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公开(公告)号：US09149004B2
公开(公告)日：2015-10-06
申请号：US13540683
申请日：2012-07-03
CPC分类号： A01F15/148 , A01F15/0825
摘要： A method for operating a baler with a pressing chamber which serves for the pressing of a straw-like crop includes compacting the crop using an adjustable pressing pressure and binding the crop through a holding material. The pressing pressure is limited to a maximum value and controlled through a control circuit. A control circuit reference variable is a load variable of the holding material. The load variable is adjustable and is smaller than or equal to the maximum value.
摘要翻译： 用于操作具有用于挤压秸秆样作物的按压室的打包机的方法包括使用可调节的压力压缩作物并通过保持材料结合作物。 按压压力被限制在最大值，并通过控制电路进行控制。 控制电路参考变量是保持材料的负载变量。 负载变量可调，小于或等于最大值。
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公开(公告)号：US08555780B2
公开(公告)日：2013-10-15
申请号：US13597888
申请日：2012-08-29
申请人： Thorsten Scharf , Ulrich Hesselmann
发明人： Thorsten Scharf , Ulrich Hesselmann
CPC分类号： A01F15/145
摘要： A bale press includes a pressing channel in which a piston is displaceable for forming a bale from crop material supplied to the pressing channel. The bale press includes a yarn supply and a knotter device arranged at a side of the pressing channel. The knotter device has a first holder for releasably holding an end portion of a yarn, a yarn deflecting member and a knotter beak. The yarn extends between the first holder and the yarn supply across the deflecting member and a side of the bale facing away from the piston. The knotter beak ties a knot in a first stretch of the yarn extending between the first holder and the deflecting member. A second holder holds the yarn at the deflecting member in an initial phase of bale formation.
摘要翻译： 捆包机包括压榨通道，活塞可移动，用于从供应到压榨通道的作物材料形成捆包。 捆包机包括布置在挤压通道一侧的纱线供给器和打结器装置。 打结装置具有用于可释放地保持纱线的端部，纱线偏转构件和打结喙的第一保持器。 纱线在第一保持器和纱线供应件之间横跨偏转构件延伸，并且捆包的一侧面朝向活塞。 打结喙在第一保持器和偏转构件之间延伸的纱线的第一段中结合结。 第二个保持器将纱线保持在偏转构件处于捆包形成的初始阶段。
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公开(公告)号：US20130055910A1
公开(公告)日：2013-03-07
申请号：US13597888
申请日：2012-08-29
申请人： Thorsten Scharf , Ulrich Hesselmann
发明人： Thorsten Scharf , Ulrich Hesselmann
IPC分类号： A01F15/14
CPC分类号： A01F15/145
摘要： A bale press includes a pressing channel in which a piston is displaceable for forming a bale from crop material supplied to the pressing channel. The bale press includes a yarn supply and a knotter device arranged at a side of the pressing channel. The knotter device has a first holder for releasably holding an end portion of a yarn, a yarn deflecting member and a knotter beak. The yarn extends between the first holder and the yarn supply across the deflecting member and a side of the bale facing away from the piston. The knotter beak ties a knot in a first stretch of the yarn extending between the first holder and the deflecting member. A second holder holds the yarn at the deflecting member in an initial phase of bale formation.
摘要翻译： 捆包机包括压榨通道，活塞可移动，用于从供应到压榨通道的作物材料形成捆包。 捆包机包括布置在挤压通道一侧的纱线供给器和打结器装置。 打结装置具有用于可释放地保持纱线的端部，纱线偏转构件和打结喙的第一保持器。 纱线在第一保持器和纱线供应件之间横跨偏转构件延伸，并且捆包的一侧面朝向活塞。 打结喙在第一保持器和偏转构件之间延伸的纱线的第一段中结合结。 第二个保持器将纱线保持在偏转构件处于捆包形成的初始阶段。
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公开(公告)号：US20130341780A1
公开(公告)日：2013-12-26
申请号：US13527668
申请日：2012-06-20
申请人： Thorsten Scharf , Boris Plikat , Henrik Ewe , Anton Prueckl , Stefan Landau
发明人： Thorsten Scharf , Boris Plikat , Henrik Ewe , Anton Prueckl , Stefan Landau
IPC分类号： H01L23/48 , H01L21/60 , H01L23/495
CPC分类号： H01L24/82 , H01L23/295 , H01L23/3171 , H01L23/3735 , H01L23/49562 , H01L24/24 , H01L2224/04105 , H01L2224/2413 , H01L2224/29111 , H01L2224/29118 , H01L2224/29124 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/29166 , H01L2224/2919 , H01L2224/32245 , H01L2224/73267 , H01L2224/82039 , H01L2224/82047 , H01L2224/8382 , H01L2224/92244 , H01L2924/07802 , H01L2924/12042 , H01L2924/1301 , H01L2924/15747 , H01L2924/00
摘要： A chip arrangement is provided. The chip arrangement including: a chip including at least one electrically conductive contact; a passivation material formed over the at least one electrically conductive contact; an encapsulation material formed over the passivation material; one or more holes formed through the encapsulation material and the passivation material, wherein the passivation material at least partially surrounds the one or more holes; and electrically conductive material provided within the one or more holes, wherein the electrically conductive material is electrically connected to the at least one electrically conductive contact.
