Lateral power MOSFET with high breakdown voltage and low on-resistance
    1.
    发明授权
    Lateral power MOSFET with high breakdown voltage and low on-resistance 有权
    具有高击穿电压和低导通电阻的侧向功率MOSFET

    公开(公告)号:US07989890B2

    公开(公告)日:2011-08-02

    申请号:US12205961

    申请日:2008-09-08

    IPC分类号: H01L29/78

    摘要: A semiconductor structure includes a semiconductor substrate of a first conductivity type; a pre-high-voltage well (pre-HVW) in the semiconductor substrate, wherein the pre-HVW is of a second conductivity type opposite the first conductivity type; a high-voltage well (HVW) over the pre-HVW, wherein the HVW is of the second conductivity type; a field ring in the HVW and occupying a top portion of the HVW, wherein the field ring is of the first conductivity type; an insulation region over and in contact with the field ring and a portion of the HVW; a gate electrode partially over the insulation region; a drain region in the HVW, wherein the drain region is of the second conductivity type; and wherein the HVW horizontally extends further toward the drain region than the pre-HVW; and a source region adjacent to, and on an opposite side of the gate electrode than the drain region.

    摘要翻译: 半导体结构包括第一导电类型的半导体衬底; 在所述半导体衬底中的预高压阱(预HVW),其中所述预HVW具有与所​​述第一导电类型相反的第二导电类型; 在HVW之前的高压井(HVW),其中HVW是第二导电类型; HVW中的场环,占据HVW的顶部,其中场环是第一导电类型; 与场环和HVW的一部分接触的绝缘区域; 位于所述绝缘区域上的栅电极; 所述HVW中的漏极区域,其中所述漏极区域是所述第二导电类型; 并且其中所述HVW水平地延伸到所述漏极区域比所述预HVW; 以及与漏极区域相邻并且在与栅极电极相反的一侧的源极区域。

    Lateral power MOSFET with high breakdown voltage and low on-resistance
    2.
    发明授权
    Lateral power MOSFET with high breakdown voltage and low on-resistance 有权
    具有高击穿电压和低导通电阻的侧向功率MOSFET

    公开(公告)号:US08389341B2

    公开(公告)日:2013-03-05

    申请号:US13175246

    申请日:2011-07-01

    IPC分类号: H01L21/336

    摘要: A semiconductor structure includes a semiconductor substrate of a first conductivity type; a pre-high-voltage well (pre-HVW) in the semiconductor substrate, wherein the pre-HVW is of a second conductivity type opposite the first conductivity type; a high-voltage well (HVW) over the pre-HVW, wherein the HVW is of the second conductivity type; a field ring in the HVW and occupying a top portion of the HVW, wherein the field ring is of the first conductivity type; an insulation region over and in contact with the field ring and a portion of the HVW; a gate electrode partially over the insulation region; a drain region in the HVW, wherein the drain region is of the second conductivity type; and wherein the HVW horizontally extends further toward the drain region than the pre-HVW; and a source region adjacent to, and on an opposite side of the gate electrode than the drain region.

    摘要翻译: 半导体结构包括第一导电类型的半导体衬底; 在所述半导体衬底中的预高压阱(预HVW),其中所述预HVW具有与所​​述第一导电类型相反的第二导电类型; 在HVW之前的高压井(HVW),其中HVW是第二导电类型; HVW中的场环,占据HVW的顶部,其中场环是第一导电类型; 与场环和HVW的一部分接触的绝缘区域; 位于所述绝缘区域上的栅电极; 所述HVW中的漏极区域,其中所述漏极区域是所述第二导电类型; 并且其中所述HVW水平地延伸到所述漏极区域比所述预HVW; 以及与漏极区域相邻并且在与栅极电极相反的一侧的源极区域。

    Lateral Power MOSFET with High Breakdown Voltage and Low On-Resistance
    3.
    发明申请
    Lateral Power MOSFET with High Breakdown Voltage and Low On-Resistance 有权
    具有高击穿电压和低导通电阻的侧向功率MOSFET

    公开(公告)号:US20120003803A1

    公开(公告)日:2012-01-05

    申请号:US13175246

    申请日:2011-07-01

    IPC分类号: H01L21/336

    摘要: A semiconductor structure includes a semiconductor substrate of a first conductivity type; a pre-high-voltage well (pre-HVW) in the semiconductor substrate, wherein the pre-HVW is of a second conductivity type opposite the first conductivity type; a high-voltage well (HVW) over the pre-HVW, wherein the HVW is of the second conductivity type; a field ring in the HVW and occupying a top portion of the HVW, wherein the field ring is of the first conductivity type; an insulation region over and in contact with the field ring and a portion of the HVW; a gate electrode partially over the insulation region; a drain region in the HVW, wherein the drain region is of the second conductivity type; and wherein the HVW horizontally extends further toward the drain region than the pre-HVW; and a source region adjacent to, and on an opposite side of the gate electrode than the drain region.

