公开(公告)号：US10426001B2

公开(公告)日：2019-09-24

申请号：US14195005

申请日：2014-03-03

Applicant: Tokyo Electron Limited

Inventor： Ronald Nasman ,  Mirko Vukovic ,  Gerrit J. Leusink ,  Rodney L. Robison ,  Robert D. Clark

IPC: H05B6/80 ,  H01L21/67 ,  H05B6/72 ,  H05B6/70 ,  H01L21/268

Abstract: A processing system is disclosed, having a process chamber that houses a substrate for exposure of a surface of the substrate to a travelling electromagnetic (EM) wave. The processing system also includes an EM wave transmission antenna configured to launch the travelling EM wave into the process chamber for the travelling EM wave to propagate in a direction substantially parallel to the surface of the substrate. The processing system also includes a power coupling system configured to supply EM energy into the EM wave transmission antenna to generate the travelling EM wave at a prescribed output power and in a prescribed EM wave mode during treatment of the substrate. The processing system also includes an EM wave receiving antenna configured to absorb the travelling EM wave after propagation through the process chamber.

公开(公告)号：US20180066363A1

公开(公告)日：2018-03-08

申请号：US15601372

申请日：2017-05-22

Applicant: Tokyo Electron Limited

Inventor： Ronald Nasman ,  Danny Newman ,  Rodney L. Robison

IPC: C23C16/455 ,  B01F3/04 ,  C23C16/448 ,  C23C18/16

CPC classification number: C23C16/45563 ,  B01F3/04 ,  B05B1/3426 ,  B05B7/0012 ,  B05B7/10 ,  B05B7/1686 ,  C23C16/4405 ,  C23C16/448 ,  C23C16/4486 ,  C23C16/45512 ,  C23C16/45514 ,  C23C16/45582 ,  C23C18/1644 ,  Y10T137/2098 ,  Y10T137/2104

Abstract: A vortical atomizing nozzle assembly, vaporizer, and related methods are disclosed for substrate processing systems. The vaporizer introduces an atomized or vaporized liquid into a substrate processing system and includes a vaporizer chamber, a nozzle assembly coupled to the inlet for the vaporizer chamber, and a carrier gas channel coupled to the nozzle assembly. The nozzle assembly includes a premix chamber, an outlet channel, and an expanding nozzle. The premix chamber includes a liquid inlet to receive the liquid to be vaporized and a gas inlet to receive the carrier gas. The carrier gas channel is positioned with respect to the gas inlet to cause a vortical flow within the premix chamber upon introduction of the carrier gas through the carrier gas channel. The premixed liquid from the premix chamber is received by the outlet channel and exits the outlet channel into the expanding nozzle.

公开(公告)号：US20180047562A1

公开(公告)日：2018-02-15

申请号：US15675383

申请日：2017-08-11

Applicant: Tokyo Electron Limited

Inventor： Anton J. deVilliers ,  Rodney L. Robison ,  Ronald Nasman ,  David Travis ,  James Grootegoed ,  Norman A. Jacobson, JR. ,  Lior Huli ,  Joshua S. Hooge

IPC: H01L21/027 ,  H01L21/02 ,  H01L21/67

CPC classification number: H01L21/0275 ,  B05B15/557 ,  B05C5/02 ,  B05C11/1007 ,  B05C11/1047 ,  H01L21/02118 ,  H01L21/67017 ,  H01L21/67023 ,  H01L21/6715

Abstract: Techniques herein include a bladder-based dispense system using an elongate bladder configured to selectively expand and contract to assist with dispense actions. This dispense system compensates for filter-lag, which often accompanies fluid filtering for microfabrication. This dispense system also provides a high-purity and high precision dispense unit. A process fluid filter is located downstream from a process fluid source as well as a system valve. Downstream from the process fluid filter there are no valves. Dispense actions can be initiated and stop while the system valve is open by using the elongate bladder. The elongate bladder can be expanded to stop or pause a dispense action, and then be contracted to assist with a dispense action.

