公开(公告)号：US20230004088A1

公开(公告)日：2023-01-05

申请号：US17661901

申请日：2022-05-03

Applicant: Tokyo Electron Limited

Inventor： Mirko Vukovic ,  Steven Gueci

IPC: G03F7/16 ,  H01L21/027 ,  H01L21/033

Abstract: Equipment for coating a wafer is disclosed, where the equipment includes a wafer holder configured to spin the wafer while holding the wafer; a rotary drive configured to spin the wafer holder; a nozzle configured to pour liquid onto a surface to be coated of the wafer; an annular duct disposed circumferentially around the wafer when the wafer is spun by the wafer holder, the duct configured to collect material ejected off an edge of the wafer; and an air knife disposed proximate a backside, the backside being opposite the side to be coated, where the air knife is configured to blow an air curtain through a slot onto an exposed edge region of the backside at a grazing angle of incidence to flow gas radially outward along the backside toward the annular duct.

公开(公告)号：US20180096827A1

公开(公告)日：2018-04-05

申请号：US15719294

申请日：2017-09-28

Applicant: Tokyo Electron Limited

Inventor： Anton J. deVilliers ,  Mirko Vukovic ,  Brandon Byrns

IPC: H01J37/32 ,  H01L21/67 ,  H01L21/687 ,  H01L21/3065

CPC classification number: H01J37/32825 ,  H01J37/32183 ,  H01J37/3244 ,  H01J37/32541 ,  H01J37/32715 ,  H01J2237/20214 ,  H01J2237/334 ,  H01L21/3065 ,  H01L21/67069 ,  H01L21/68764

Abstract: Systems and related methods are disclosed for atmospheric plasma processing of microelectronic workpieces, such as semiconductor wafers. For disclosed embodiments, a radio frequency (RF) generator generates an RF signal that is distributed to one or more plasma sources within a process chamber. The process chamber has an atmospheric pressure between 350 to 4000 Torr. The plasma sources are then scanned across a microelectronic workpiece to apply plasma gasses generated by the plasma generators to the microelectronic workpiece. The plasma sources can be individually scanned and/or combined in arrays for scanning across the microelectronic workpiece. Linear and/or angular movement can be applied to the plasma sources and/or the microelectronic workpiece to provide the scanning operation. Various implementations are disclosed.

公开(公告)号：US12105423B2

公开(公告)日：2024-10-01

申请号：US17033489

申请日：2020-09-25

Applicant: Tokyo Electron Limited

Inventor： Mirko Vukovic

IPC: H01J37/20 ,  G03F7/16 ,  H01J37/317 ,  H01L21/67

CPC classification number: G03F7/168 ,  G03F7/162 ,  H01J37/20 ,  H01J37/3174 ,  H01L21/67069 ,  H01J2237/20214 ,  H01J2237/31774

Abstract: A substrate processing system including a processing chamber, a substrate holder configured to hold and rotate a substrate about an axis perpendicular to a working surface of the substrate; an electron emitter adapted to emit a first electron beam directed at a first surface of a peripheral region of the substrate, the first electron beam having a first beam energy and a first beam current sufficient to vaporize material from the first surface of the peripheral region of the substrate; an airflow system configured to direct a flow of gas across the working surface of the substrate; and an exhaust system configured to collect the gas comprising the material vaporized from the peripheral region.

公开(公告)号：US20210109450A1

公开(公告)日：2021-04-15

申请号：US17033489

申请日：2020-09-25

Applicant: Tokyo Electron Limited

Inventor： Mirko Vukovic

IPC: G03F7/16 ,  H01L21/67 ,  H01J37/20 ,  H01J37/317

Abstract: A substrate processing system including a processing chamber, a substrate holder configured to hold and rotate a substrate about an axis perpendicular to a working surface of the substrate; an electron emitter adapted to emit a first electron beam directed at a first surface of a peripheral region of the substrate, the first electron beam having a first beam energy and a first beam current sufficient to vaporize material from the first surface of the peripheral region of the substrate; an airflow system configured to direct a flow of gas across the working surface of the substrate; and an exhaust system configured to collect the gas comprising the material vaporized from the peripheral region.

公开(公告)号：US20240046446A1

公开(公告)日：2024-02-08

申请号：US17881881

申请日：2022-08-05

Applicant: Tokyo Electron Limited

Inventor： Mirko Vukovic ,  Ryan Lloyd

IPC: G06T7/00 ,  G06T7/80

CPC classification number: G06T7/001 ,  G06T7/80 ,  G06T2207/30148 ,  G06T15/00

Abstract: Embodiments of systems and methods are disclosed for inspecting features formed within and/or on a semiconductor substrate. More specifically, the present disclosure provides various embodiments of systems and methods to automatically adjust one or more parameters (or camera settings) used by a camera system to capture a stack of images of a feature formed within and/or on a semiconductor substrate before the images are processed to generate a three-dimensional (3D) reconstruction of the feature. In some embodiments, the disclosed systems and methods may filter the images included within the stack of images used for 3D reconstruction and dynamically determine when the camera system has captured enough images for 3D reconstruction of the feature. In doing so, the disclosed systems and methods may provide a more complete and accurate 3D reconstruction of the feature, while improving throughput of the wafer inspection process.

