公开(公告)号：US09530676B2

公开(公告)日：2016-12-27

申请号：US13483118

申请日：2012-05-30

申请人： Toshio Yokoyama ,  Junji Kunisawa ,  Mitsuru Miyazaki ,  Kenichi Suzuki ,  Hiroshi Sotozaki

发明人： Toshio Yokoyama ,  Junji Kunisawa ,  Mitsuru Miyazaki ,  Kenichi Suzuki ,  Hiroshi Sotozaki

IPC分类号： H01L21/67 ,  H01L21/677 ,  H01L21/687 ,  B25J11/00

CPC分类号： H01L21/67718 ,  B25J11/0095 ,  H01L21/6704 ,  H01L21/67173 ,  H01L21/67196 ,  H01L21/67219 ,  H01L21/67706 ,  H01L21/67742 ,  H01L21/68707

摘要： A substrate processing apparatus can prevent photo-corrosion of, e.g., copper interconnects due to exposure of a surface to be processed of a substrate to light, and can perform processing, such as cleaning, of a substrate surface while preventing photo-corrosion of, e.g., copper interconnects due to exposure to light. The substrate processing apparatus includes a plurality of processing areas housing therein processing units which have been subjected to light shielding processing; and at least one transfer area housing therein a transfer robot and disposed between two adjacent ones of the plurality of processing areas. A light shielding wall is provided between the transfer area and each of the two adjacent processing areas, and a light-shielding maintenance door is provided for the front opening of the transfer area. The processing units are coupled to the light shielding walls in a light-shielding manner.

摘要翻译： 基板处理装置可以防止由于基板的被处理表面暴露于光而导致的铜互连的光腐蚀，并且可以执行基板表面的处理，例如清洁基板表面，同时防止光蚀刻， 例如，由于曝光而导致的铜互连。 基板处理装置包括容纳其中已进行遮光处理的处理单元的多个处理区域; 以及至少一个传送区域，其中容纳有传送机器人并设置在所述多个处理区域中的两个相邻处理区域之间。 在传送区域和两个相邻的处理区域中的每一个之间设置遮光壁，并且为传送区域的前开口设置遮光维护门。 处理单元以遮光方式耦合到遮光壁。

公开(公告)号：US20090305612A1

公开(公告)日：2009-12-10

申请号：US12457175

申请日：2009-06-03

申请人： Mitsuru Miyazaki ,  Seiji Katsuoka ,  Naoki Matsuda ,  Junji Kunisawa ,  Kenichi Kobayashi ,  Hiroshi Sotozaki ,  Hiroyuki Shinozaki ,  Osamu Nabeya ,  Shinya Morisawa ,  Takahiro Ogawa ,  Natsuki Makino

发明人： Mitsuru Miyazaki ,  Seiji Katsuoka ,  Naoki Matsuda ,  Junji Kunisawa ,  Kenichi Kobayashi ,  Hiroshi Sotozaki ,  Hiroyuki Shinozaki ,  Osamu Nabeya ,  Shinya Morisawa ,  Takahiro Ogawa ,  Natsuki Makino

IPC分类号： B24B51/00 ,  B08B3/00 ,  B08B1/02 ,  F26B5/00

CPC分类号： B24B37/345 ,  H01L21/30625 ,  H01L21/67219 ,  H01L21/67739 ,  H01L21/67742 ,  H01L21/67754 ,  Y10T137/0318 ,  Y10T137/8593

摘要： An apparatus for processing a substrate is disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates.

摘要翻译： 公开了一种用于处理衬底的设备。 该装置包括：抛光部，其被配置为对基板进行抛光;移动机构，被配置为传送基板;以及清洁部，其构造成清洁和干燥被抛光的基板。 清洗部具有多个用于清洗多个基板的清洗线。 多个清洁线具有多个清洁模块和用于传送基板的多个传送机器人。

公开(公告)号：US08795032B2

公开(公告)日：2014-08-05

申请号：US12457175

申请日：2009-06-03

申请人： Mitsuru Miyazaki ,  Seiji Katsuoka ,  Naoki Matsuda ,  Junji Kunisawa ,  Kenichi Kobayashi ,  Hiroshi Sotozaki ,  Hiroyuki Shinozaki ,  Osamu Nabeya ,  Shinya Morisawa ,  Takahiro Ogawa ,  Natsuki Makino