    摘要翻译: 半导体结构包括第一导电类型的半导体衬底; 在所述半导体衬底中的预高压阱(预HVW),其中所述预HVW具有与所​​述第一导电类型相反的第二导电类型; 在HVW之前的高压井(HVW),其中HVW是第二导电类型; HVW中的场环,占据HVW的顶部,其中场环是第一导电类型; 与场环和HVW的一部分接触的绝缘区域; 位于所述绝缘区域上的栅电极; 所述HVW中的漏极区域,其中所述漏极区域是所述第二导电类型; 并且其中所述HVW水平地延伸到所述漏极区域比所述预HVW; 以及与漏极区域相邻并且在与栅极电极相反的一侧的源极区域。

    Lateral Power MOSFET with High Breakdown Voltage and Low On-Resistance
    4.
    发明申请
    Lateral Power MOSFET with High Breakdown Voltage and Low On-Resistance 有权
    具有高击穿电压和低导通电阻的侧向功率MOSFET

    公开(公告)号:US20090001462A1

    公开(公告)日:2009-01-01

    申请号:US12205961

    申请日:2008-09-08

    IPC分类号: H01L29/76

    摘要: A semiconductor structure includes a semiconductor substrate of a first conductivity type; a pre-high-voltage well (pre-HVW) in the semiconductor substrate, wherein the pre-HVW is of a second conductivity type opposite the first conductivity type; a high-voltage well (HVW) over the pre-HVW, wherein the HVW is of the second conductivity type; a field ring in the HVW and occupying a top portion of the HVW, wherein the field ring is of the first conductivity type; an insulation region over and in contact with the field ring and a portion of the HVW; a gate electrode partially over the insulation region; a drain region in the HVW, wherein the drain region is of the second conductivity type; and wherein the HVW horizontally extends further toward the drain region than the pre-HVW; and a source region adjacent to, and on an opposite side of the gate electrode than the drain region.

    摘要翻译: 半导体结构包括第一导电类型的半导体衬底; 在所述半导体衬底中的预高压阱(预HVW),其中所述预HVW具有与所​​述第一导电类型相反的第二导电类型; 在HVW之前的高压井(HVW),其中HVW是第二导电类型; HVW中的场环,占据HVW的顶部,其中场环是第一导电类型; 与场环和HVW的一部分接触的绝缘区域; 位于所述绝缘区域上的栅电极; 所述HVW中的漏极区域,其中所述漏极区域是所述第二导电类型; 并且其中所述HVW水平地延伸到所述漏极区域比所述预HVW; 以及与漏极区域相邻并且在与栅极电极相反的一侧的源极区域。

    Breakdown voltages of ultra-high voltage devices by forming tunnels
    7.
    发明授权
    Breakdown voltages of ultra-high voltage devices by forming tunnels 有权
    通过形成隧道的超高压装置的击穿电压

    公开(公告)号:US07960786B2

    公开(公告)日:2011-06-14

    申请号:US12170246

    申请日:2008-07-09

    IPC分类号: H01L29/78

    摘要: A semiconductor structure includes a semiconductor substrate of a first conductivity type; a pre-high-voltage well (pre-HVW) in the semiconductor substrate, wherein the pre-HVW is of a second conductivity type opposite the first conductivity type; a high-voltage well (HVW) over the pre-HVW, wherein the HVW is of the second conductivity type; a field ring of the first conductivity type occupying a top portion of the HVW, wherein at least one of the pre-HVW, the HVW, and the field ring comprises at least two tunnels; an insulation region over the field ring and a portion of the HVW; a drain region in the HVW and adjacent the insulation region; a gate electrode over a portion the insulation region; and a source region on an opposite side of the gate electrode than the drain region.

    摘要翻译: 半导体结构包括第一导电类型的半导体衬底; 在所述半导体衬底中的预高压阱(预HVW),其中所述预HVW具有与所​​述第一导电类型相反的第二导电类型; 在HVW之前的高压井(HVW),其中HVW是第二导电类型; 所述第一导电类型的场环占据所述HVW的顶部部分,其中所述预HVW,所述HVW和所述场环中的至少一个包括至少两个隧道; 在场环上的绝缘区域和HVW的一部分; 在HVW中的漏极区域并且邻近绝缘区域; 绝缘区域的一部分上的栅电极; 以及栅极电极的与漏极区域相反的一侧的源极区域。

    Breakdown Voltages of Ultra-High Voltage Devices By Forming Tunnels
    8.
    发明申请
    Breakdown Voltages of Ultra-High Voltage Devices By Forming Tunnels 有权
    通过形成隧道的超高压器件的故障电压

    公开(公告)号:US20100006935A1

    公开(公告)日:2010-01-14

    申请号:US12170246

    申请日:2008-07-09

    IPC分类号: H01L29/78

    摘要: A semiconductor structure includes a semiconductor substrate of a first conductivity type; a pre-high-voltage well (pre-HVW) in the semiconductor substrate, wherein the pre-HVW is of a second conductivity type opposite the first conductivity type; a high-voltage well (HVW) over the pre-HVW, wherein the HVW is of the second conductivity type; a field ring of the first conductivity type occupying a top portion of the HVW, wherein at least one of the pre-HVW, the HVW, and the field ring comprises at least two tunnels; an insulation region over the field ring and a portion of the HVW; a drain region in the HVW and adjacent the insulation region; a gate electrode over a portion the insulation region; and a source region on an opposite side of the gate electrode than the drain region.

    摘要翻译: 半导体结构包括第一导电类型的半导体衬底; 在所述半导体衬底中的预高压阱(预HVW),其中所述预HVW具有与所​​述第一导电类型相反的第二导电类型; 在HVW之前的高压井(HVW),其中HVW是第二导电类型; 所述第一导电类型的场环占据所述HVW的顶部部分,其中所述预HVW,所述HVW和所述场环中的至少一个包括至少两个隧道; 在场环上的绝缘区域和HVW的一部分; 在HVW中的漏极区域并且邻近绝缘区域; 绝缘区域的一部分上的栅电极; 以及栅极电极的与漏极区域相反的一侧的源极区域。