公开(公告)号：US10426001B2

公开(公告)日：2019-09-24

申请号：US14195005

申请日：2014-03-03

Applicant: Tokyo Electron Limited

Inventor： Ronald Nasman ,  Mirko Vukovic ,  Gerrit J. Leusink ,  Rodney L. Robison ,  Robert D. Clark

IPC: H05B6/80 ,  H01L21/67 ,  H05B6/72 ,  H05B6/70 ,  H01L21/268

Abstract: A processing system is disclosed, having a process chamber that houses a substrate for exposure of a surface of the substrate to a travelling electromagnetic (EM) wave. The processing system also includes an EM wave transmission antenna configured to launch the travelling EM wave into the process chamber for the travelling EM wave to propagate in a direction substantially parallel to the surface of the substrate. The processing system also includes a power coupling system configured to supply EM energy into the EM wave transmission antenna to generate the travelling EM wave at a prescribed output power and in a prescribed EM wave mode during treatment of the substrate. The processing system also includes an EM wave receiving antenna configured to absorb the travelling EM wave after propagation through the process chamber.

公开(公告)号：US10256121B2

公开(公告)日：2019-04-09

申请号：US14792509

申请日：2015-07-06

Applicant: Tokyo Electron Limited

Inventor： Mirko Vukovic ,  Ronald Nasman

IPC: H01L21/67 ,  H01L21/285

Abstract: Embodiments include a method for controlled cooling of a heated stage. The method includes setting a stage coupling to a maximum value and heating the stage to a process temperature. The method includes providing a wafer on the heated stage in a process chamber. The method includes performing a process on the wafer and reducing the heating stage coupling to a predetermined minimum value and reducing the heated stage temperature. The method includes removing the wafer from the heated stage and the process chamber. The heated stage is covered with a plurality of pixels, each pixel of the plurality of pixels include a level of emissivity and are equipped with an emissivity control device configured to independently adjust the level of emissivity of the pixel. The heated stage coupling is configured to achieve a predetermined radiative coupling and control the wafer cooling rate and target temperature.

公开(公告)号：US20180252650A1

公开(公告)日：2018-09-06

申请号：US15448069

申请日：2017-03-02

Applicant: Tokyo Electron Limited

Inventor： Daniel Morvay ,  Taejoon Han ,  Mirko Vukovic

IPC: G01N21/73 ,  H01J37/32 ,  G06T11/00 ,  G01J3/443 ,  H01L21/3065 ,  H01L21/67

CPC classification number: G01N21/73 ,  G01J3/443 ,  G01N21/68 ,  G01N2021/1787 ,  G01N2201/1293 ,  G06T11/003 ,  H01J37/32422 ,  H01J37/32972 ,  H01J2237/334 ,  H01L21/3065 ,  H01L21/67069

Abstract: Described herein are technologies to facilitate computed tomographic techniques to help identifying chemical species during plasma processing of a substrate (e.g., semiconductor wafer) using optical emission spectroscopy (OES). More particularly, the technology described herein uses topographic techniques to spatially resolves emissions and absorptions in at least two-dimension space above the substrate during the plasma processing (e.g., etching) of the substrate. With some implementations utilize optical detectors positioned along multiple axes (e.g., two or more) to receive incident incoming optical spectra from the plasma chamber during the plasma processing (e.g., etching) of the substrate. Because of the multi-axes arrangement, the incident incoming optical spectra form an intersecting grid.

公开(公告)号：US10522384B2

公开(公告)日：2019-12-31

申请号：US15250110

申请日：2016-08-29

Applicant: Tokyo Electron Limited

Inventor： Mirko Vukovic

IPC: H01L21/687 ,  H01P1/38 ,  H01P1/18 ,  H01P3/12 ,  H01P7/06 ,  H01L21/324 ,  H01Q13/22 ,  H01Q21/00 ,  H01L21/67

Abstract: A processing system is disclosed, having a process chamber that houses a substrate for exposure of a surface of the substrate to a travelling electromagnetic (EM) wave. The processing system also includes an EM wave transmission antenna configured to launch the travelling EM wave into the process chamber for the travelling EM wave to propagate in a direction substantially parallel to the surface of the substrate. The processing system also includes a power coupling system configured to supply EM energy into the EM wave transmission antenna to generate the travelling EM wave at a prescribed output power and in a prescribed EM wave mode during treatment of the substrate. The EM wave is recycled in the processing system in order to increase the efficiency of the microwave power use and eliminate the complexity of the resistive load cooling.

公开(公告)号：US20170084462A1

公开(公告)日：2017-03-23

申请号：US15250110

申请日：2016-08-29

Applicant: Tokyo Electron Limited

Inventor： Mirko Vukovic

IPC: H01L21/268 ,  H01P1/18 ,  H03H7/38 ,  H01L21/687 ,  H01P7/06 ,  H01L21/225 ,  H01L21/324 ,  H01P1/38 ,  H01P3/12

CPC classification number: H01L21/68714 ,  H01L21/324 ,  H01L21/67115 ,  H01P1/182 ,  H01P1/38 ,  H01P3/12 ,  H01P7/06 ,  H01Q13/22 ,  H01Q21/0043

Abstract: A processing system is disclosed, having a process chamber that houses a substrate for exposure of a surface of the substrate to a travelling electromagnetic (EM) wave. The processing system also includes an EM wave transmission antenna configured to launch the travelling EM wave into the process chamber for the travelling EM wave to propagate in a direction substantially parallel to the surface of the substrate. The processing system also includes a power coupling system configured to supply EM energy into the EM wave transmission antenna to generate the travelling EM wave at a prescribed output power and in a prescribed EM wave mode during treatment of the substrate. The EM wave is recycled in the processing system in order to increase the efficiency of the microwave power use and eliminate the complexity of the resistive load cooling.