摘要:
There is provided a displacement measuring apparatus efficiently productive and easily applicable to high precise measurement of displacement with contact probe detection for hardly-measurable works in the art such as micro-works and deep parts in complicated structures. A scale member includes a spindle and a scale both supported by a parallel leaf spring movable on a scale substrate. The spindle is arranged in coaxial with a measurement axis in the scale member. The L & S slit-processed scale is integrated with the spindle and supported by the parallel leaf spring to move together with the spindle along the measurement axis. The spindle, scale and parallel leaf spring are coupled to the scale substrate interposing an anchor of the parallel leaf spring therebetween. The spindle, scale and parallel leaf spring are formed in an integral structure and only the anchor contacts the scale substrate while the spindle, scale and parallel leaf spring slightly float from the scale substrate. A displacement sensor comprises a sensor substrate arranged opposite to the scale substrate. A light source and a photosensitive device are located on the sensor substrate.
摘要:
A semiconductor device allowing reduction in area occupied by a bipolar transistor as well as a method of manufacturing the same are obtained. The semiconductor device includes a substrate, first conductivity type regions, a collector region, base regions and emitter regions. The first conductivity type region is formed on the substrate, and has a main surface. The collector region is formed in the first conductivity type region. The base region is located in the first conductivity type region and on the collector region. The emitter region is located in the first conductivity type region and on the base region. The first conductivity type region is provided with grooves extending to the collector region, and isolation grooves disposed around a vertical bipolar transistor. The grooves are filled with conductors of the second conductivity type. The isolation grooves are filled with isolation conductors of the second conductivity type.
摘要:
An implementation base (10) is formed of a silicon substrate (11) having a recess (12) on a surface. Wire layers (13) are formed on the silicon substrate (11), continuously extending from the bottom of and via the side of the recess (12) to the top surface. A semiconductor chip (14) is implemented in the recess (12) of the implementation base (10) in a flip-chip manner to configure a functional device unit.
摘要:
A transmission electrode 10 and a detection electrode 12 are placed in an electrode section of a sensor and are capacity-coupled with a reception electrode placed on an opposed scale. Capacity change between the transmission electrode 10 and the reception electrode caused by displacement is detected with the detection electrode 12. A plurality of signals different in phase are supplied to the transmission electrode 10. The signal lines are wired like a zigzag using an upper layer and a lower layer and the distances between the signal lines and the detection electrode 12 are made substantially equal for making uniform the crosstalk amounts relative to the detection electrode 12.
摘要:
A scale for a photoelectric encoder effectively protects the base of the scale from corrosion, rust, and flaws. The scale includes a base, a light-absorbing layer including a DLC layer formed on at least one surface of the base, and light-reflecting layers with a higher reflectance than that of the light-absorbing layer with respect to light falling within a wavelength range and formed into a grating on the light-absorbing layer.
摘要:
On the side of a first main surface of a module base, a transmitter is provided which includes wiring patterns formed on the first main surface and electronic components provided on the wiring patterns. On the side of a second main surface of the module base, a receiver is provided which includes wiring patterns formed on the second main surface and electronic components provided on the wiring patterns. A motherboard has an opening formed therein, and an electronic circuit module is mounted on the motherboard, with the receiver inserted into the opening.
摘要:
A first AGC voltage and a second AGC voltage are taken from the final stage of a radio-frequency circuit and the output side of a bandpass filter, respectively, and the gain of the radio-frequency circuit is controlled on the basis of the two AGC voltages. The pass-band width of the bandpass filter is approximately two times greater than the frequency interval of FM broadcast signals. The second AGC voltage is set higher than the first AGC voltage in the pass-band of the bandpass filter.
摘要:
A semiconductor device in which at least one IIL transistor is formed, the semiconductor device having, a base region (6) provided against a semiconductor substrate (1), a plurality of collector regions (9) formed in the base region (6), each of the collector regions (9) aligning in a direction parallel to a spreading surface of the semiconductor substrate (1), and a metal wiring having a plurality of contact portions (10), each of the contact portions being connected electrically to predetermined one of the collector regions (9), characterized in that, each of the contact portions of the metal wiring (10) is connected electrically to the collector region (9) corresponding thereto via a polysilicon cap (11) formed so as to cover the collector region (9).
摘要:
A reflection type encoder, which receives a plurality of light-receiving signals from a single scale, includes a light source, a scale having a plurality of patterns formed thereon to which light is irradiated from the light source, and a light-receiving element for receiving light reflected from each of the plurality of patterns, wherein a plurality of patterns each having different thicknesses are formed on a single track of the scale by using a dielectric substance, light of a plurality of wavelengths each having different brightnesses in accordance with differences in the thickness of the dielectric substance is irradiated from the light source, and a light-receiving signal is obtained for the respective thicknesses of the dielectric substance. Therefore, the scale can be downsized by overlapping a plurality of patterns on the same track.
摘要:
A sensor block that includes a plurality of sensor chips in combination. Each sensor chip includes a semiconductor substrate having a detection unit formed therein, and two glass substrates bonded to both sides of the semiconductor substrate. One of the glass substrates is shared among the sensor chips and serves as a base block to support the sensor chips.