公开(公告)号：US20190035646A1

公开(公告)日：2019-01-31

申请号：US16047711

申请日：2018-07-27

Applicant: Tokyo Electron Limited

Inventor： Ronald Nasman ,  Gerrit J. Leusink ,  Rodney L. Robison ,  Hoyoung Kang ,  Daniel Fulford

IPC: H01L21/67 ,  C23C16/455 ,  C23C16/52

Abstract: Techniques herein include a process chamber for depositing thin films to backside surfaces of wafers to reduce wafer bowing and distortion. A substrate support provides an annular perimeter seal around the bottom and/or side of the wafer which allows the majority of the substrate backside to be exposed to a process environment. A supported wafer separates the chamber into lower and upper chambers that provide different process environments. The lower section of the processing chamber includes deposition hardware configured to apply and remove thin films. The upper section can remain a chemically inert environment, protecting the existing features on the top surface of the wafer. Multiple exhausts and differential pressures are used to prevent deposition gasses from accessing the working surface of a wafer.

公开(公告)号：US20180047563A1

公开(公告)日：2018-02-15

申请号：US15675385

申请日：2017-08-11

Applicant: Tokyo Electron Limited

Inventor： Anton J. deVilliers ,  Rodney L. Robison ,  Ronald Nasman ,  David Travis ,  James Grootegoed ,  Norman A. Jacobson, JR. ,  David Hetzer ,  Lior Huli ,  Joshua S. Hooge

IPC: H01L21/027 ,  H01L21/02 ,  H01L21/66 ,  H01L21/67

CPC classification number: H01L21/0275 ,  B05C5/02 ,  B05C11/1007 ,  B05C11/1047 ,  H01L21/02118 ,  H01L21/67017 ,  H01L21/67023 ,  H01L21/6715 ,  H01L21/67253 ,  H01L22/12

Abstract: Techniques herein include a bladder-based dispense system using an elongate bladder configured to selectively expand and contract to assist with dispense actions. This dispense system compensates for filter-lag, which often accompanies fluid filtering for microfabrication. This dispense system also provides a high-purity and high precision dispense unit. A meniscus sensor monitors a position of a meniscus of process fluid at a nozzle. The elongate bladder unit is used to maintain a position of the meniscus at a particular location by selectively expanding or contracting the bladder, thereby moving or holding a meniscus position. Expansion of the elongate bladder is also used for a suck-back action after completing a dispense action.

公开(公告)号：US10403501B2

公开(公告)日：2019-09-03

申请号：US15675383

申请日：2017-08-11

Applicant: Tokyo Electron Limited

Inventor： Anton J. deVilliers ,  Rodney L. Robison ,  Ronald Nasman ,  David Travis ,  James Grootegoed ,  Norman A. Jacobson, Jr. ,  Lior Huli ,  Joshua S. Hooge

IPC: B05C11/10 ,  H01L21/02 ,  H01L21/027 ,  B05B15/55 ,  H01L21/67 ,  B05C5/02

Abstract: Techniques herein include a bladder-based dispense system using an elongate bladder configured to selectively expand and contract to assist with dispense actions. This dispense system compensates for filter-lag, which often accompanies fluid filtering for microfabrication. This dispense system also provides a high-purity and high precision dispense unit. A process fluid filter is located downstream from a process fluid source as well as a system valve. Downstream from the process fluid filter there are no valves. Dispense actions can be initiated and stop while the system valve is open by using the elongate bladder. The elongate bladder can be expanded to stop or pause a dispense action, and then be contracted to assist with a dispense action.