发明人： Mitsuru Miyazaki ,  Seiji Katsuoka ,  Naoki Matsuda ,  Junji Kunisawa ,  Kenichi Kobayashi ,  Hiroshi Sotozaki ,  Hiroyuki Shinozaki ,  Osamu Nabeya ,  Shinya Morisawa ,  Takahiro Ogawa ,  Natsuki Makino

IPC分类号： B24B51/00

CPC分类号： B24B37/345 ,  H01L21/30625 ,  H01L21/67219 ,  H01L21/67739 ,  H01L21/67742 ,  H01L21/67754 ,  Y10T137/0318 ,  Y10T137/8593

摘要： An apparatus for processing a substrate is disclosed. The apparatus includes a polishing section configured to polish a substrate, a transfer mechanism configured to transfer the substrate, and a cleaning section configured to clean and dry the polished substrate. The cleaning section has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules and plural transfer robots for transferring the substrates.

摘要翻译： 公开了一种用于处理衬底的设备。 该装置包括：抛光部，其被配置为对基板进行抛光;移动机构，被配置为传送基板;以及清洁部，其构造成清洁和干燥被研磨的基板。 清洗部具有多个用于清洗多个基板的清洗线。 多个清洁线具有多个清洁模块和用于传送基板的多个传送机器人。

公开(公告)号：US20090067959A1

公开(公告)日：2009-03-12

申请号：US11665963

申请日：2007-02-21

申请人： Nobuyuki Takahashi ,  Hiroaki Nishida ,  Hiroomi Torii ,  Soichi Isobe ,  Tadakazu Sone ,  Ryuichi Kosuge ,  Hiroyuki Kaneko ,  Hiroshi Sotozaki ,  Takao Mitsukura ,  Takahiro Ogawa ,  Kenichi Sugita

发明人： Nobuyuki Takahashi ,  Hiroaki Nishida ,  Hiroomi Torii ,  Soichi Isobe ,  Tadakazu Sone ,  Ryuichi Kosuge ,  Hiroyuki Kaneko ,  Hiroshi Sotozaki ,  Takao Mitsukura ,  Takahiro Ogawa ,  Kenichi Sugita

IPC分类号： H01L21/67

CPC分类号： H01L21/67219 ,  B24B37/345 ,  H01L21/6719 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/67751 ,  H01L21/67766 ,  H01L21/68707

摘要： The present invention relates to a substrate processing apparatus which can improve a tact time of substrate processing. A polishing apparatus as the substrate processing apparatus includes plural polishing sections (3a, 3b) each for polishing a semiconductor wafer (W), and a swing transporter (7) for transferring the wafer (W). The swing transporter (7) includes a wafer clamp mechanism (112) adapted to clamp the wafer (W), a vertically moving mechanism (104, 106) for vertically moving the wafer clamp mechanism (112) along a frame (102) of a casing of the polishing section (3a), and a swing mechanism (108, 110) for swinging the wafer clamp mechanism (112) about a shaft adjacent to the frame (102).

摘要翻译： 本发明涉及能够提高基板处理的节拍时间的基板处理装置。 作为基板处理装置的研磨装置包括：用于研磨半导体晶片（W）的多个研磨部（3a，3b）和用于转印晶片（W）的摆动传送装置（7）。 摆动传送器（7）包括适于夹紧晶片（W）的晶片夹紧机构（112），用于沿着晶片夹持机构（102）的框架（102）垂直移动的垂直移动机构（104,106） 抛光部分（3a）的外壳和用于使晶片夹紧机构（112）围绕与框架（102）相邻的轴摆动的摆动机构（108,110）。

公开(公告)号：US06851152B2

公开(公告)日：2005-02-08

申请号：US09924464

申请日：2001-08-09

申请人： Hiroshi Sotozaki ,  Fumitoshi Oikawa

发明人： Hiroshi Sotozaki ,  Fumitoshi Oikawa

IPC分类号： B08B1/04 ,  B08B3/02 ,  B08B7/04 ,  B24D13/10 ,  H01L21/00 ,  H01L21/304 ,  A47L25/00

CPC分类号： H01L21/67051 ,  B08B1/04 ,  H01L21/67046

摘要： A substrate cleaning apparatus allows an end face and/or a bevel face of a substrate to be scrub-cleaned in a simple and effective manner. The apparatus has a plurality of rotatable substrate rotating rollers for gripping a periphery of the substrate and rotating the substrate, a cleaning roller capable of rotating and having a cleaning member which is to be brought into contact with the end face and/or the bevel face of the substrate so as to apply scrub-cleaning to the end face and/or the bevel face, and a power transmission mechanism for transmitting a rotating force of the substrate rotating roller to the cleaning roller so as to rotate the cleaning roller.