摘要翻译： 提供了芯片布置。 芯片布置包括：包括至少一个导电触点的芯片; 形成在所述至少一个导电触点上的钝化材料; 形成在钝化材料上的封装材料; 通过所述封装材料和所述钝化材料形成的一个或多个孔，其中所述钝化材料至少部分地围绕所述一个或多个孔; 以及设置在所述一个或多个孔内的导电材料，其中所述导电材料电连接到所述至少一个导电触点。
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公开(公告)号：US08399995B2
公开(公告)日：2013-03-19
申请号：US12355313
申请日：2009-01-16
申请人： Thorsten Scharf , Horst Theuss , Markus Leicht
发明人： Thorsten Scharf , Horst Theuss , Markus Leicht
CPC分类号： H01L21/561 , H01L23/3114 , H01L23/3185 , H01L24/28 , H01L24/73 , H01L2224/16105 , H01L2224/291 , H01L2224/29111 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/157 , H01L2924/181 , H01L2924/19043 , H01L2924/01023 , H01L2924/01028 , H01L2924/01083 , H01L2924/014 , H01L2924/00
摘要： A semiconductor device includes a chip. The chip includes a single circuit element formed in a semiconductor substrate, a first metal layer on a first face of the semiconductor substrate, and a second metal layer on a second face of the semiconductor substrate opposite the first face. The first metal layer and the second metal layer are configured for accessing the single circuit element. A smaller of a first width of the first face of the semiconductor substrate and a second width of the first face of the semiconductor substrate perpendicular to the first width is less than or equal to a distance between an exposed face of the first metal layer parallel to the first face of the semiconductor substrate and an exposed face of the second metal layer parallel to the second face of the semiconductor substrate.
摘要翻译： 半导体器件包括芯片。 芯片包括形成在半导体衬底中的单个电路元件，在半导体衬底的第一面上的第一金属层和与第一面相对的第二面上的第二金属层。 第一金属层和第二金属层被配置为用于访问单个电路元件。 半导体衬底的第一面的第一宽度的较小值和垂直于第一宽度的半导体衬底的第一面的第二宽度小于或等于第一金属层的暴露面平行于 半导体衬底的第一面和第二金属层的暴露面平行于半导体衬底的第二面。
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公开(公告)号：US08177878B2
公开(公告)日：2012-05-15
申请号：US12627825
申请日：2009-11-30
IPC分类号： B22F1/00
CPC分类号： H01B1/02 , B23K1/0006 , B23K1/0016 , B23K35/0227 , B23K35/0244 , B23K35/282 , B23K35/286 , B23K35/325 , B23K35/3602 , B23K2101/40 , H01L24/29 , H01L24/83 , H01L2224/29 , H01L2224/29101 , H01L2224/29111 , H01L2224/29118 , H01L2224/29139 , H01L2224/2919 , H01L2224/29386 , H01L2224/29424 , H01L2224/83222 , H01L2924/0001 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/0102 , H01L2924/01024 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/0104 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01056 , H01L2924/01068 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/14 , H01L2924/1461 , H01L2924/15747 , H01L2924/00 , H01L2924/00014 , H01L2224/29099 , H01L2924/05381
摘要： A bonding material including a meltable joining material and a plurality of heterostructures distributed throughout the meltable joining material, the heterostructures comprising at least a first material and a second material capable of conducting a self-sustaining exothermic reaction upon initiation by an external energy to generate heat sufficient to melt the meltable joining material.
摘要翻译： 一种粘合材料，包括分布在整个可熔接合材料中的可熔接合材料和多个异质结构，所述异质结构至少包括第一材料和第二材料，所述第一材料和第二材料在外部能量引发时能够进行自持放热反应以产生热量 足以熔化可熔接合材料。
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公开(公告)号：US07770744B2
公开(公告)日：2010-08-10
申请号：US11579099
申请日：2005-04-29
申请人： Thorsten Scharf , Ingo Noeske
发明人： Thorsten Scharf , Ingo Noeske
IPC分类号： B65H59/10
摘要： The present invention relates to a rope winding system (1) for winding and unwinding a steel rope (4) of a crane (7). A rope winding system (1) according to the present invention has a rope drum (6), onto which the steel rope (4) can be wound in a plurality of layers, and a magnetic system (7) which is configured to generate a magnetic field over a section of the steel rope (4) with its magnetic flux being deflected by a movement of the steel rope (4) in such a way that the steel rope (4) is braked. A crane (7) is also discloses which is equipped with such a rope winding system (1) for winding and unwinding a steel rope (4).