公开(公告)号：US20140273532A1

公开(公告)日：2014-09-18

申请号：US14195005

申请日：2014-03-03

Applicant: TOKYO ELECTRON LIMITED

Inventor： Ronald Nasman ,  Mirko Vukovic ,  Gerrit J. Leusink ,  Rodney L. Robison ,  Robert D. Clark

IPC: H01L21/263 ,  H01L21/67 ,  H05B6/80 ,  H05B6/72 ,  H05B6/64

Abstract: A processing system is disclosed, having a process chamber that houses a substrate for exposure of a surface of the substrate to a travelling electromagnetic (EM) wave. The processing system also includes an EM wave transmission antenna configured to launch the travelling EM wave into the process chamber for the travelling EM wave to propagate in a direction substantially parallel to the surface of the substrate. The processing system also includes a power coupling system configured to supply EM energy into the EM wave transmission antenna to generate the travelling EM wave at a prescribed output power and in a prescribed EM wave mode during treatment of the substrate. The processing system also includes an EM wave receiving antenna configured to absorb the travelling EM wave after propagation through the process chamber.

Abstract translation: 公开了一种处理系统，其具有处理室，该处理室容纳用于将基板的表面暴露于行进电磁（EM）波的基板。 处理系统还包括一个EM波发射天线，被配置为将行进的EM波发射到处理室中，用于行进的EM波沿基本上平行于基板的表面的方向传播。 处理系统还包括一个功率耦合系统，被配置为在EM波发射天线中提供EM能量，以在处理基板期间以规定的输出功率和规定的EM波模式产生行进EM波。 该处理系统还包括一个EM波接收天线，该天线被配置成在通过处理室传播之后吸收行进的EM波。

公开(公告)号：US11908728B2

公开(公告)日：2024-02-20

申请号：US16047711

申请日：2018-07-27

Applicant: Tokyo Electron Limited

Inventor： Ronald Nasman ,  Gerrit J. Leusink ,  Rodney L. Robison ,  Hoyoung Kang ,  Daniel Fulford

IPC: H01L21/687 ,  C23C16/455 ,  C23C16/458 ,  C23C16/44 ,  H01J37/32 ,  H01L21/67 ,  C23C16/505

CPC classification number: H01L21/68735 ,  C23C16/4409 ,  C23C16/4412 ,  C23C16/455 ,  C23C16/4585 ,  H01J37/32449 ,  C23C16/505 ,  H01L21/67069

Abstract: Techniques herein include a process chamber for depositing thin films to backside surfaces of wafers to reduce wafer bowing and distortion. A substrate support provides an annular perimeter seal around the bottom and/or side of the wafer which allows the majority of the substrate backside to be exposed to a process environment. A supported wafer separates the chamber into lower and upper chambers that provide different process environments. The lower section of the processing chamber includes deposition hardware configured to apply and remove thin films. The upper section can remain a chemically inert environment, protecting the existing features on the top surface of the wafer. Multiple exhausts and differential pressures are used to prevent deposition gasses from accessing the working surface of a wafer.

公开(公告)号：US10354872B2

公开(公告)日：2019-07-16

申请号：US15675385

申请日：2017-08-11

Applicant: Tokyo Electron Limited

Inventor： Anton J. deVilliers ,  Rodney L. Robison ,  Ronald Nasman ,  David Travis ,  James Grootegoed ,  Norman A. Jacobson, Jr. ,  David Hetzer ,  Lior Huli ,  Joshua S. Hooge

IPC: B05C11/10 ,  H01L21/027 ,  H01L21/02 ,  H01L21/67 ,  H01L21/66 ,  B05C5/02

Abstract: Techniques herein include a bladder-based dispense system using an elongate bladder configured to selectively expand and contract to assist with dispense actions. This dispense system compensates for filter-lag, which often accompanies fluid filtering for microfabrication. This dispense system also provides a high-purity and high precision dispense unit. A meniscus sensor monitors a position of a meniscus of process fluid at a nozzle. The elongate bladder unit is used to maintain a position of the meniscus at a particular location by selectively expanding or contracting the bladder, thereby moving or holding a meniscus position. Expansion of the elongate bladder is also used for a suck-back action after completing a dispense action.