摘要翻译： 基板清洁装置允许以简单且有效的方式擦洗基板的端面和/或斜面。 该装置具有多个可旋转的基板旋转辊，用于夹持基板的周边并旋转基板，能够旋转并具有与端面和/或斜面接触的清洁构件的清洁辊 的基板，以便对端面和/或斜面施加擦洗;以及动力传递机构，用于将基板旋转辊的旋转力传递到清洁辊，以使清洁辊旋转。

公开(公告)号：US07850817B2

公开(公告)日：2010-12-14

申请号：US10481001

申请日：2003-04-09

申请人： Satoshi Wakabayashi ,  Tetsuji Togawa ,  Ryuichi Kosuge ,  Koji Ato ,  Hiroshi Sotozaki

发明人： Satoshi Wakabayashi ,  Tetsuji Togawa ,  Ryuichi Kosuge ,  Koji Ato ,  Hiroshi Sotozaki

IPC分类号： C23F1/00

CPC分类号： B24B37/345 ,  H01L21/67219 ,  H01L21/67745 ,  H01L21/67751 ,  H01L21/67766 ,  H01L21/68707

摘要： A polishing apparatus has a plurality of polishing units. Moving mechanisms for moving top rings between polishing positions on polishing surfaces and wafer receiving/delivering positions are provided in each of the polishing units. Linear transporters are provided for transferring a wafer between a plurality of transferring positions including the wafer receiving/delivering positions. Pushers for receiving and delivering the wafer between the linear transporters and the top rings are provided at the transferring positions as the wafer receiving/delivering positions.

摘要翻译： 抛光装置具有多个抛光单元。 在每个抛光单元中设置有用于在抛光表面上的抛光位置和晶片接收/传送位置之间移动顶环的移动机构。 提供线性转运器用于在包括晶片接收/传送位置的多个传送位置之间传送晶片。 用于在线性运送器和顶环之间接收和输送晶片的推动器设置在作为晶片接收/传送位置的转移位置处。

公开(公告)号：US06643882B1

公开(公告)日：2003-11-11

申请号：US09594787

申请日：2000-06-16

申请人： Hiroshi Sotozaki ,  Koji Atoh ,  Yuki Inoue ,  Tatsuo Inoue

发明人： Hiroshi Sotozaki ,  Koji Atoh ,  Yuki Inoue ,  Tatsuo Inoue

IPC分类号： B08B104

CPC分类号： H01L21/67051 ,  B08B1/007 ,  B08B1/04 ,  B08B3/024 ,  H01L21/67046

摘要： A substrate cleaning apparatus for cleaning a rotating substrate has a scrub cleaning tool for cleaning the substrate by bringing the cleaning tool into contact with the substrate, a liquid jet spray nozzle for cleaning the substrate by yet-spraying a cleaning liquid from the nozzle to the substrate, and a swing mechanism for simultaneously swinging both of the scrub cleaning tool and the liquid jet spray nozzle on and above the substrate. The substrate cleaning apparatus also has a cleaning tool vertical driving mechanism for moving at least the cleaning tool from a position where the cleaning tool is in contact with a surface of the substrate to another position where the cleaning liquid jet-sprayed from the nozzle is applied to the cleaning tool, by vertically moving the cleaning tool.

摘要翻译： 用于清洁旋转基板的基板清洁装置具有擦洗清洁工具，用于通过使清洁工具与基板接触来清洁基板;液体喷射喷嘴，用于通过从喷嘴喷射清洁液体至 基板和用于同时摆动洗涤清洁工具和液体喷射喷嘴在基板上和上方的摆动机构。 基板清洁装置还具有清洁工具垂直驱动机构，用于至少将清洁工具从清洁工具与基板的表面接触的位置移动到施加从喷嘴喷射的清洁液体的另一位置 通过垂直移动清洁工具到清洁工具。

公开(公告)号：US20120193506A1

公开(公告)日：2012-08-02

申请号：US13404409

申请日：2012-02-24

申请人： Nobuyuki TAKAHASHI ,  Hiroaki Nishida ,  Hiroomi Torii ,  Soichi Isobe ,  Tadakazu Sone ,  Ryuichi Kosuge ,  Hiroyuki Kaneko ,  Hiroshi Sotozaki ,  Takao Mitsukura ,  Takahiro Ogawa ,  Kenichi Sugita

