节至小于3.3的pH。 该方法还包括在水溶液中搅拌悬浮研磨的电解二氧化锰预定的时间以将含金属的微粒溶解在研磨的电解二氧化锰中。

公开(公告)号：US07986005B2

公开(公告)日：2011-07-26

申请号：US11829311

申请日：2007-07-27

申请人： Oliver Schilling ,  Frank Pfirsch

发明人： Oliver Schilling ,  Frank Pfirsch

IPC分类号： H01L29/78

CPC分类号： H01L29/7802 ,  H01L29/42368 ,  H01L29/66333 ,  H01L29/7395 ,  H01L29/7397 ,  H01L29/7813 ,  H01L29/7831 ,  H01L29/788

摘要： A power semiconductor device includes a semiconductor body. The semiconductor body includes a body region of a first conductivity type for forming therein a conductive channel of a second conductivity type; a gate electrode arranged next to the body region; and a floating electrode arranged between the gate electrode and the body region.

摘要翻译： 功率半导体器件包括半导体本体。 半导体本体包括第一导电类型的体区，用于在其中形成具有第二导电类型的导电沟道; 布置在身体区域旁边的栅电极; 以及布置在栅极电极和主体区域之间的浮动电极。

公开(公告)号：US07656672B2

公开(公告)日：2010-02-02

申请号：US11381881

申请日：2006-05-05

申请人： Oliver Schilling ,  Reinhold Spanke

发明人： Oliver Schilling ,  Reinhold Spanke

IPC分类号： H05K1/14

CPC分类号： H01L24/49 ,  H01L24/48 ,  H01L25/072 ,  H01L2224/0603 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01052 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1301 ,  H01L2924/13033 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/30107 ,  H02M7/003 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A power module has several circuit units (20, 21) that are electrically connected in parallel and are provided with terminal contacts (5, 5′) which are electrically and mechanically interconnected via at least one current-conducting saddle (26). In order to create a power module which is easy to produce and in which the current-conducting saddle (26) requires little space, the saddle (26) is embodied in several parts while encompassing a terminal element (12) that can be connected in a fixed manner to a terminal contact (5) of a circuit unit (20) independently of a connecting element (25) of the saddle (26). The connecting element (25) of the saddle (26) extends on a plane that is spaced apart from the circuit unit (20) while being electrically connected to the terminal element (12).

摘要翻译： 功率模块具有并联电连接并且设置有通过至少一个导电鞍座（26）电和机械地互连的端子触头（5,5'）的数个电路单元（20,21）。 为了形成易于制造并且导电鞍座（26）所需的空间很小的功率模块，鞍座（26）被体现在几个部分中，同时包含可以连接在其上的端子元件（12） 固定地连接到电路单元（20）的端子触点（5），独立于鞍座（26）的连接元件（25）。 鞍座（26）的连接元件（25）在与电路单元（20）间隔开的平面上延伸，同时电连接到端子元件（12）。

公开(公告)号：US07968988B2

公开(公告)日：2011-06-28

申请号：US11680881

申请日：2007-03-01

申请人： Thomas Nuebel ,  Oliver Schilling ,  Reinhold Spanke

发明人： Thomas Nuebel ,  Oliver Schilling ,  Reinhold Spanke

IPC分类号： H01L23/02

CPC分类号： H01L25/162 ,  H01L25/072 ,  H01L2924/0002 ,  H01L2924/00

摘要： The power semiconductor module (1) has a heat-conducting base plate (11) on which at least three substrates (2, 3, 4, 5, 6, 7) are placed, each substrate supporting at least one power semiconductor component (8, 9) that gives off heat generated during operation. In order to optimize a power semiconductor module of this type with regard to mechanical load and heat dissipation, the substrates (2, 3, 4, 5, 6, 7) are placed on the base plate (11) while being arranged in a single row (12), and pressing devices (15, 16), which are situated close to the substrate, are provided on both longitudinal sides (11a, 11b) of the base plate (11) while being arranged parallel to the row (12). The base plate can be pressed against a cooling surface by the pressing devices.

摘要翻译： 功率半导体模块（1）具有导热基板（11），其上放置有至少三个基板（2,3,4,5,6,7），每个基板支撑至少一个功率半导体部件（8 ，9）发出运行中产生的热量。 为了优化关于机械负载和散热的这种功率半导体模块，将基板（2,3,4,5,6,7）放置在基板（11）上，同时布置成单个 位于基板附近的行（12）和按压装置（15,16）在平行于行（12）的同时设置在基板（11）的两个纵向侧（11a，11b）上， 。 基板可以通过按压装置压靠冷却表面。

公开(公告)号：US20070205500A1

公开(公告)日：2007-09-06

申请号：US11680881

申请日：2007-03-01

申请人： Thomas Nuebel ,  Oliver Schilling ,  Reinhold Spanke

发明人： Thomas Nuebel ,  Oliver Schilling ,  Reinhold Spanke

IPC分类号： H01L23/12

CPC分类号： H01L25/162 ,  H01L25/072 ,  H01L2924/0002 ,  H01L2924/00

摘要： The power semiconductor module (1) has a heat-conducting base plate (11) on which at least three substrates (2, 3, 4, 5, 6, 7) are placed, each substrate supporting at least one power semiconductor component (8, 9) that gives off heat generated during operation. In order to optimize a power semiconductor module of this type with regard to mechanical load and heat dissipation, the substrates (2, 3, 4, 5, 6, 7) are placed on the base plate (11) while being arranged in a single row (12), and pressing devices (15, 16), which are situated close to the substrate, are provided on both longitudinal sides (11a, 11b) of the base plate (11) while being arranged parallel to the row (12). The base plate can be pressed against a cooling surface by the pressing devices.

