摘要:
The SRAM cell configuration has at least six transistors in each memory cell. Four of the transistors form a flip-flop and they are arranged at the corners of a quadrilateral. The flip-flop is driven by two of the transistors, which are disposed so as to adjoin diagonally opposite corners of the quadrilateral and outside the quadrilateral. Adjacent memory cells along a word line can be arranged in such a way that a first bit line and a second bit line of the adjacent memory cells coincide. The transistors are preferably vertical and are arranged at semiconductor structures (St1, St2, St3, St4, St5, St6) produced from a layer sequence. Two of the transistors having n-doped channel regions are preferably formed in each case on two semiconductor structures.
摘要:
In the circuit arrangement two of the four vertical transistors are complementary to the remaining two transistors. Two of the transistors are respectively arranged at the same level. For this purpose, layer structures (St1, St2, St3, St4) are structured that respectively have at least a channel layer and a source/drain region of one of the transistors. All the layer structures (St1, St2, St3, St4) can be produced from a layer sequence with only four layers. In order to avoid leakage currents due to a parasitic bipolar transistor, the layer structures (St1, St2, St3, St4) can be realized very thinly, using spacer-type masks. Electrical connections between parts of the four transistors can take place via layers of the layer sequence. The contacting to the output voltage terminal can take place via a step that is formed by two layers of the layer sequence.
摘要:
A semiconductor body having a pair of vertical, double-gated CMOS transistors. An insulating layer extending horizontally beneath the surface of the semiconductor body such insulating layer being disposed beneath the pair of transistors. The transistors, together with additional such transistors, are arranged to form a Synchronous Dynamic Random Access Memory (SRAM) array. The array includes a plurality of SRAM cells arranged in rows and columns, each one of the cells having a WORDLINE connected to a WORLDINE CONTACT. The WORDLINE CONTACT is common to four contiguous one of the cells. One of the cells having a plurality of electrically interconnected MOS transistors arranged to provide an SRAM circuit. Each one of the cells has a VDD CONTACT and a VSS CONTACT. One of such CONTACTs is disposed centrally within each one of the cells and the other one of the CONTACTs being common to four contiguous ones of the cells. Each one of the cells has the common one of the CONTACTs and the WORDLINE CONTACT disposed at peripheral, corner regions of the cell.
摘要:
A double gate MOSFET transistor and a method for fabricating it are described. In this case, a semiconductor layer structure of a transistor channel to be formed is embedded in a spacer material and contact-connected by source and drain regions which are filled into depressions that are etched on opposite sides of the semiconductor layer structure. Afterwards, the spacer material is etched out selectively and replaced by the electrically conductive gate electrode material.
摘要:
A memory cell contains a memory transistor and a transfer transistor. A gate electrode of the transfer transistor and a control gate electrode of the memory transistor are connected to a word line. The memory transistor has a floating gate electrode that is isolated from a channel region of the memory transistor by a first dielectric layer and is connected to a first source/drain region of the transfer transistor. The control gate electrode is isolated from the floating gate electrode by a second dielectric layer. A first source/drain region of the memory transistor is connected to a bit line. The memory and transfer transistors are preferably of different conductivity types. During the writing of information, the transfer transistor is in the on-state and the memory transistor is in the off-state. During the reading-out of information, the transfer transistor is in the off-state and the memory transistor is in the on-state.
摘要:
A spacer is used as a mask in an etching step during which a layer structure is produced for a channel layer and for a first source/drain region. After the layer structure has been produced, the first source/drain region and a second source/drain region can be produced by implantation. The second source/drain region is self-aligned on two mutually opposite flanks of the layer structure. A gate electrode can be produced in the form of a spacer on the two flanks. In order to avoid a capacitance formed by a first contact of the gate electrode and the first source/drain region, a part of the first source/drain region may be removed. If the layer structure is produced along edges of an inner area, then a third contact of the second source/drain region may be produced inside the inner area in order to reduce the surface area of the transistor.
摘要:
A semiconductor body-having a pair of vertical, double-gated CMOS transistors. An insulating layer extending horizontally beneath the surface of the semiconductor body such insulating layer being disposed beneath the pair of transistors. The transistors, together with additional such transistors, are arranged to form a Synchronous Dynamic Random Access Memory (SRAM) array. The array includes a plurality of SRAM cells arranged in rows and columns, each one of the cells having a WORDLINE connected to a WORLDINE CONTACT. The WORDLINE CONTACT is common to four contiguous one of the cells. One of the cells having a plurality of electrically interconnected MOS transistors arranged to provide an SRAM circuit. Each one of the cells has a VDD CONTACT and a VSS CONTACT. One of such CONTACTs is disposed centrally within each one of the cells and the other one of the CONTACTs being common to four contiguous ones of the cells. Each one of the cells has the common one of the CONTACTs and the WORDLINE CONTACT disposed at peripheral, corner regions of the cell.
摘要:
A semiconductor body having a pair of vertical, double-gated CMOS transistors. An insulating layer extending horizontally beneath the surface of the semiconductor body such insulating layer being disposed beneath the pair of transistors. The transistors, together with additional such transistors, are arranged to form a Synchronous Dynamic Random Access Memory (SRAM) array. The array includes a plurality of SRAM cells arranged in rows and columns, each one of the cells having a WORDLINE connected to a WORLDINE CONTACT. The WORDLINE CONTACT is common to four contiguous one of the cells. One of the cells having a plurality of electrically interconnected MOS transistors arranged to provide an SRAM circuit. Each one of the cells has a VDD CONTACT and a VSS CONTACT. One of such CONTACTs is disposed centrally within each one of the cells and the other one of the CONTACTs being common to four contiguous ones of the cells. Each one of the cells has the common one of the CONTACTs and the WORDLINE CONTACT disposed at peripheral, corner regions of the cell.
摘要:
A vertical semiconductor transistor component is built up on a substrate by using a statistical mask. The vertical semiconductor transistor component has vertical pillar structures statistically distributed over the substrate. The vertical pillar structures are electrically connected on a base side thereof to a first common electrical contact. The vertical pillar structures include, along the vertical direction, layer zones of differing conductivity, and have insulation layers on their circumferential walls. An electrically conductive material is deposited between the pillar structures and forms a second electrical contact of the semiconductor transistor component. The pillar structures are electrically contacted to a third common electrical contact on their capping side.
摘要:
A nonvolatile semiconductor memory cell includes a transistor component formed on a substrate and a storage node that determines the switching state of the transistor component. The storage node is arranged near a control gate electrode. The storage node has a group of vertically oriented column structures having at least two semiconductor layer zones and an insulating layer zone situated between the two semiconductor layer zones.