发明人： Nobuyuki TAKAHASHI ,  Hiroaki Nishida ,  Hiroomi Torii ,  Soichi Isobe ,  Tadakazu Sone ,  Ryuichi Kosuge ,  Hiroyuki Kaneko ,  Hiroshi Sotozaki ,  Takao Mitsukura ,  Takahiro Ogawa ,  Kenichi Sugita

IPC分类号： F16M11/20

CPC分类号： H01L21/67219 ,  B24B37/345 ,  H01L21/6719 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/67751 ,  H01L21/67766 ,  H01L21/68707

摘要： The present invention relates to a substrate processing apparatus which can improve a tact time of substrate processing. A polishing apparatus as the substrate processing apparatus includes plural polishing sections each for polishing a semiconductor wafer (W), and a swing transporter for transferring the wafer (W). The swing transporter includes a wafer clamp mechanism adapted to clamp the wafer (W), a vertically moving mechanism for vertically moving the wafer clamp mechanism along a frame of a casing of the polishing section, and a swing mechanism for swinging the wafer clamp mechanism about a shaft adjacent to the frame.

摘要翻译： 本发明涉及能够提高基板处理的节拍时间的基板处理装置。 作为基板处理设备的抛光装置包括用于抛光半导体晶片（W）的多个抛光部分和用于传送晶片（W）的摆动传送器。 摆动传送器包括适于夹紧晶片（W）的晶片夹持机构，用于沿着抛光部分的壳体的框架垂直移动晶片夹持机构的垂直移动机构，以及用于使晶片夹紧机构摆动的摆动机构 靠近框架的轴。

公开(公告)号：US06616512B2

公开(公告)日：2003-09-09

申请号：US09915289

申请日：2001-07-27

申请人： Hiroshi Sotozaki

发明人： Hiroshi Sotozaki

IPC分类号： B24B100

CPC分类号： B24B37/345 ,  H01L21/67051

摘要： A substrate cleaning apparatus is provided which comprises a box in which a substrate is cleaned with a cleaning liquid, and an exhaust system for exhausting the box, wherein the box is provided in its upper wall with an air intake opening and the exhaust system is fluidly connected to the box at a lower wall of the box so that air is introduced into the box through the air intake opening, flows down in the box passing around the substrate and finally exits the box through the exhaust system. A door is provided to close the air intake opening when an inside air pressure in the box becomes greater than an outside air pressure outside the box.

摘要翻译： 提供了一种基板清洁装置，其包括其中用清洗液清洁基板的盒子和用于排出箱子的排气系统，其中该箱体在其上壁上设置有进气口，并且排气系统是流体 在盒子的下壁连接到盒子，使得空气通过进气口引入箱中，在通过基板的箱中向下流动，最后通过排气系统离开箱体。 当箱体内部的空气压力变得大于箱外的外部空气压力时，提供一个关闭进气口的门。

公开(公告)号：US06494985B1

公开(公告)日：2002-12-17

申请号：US09434482

申请日：1999-11-05

申请人： Hiroshi Sotozaki ,  Koji Ato

发明人： Hiroshi Sotozaki ,  Koji Ato

IPC分类号： B24B4900

CPC分类号： B24B37/345 ,  B24B51/00 ,  H01L21/02052 ,  H01L21/02057 ,  H01L21/30625 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/67219

摘要： A substrate such as a semiconductor wafer, a glass substrate, or a liquid crystal display is polished to a flat mirror finish, and then cleaning a polished substrate that is cleaned to a high degree of cleanliness. A polishing section having at least one polishing unit for performs primary polishing and secondary polishing of the substrate by pressing the substrate against a polishing surface. A cleaning section cleans the substrate which has been polished to remove particles attached to the substrate by a scrubbing cleaning. Metal ions are removed from the substrate by supplying an etching liquid.

摘要翻译： 将诸如半导体晶片，玻璃基板或液晶显示器之类的基板抛光到平面镜面，然后清洁被清洁的抛光的基板以达到高清洁度。 一种具有至少一个抛光单元的抛光部分，用于通过将衬底压靠在抛光表面上进行一次抛光和二次抛光。 清洁部分通过洗涤清洁来清洁已经被抛光的基底以去除附着到基底上的颗粒。 通过提供蚀刻液体从基板去除金属离子。