摘要翻译： 本发明涉及一种用于卷绕和展开起重机（7）的钢丝绳（4）的绳索卷绕系统（1）。 根据本发明的绳索卷绕系统（1）具有绳索（6），钢丝绳（4）可以缠绕在多个层中，并且磁性系统（7）被构造成产生 钢绳（4）的一部分上的磁场，其磁通量由钢绳（4）的运动以钢绳（4）制动的方式偏转。 还公开了一种起重机（7），其装备有用于卷绕和展开钢绳（4）的这种绳索卷绕系统（1）。
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公开(公告)号：US20070228202A1
公开(公告)日：2007-10-04
申请号：US11579099
申请日：2005-04-29
申请人： Thorsten Scharf , Ingo Noeske
发明人： Thorsten Scharf , Ingo Noeske
IPC分类号： B66D5/16
摘要： The present invention relates to a rope winding system (1) for winding and unwinding a steel rope (4) of a crane (7). A rope winding system (1) according to the present invention has a rope drum (6), onto which the steel rope (4) can be wound in a plurality of layers, and a magnetic system (7) which is configured to generate a magnetic field over a section of the steel rope (4) with its magnetic flux being deflected by a movement of the steel rope (4) in such a way that the steel rope (4) is braked. A crane (7) is also discloses which is equipped with such a rope winding system (1) for winding and unwinding a steel rope (4).
摘要翻译： 本发明涉及一种用于卷绕和展开起重机（7）的钢丝绳（4）的绳索卷绕系统（1）。 根据本发明的绳索卷绕系统（1）具有绳索（6），钢丝绳（4）可以缠绕在多个层中，并且磁性系统（7）被构造成产生 钢绳（4）的一部分上的磁场，其磁通量由钢绳（4）的运动以钢绳（4）制动的方式偏转。 还公开了一种起重机（7），其装备有用于卷绕和展开钢绳（4）的这种绳索卷绕系统（1）。
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公开(公告)号：US20110127314A1
公开(公告)日：2011-06-02
申请号：US12627825
申请日：2009-11-30
CPC分类号： H01B1/02 , B23K1/0006 , B23K1/0016 , B23K35/0227 , B23K35/0244 , B23K35/282 , B23K35/286 , B23K35/325 , B23K35/3602 , B23K2101/40 , H01L24/29 , H01L24/83 , H01L2224/29 , H01L2224/29101 , H01L2224/29111 , H01L2224/29118 , H01L2224/29139 , H01L2224/2919 , H01L2224/29386 , H01L2224/29424 , H01L2224/83222 , H01L2924/0001 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/0102 , H01L2924/01024 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/0104 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01056 , H01L2924/01068 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/14 , H01L2924/1461 , H01L2924/15747 , H01L2924/00 , H01L2924/00014 , H01L2224/29099 , H01L2924/05381
摘要： A bonding material including a meltable joining material and a plurality of heterostructures distributed throughout the meltable joining material, the heterostructures comprising at least a first material and a second material capable of conducting a self-sustaining exothermic reaction upon initiation by an external energy to generate heat sufficient to melt the meltable joining material.
摘要翻译： 一种粘合材料，包括分布在整个可熔接合材料中的可熔接合材料和多个异质结构，所述异质结构至少包括第一材料和第二材料，所述第一材料和第二材料在外部能量引发时能够进行自持放热反应以产生热量 足以熔化可熔接合材料。
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公开(公告)号：US20100181687A1
公开(公告)日：2010-07-22
申请号：US12355313
申请日：2009-01-16
申请人： Thorsten Scharf , Horst Theuss , Markus Leicht
发明人： Thorsten Scharf , Horst Theuss , Markus Leicht
IPC分类号： H01L23/488 , H01L21/34 , H01L21/441
CPC分类号： H01L21/561 , H01L23/3114 , H01L23/3185 , H01L24/28 , H01L24/73 , H01L2224/16105 , H01L2224/291 , H01L2224/29111 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/157 , H01L2924/181 , H01L2924/19043 , H01L2924/01023 , H01L2924/01028 , H01L2924/01083 , H01L2924/014 , H01L2924/00
摘要： A semiconductor device includes a chip. The chip includes a single circuit element formed in a semiconductor substrate, a first metal layer on a first face of the semiconductor substrate, and a second metal layer on a second face of the semiconductor substrate opposite the first face. The first metal layer and the second metal layer are configured for accessing the single circuit element. A smaller of a first width of the first face of the semiconductor substrate and a second width of the first face of the semiconductor substrate perpendicular to the first width is less than or equal to a distance between an exposed face of the first metal layer parallel to the first face of the semiconductor substrate and an exposed face of the second metal layer parallel to the second face of the semiconductor substrate.
摘要翻译： 半导体器件包括芯片。 芯片包括形成在半导体衬底中的单个电路元件，在半导体衬底的第一面上的第一金属层和与第一面相对的第二面上的第二金属层。 第一金属层和第二金属层被配置为用于访问单个电路元件。 半导体衬底的第一面的第一宽度的较小值和垂直于第一宽度的半导体衬底的第一面的第二宽度小于或等于第一金属层的暴露面平行于 半导体衬底的第一面和第二金属层的暴露面平行于半导体衬底的第二面。
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