摘要翻译： 功率半导体模块（1）具有导热基板（11），其上放置有至少三个基板（2,3,4,5,6,7），每个基板支撑至少一个功率半导体部件（8 ，9）发出运行中产生的热量。 为了优化关于机械负载和散热的这种功率半导体模块，将基板（2,3,4,5,6,7）放置在基板（11）上，同时布置成单个 位于基板附近的行（12）和按压装置（15,16）设置在基板（11）的两个纵向侧（11a，11b）上，同时平行于行 12）。 基板可以通过按压装置压靠冷却表面。

公开(公告)号：US20070119820A1

公开(公告)日：2007-05-31

申请号：US11381881

申请日：2006-05-05

申请人： Oliver Schilling ,  Reinhold Spanke

发明人： Oliver Schilling ,  Reinhold Spanke

IPC分类号： H01H33/16

CPC分类号： H01L24/49 ,  H01L24/48 ,  H01L25/072 ,  H01L2224/0603 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01052 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1301 ,  H01L2924/13033 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/30107 ,  H02M7/003 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A power module has several circuit units (20, 21) that are electrically connected in parallel and are provided with terminal contacts (5, 5′) which are electrically and mechanically interconnected via at least one current-conducting saddle (26). In order to create a power module which is easy to produce and in which the current-conducting saddle (26) requires little space, the saddle (26) is embodied in several parts while encompassing a terminal element (12) that can be connected in a fixed manner to a terminal contact (5) of a circuit unit (20) independently of a connecting element (25) of the saddle (26). The connecting element (25) of the saddle (26) extends on a plane that is spaced apart from the circuit unit (20) while being electrically connected to the terminal element (12).

摘要翻译： 功率模块具有并联电连接并且设置有通过至少一个导电鞍座（26）电和机械地互连的端子触头（5,5'）的数个电路单元（20,21）。 为了形成易于制造并且导电鞍座（26）所需的空间很小的功率模块，鞍座（26）被体现在几个部分中，同时包含可以连接在其上的端子元件（12） 固定地连接到电路单元（20）的端子触点（5），独立于鞍座（26）的连接元件（25）。 鞍座（26）的连接元件（25）在与电路单元（20）间隔开的平面上延伸，同时电连接到端子元件（12）。

公开(公告)号：US09048494B2

公开(公告)日：2015-06-02

申请号：US13192936

申请日：2011-07-28

申请人： John A. Teagle ,  Oliver Schilling

发明人： John A. Teagle ,  Oliver Schilling

IPC分类号： H01M4/50 ,  H01M6/04 ,  H01M4/62 ,  H01M4/38 ,  H01M4/42

CPC分类号： H01M4/50 ,  H01M4/382 ,  H01M4/42 ,  H01M4/628 ,  H01M6/04 ,  H01M2300/0002

摘要： An electrolytic manganese dioxide improved for tool wear reduction, methods for preparing the improved electrolytic manganese dioxide and for preparing a positive-electrode precursor, and a primary battery are provided. One method includes displacement-washing neutralized electrolytic manganese dioxide with a solution including a corrosion inhibitor configured to be at a first predetermined concentration. The method further includes drying the washed electrolytic manganese dioxide to collect improved electrolytic manganese dioxide including the corrosion inhibitor configured to be at a second predetermined concentration within the improved electrolytic manganese dioxide to minimize corrosion of a metal material in contact with the improved electrolytic manganese dioxide. The corrosion inhibitor includes one of a benzoate salt, a phosphate salt, a carbonate salt, a metaborate salt, a tetraborate salt, a metaperiodate salt, and a meta-aluminate salt.

摘要翻译： 提供改善用于工具磨损减少的电解二氧化锰，提供制备改进的电解二氧化锰和制备正极前体的方法和一次电池。 一种方法包括用包括配置成处于第一预定浓度的腐蚀抑制剂的溶液置换洗涤中和的电解二氧化锰。 该方法还包括干燥洗涤的电解二氧化锰以收集包括腐蚀抑制剂在内的改进的电解二氧化锰，该腐蚀抑制剂被配置成改进的电解二氧化锰中的第二预定浓度，以最小化与改进的电解二氧化锰接触的金属材料的腐蚀。 腐蚀抑制剂包括苯甲酸盐，磷酸盐，碳酸盐，偏硼酸盐，四硼酸盐，偏高碘酸盐和偏铝酸盐中的一种。

公开(公告)号：US20090026532A1

公开(公告)日：2009-01-29

申请号：US11829311

申请日：2007-07-27

申请人： Oliver Schilling ,  Frank Pfirsch

发明人： Oliver Schilling ,  Frank Pfirsch

IPC分类号： H01L29/94 ,  H01L21/336

CPC分类号： H01L29/7802 ,  H01L29/42368 ,  H01L29/66333 ,  H01L29/7395 ,  H01L29/7397 ,  H01L29/7813 ,  H01L29/7831 ,  H01L29/788

摘要： A power semiconductor device includes a semiconductor body. The semiconductor body includes a body region of a first conductivity type for forming therein a conductive channel of a second conductivity type; a gate electrode arranged next to the body region; and a floating electrode arranged between the gate electrode and the body region.

摘要翻译： 功率半导体器件包括半导体本体。 半导体本体包括第一导电类型的体区，用于在其中形成具有第二导电类型的导电沟道; 布置在身体区域旁边的栅电极; 以及布置在栅极电极和主体区域之间的浮动电极。