COMPOSITION FOR FORMING POROUS FILM, POROUS FILM AND METHOD FOR FORMING THE SAME, INTERLEVEL INSULATOR FILM, AND SEMICONDUCTOR DEVICE
    3.
    发明申请
    COMPOSITION FOR FORMING POROUS FILM, POROUS FILM AND METHOD FOR FORMING THE SAME, INTERLEVEL INSULATOR FILM, AND SEMICONDUCTOR DEVICE 审中-公开
    用于形成多孔膜的组合物,多孔膜及其形成方法,间隔绝缘膜和半导体器件

    公开(公告)号:US20070135565A1

    公开(公告)日:2007-06-14

    申请号:US11549731

    申请日:2006-10-16

    IPC分类号: C08L83/04

    摘要: Provided are a composition for forming film which can form porous film excelling in dielectric constant, adhesiveness, uniformity of the film, mechanical strength and having low hygroscopicity; porous film and a method for forming the film; and a high-performing and highly reliable semiconductor device comprising the porous film inside. More specifically, provided is a composition for forming porous film, the composition comprising siloxane polymer and one or more quaternary ammonium salts represented by following formula (1) or (2): [(R1)4N]+[R2X]−  (1) Hk[(R1)4N]m+Yn−  (2) wherein X represents CO2, OSO3 or SO3; Y represents SO4, SO3, CO3, O2C—CO2, NO3 or NO2; and k is 0 or 1, m is 1 or 2 and n is 1 or 2 in proviso that n=1 requires k=0 and m=1, and n=2 requires k=0 and m=2, or k=1 and m=1.

    摘要翻译: 提供一种形成膜的组合物,其可以形成介电常数,粘合性,膜均匀性,机械强度和吸湿性低的多孔膜; 多孔膜和形成膜的方法; 以及内部具有多孔膜的高性能,高可靠性的半导体装置。 更具体地说,提供了一种用于形成多孔膜的组合物,该组合物包含硅氧烷聚合物和一种或多种由下式(1)或(2)表示的季铵盐:<?在线公式描述=“在线式 “end =”lead“?> [(R&lt; 1&lt; 1&gt;)&lt; 4&lt; N&gt;&lt; (1)<?in-line-formula description =“In-line Formulas”end =“tail”?> <?in-line-formula description =“In-line Formulas”end = “铅”?> k k k>>>>>> / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / (2)<?in-line-formula description =“In-line Formulas”end =“tail”?>其中X表示CO 2 2, OSO 3或SO 3 3; Y表示SO 4,SO 3,CO 3,O 2,CO 2, 3,NO 3或NO 2; 并且k为0或1,m为1或2,n为1或2,条件是n = 1需要k = 0且m = 1,n = 2需要k = 0且m = 2,或k = 1 m = 1。

    Composition for forming porous film, porous film and method for forming the same, interlevel insulator film, and semiconductor device
    4.
    发明授权
    Composition for forming porous film, porous film and method for forming the same, interlevel insulator film, and semiconductor device 有权
    用于形成多孔膜的组合物,多孔膜及其形成方法,层间绝缘膜和半导体器件

    公开(公告)号:US07132473B2

    公开(公告)日:2006-11-07

    申请号:US10706862

    申请日:2003-11-12

    IPC分类号: C08G77/04 C09D183/04

    摘要: Provided are a composition for forming film which can form porous film excelling in dielectric constant, adhesiveness, uniformity of the film, mechanical strength and having low hygroscopicity; porous film and a method for forming the film; and a high-performing and highly reliable semiconductor device comprising the porous film inside. More specifically, provided is a composition for forming porous film, the composition comprising siloxane polymer and one or more quaternary ammonium salts represented by following formula (1) or (2): [(R1)4N]+[R2X]−  (1) Hk[(R1)4N]m+YV−  (2) wherein X represents CO2, OSO3 or SO3; Y represents SO4, SO3, CO3, O2C—CO2, NO3 or NO2; and k is 0 or 1, m is 1 or 2 and n is 1 or 2 in proviso that n=1 requires k=0 and m=1, and n=2 requires k=0 and m=2, or k=1 and m=1.

    摘要翻译: 提供一种形成膜的组合物,其可以形成介电常数,粘合性,膜均匀性,机械强度和吸湿性低的多孔膜; 多孔膜和形成膜的方法; 以及内部具有多孔膜的高性能,高可靠性的半导体装置。 更具体地说,提供了一种用于形成多孔膜的组合物,该组合物包含硅氧烷聚合物和一种或多种由下式(1)或(2)表示的季铵盐:<?在线公式描述=“在线式 “end =”lead“?> [(R&lt; 1&lt; 1&gt;)&lt; 4&lt; N&gt;&lt; (1)<?in-line-formula description =“In-line Formulas”end =“tail”?> <?in-line-formula description =“In-line Formulas”end = “铅”?> k k k>>>>>> / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / (2)<?in-line-formula description =“In-line Formulas”end =“tail”?>其中X表示CO 2, OSO 3或SO 3 3; Y表示SO 4,SO 3,CO 3,O 2,CO 2, 3,NO 3或NO 2; 并且k为0或1,m为1或2,n为1或2,条件是n = 1需要k = 0且m = 1,n = 2需要k = 0且m = 2或k = 1 m = 1。

    Porous-film-forming composition, preparation method of the composition, porous film and semiconductor device
    5.
    发明授权
    Porous-film-forming composition, preparation method of the composition, porous film and semiconductor device 有权
    多孔膜形成组合物,组合物的制备方法,多孔膜和半导体器件

    公开(公告)号:US07402621B2

    公开(公告)日:2008-07-22

    申请号:US11041780

    申请日:2005-01-24

    IPC分类号: C08G77/06

    摘要: The invention provides a coating solution for forming a porous film having excellent mechanical strength and dielectric properties and for easily forming a film with a freely controlled film thickness in an ordinarily employed method in semiconductor process. More specifically, provided are a method for preparing a porous-film-forming composition comprising steps of preparing polysiloxane, silica or zeolite particles (Component A), imparting crosslinkability to Component A, and temporarily terminating the crosslinkability; and a porous-film-forming composition obtainable in this method. In addition, provided is a method of forming a porous film comprising steps of preparing a porous-film-forming composition by preparing Component A, imparting crosslinkability to Component A and adding a crosslinkability inhibitor to temporarily terminate the crosslinkability; applying the porous-film-forming composition onto a substrate to form a film, drying the film, crosslinking the particles along with removing the crosslinkability inhibitor by heating the dried film.

    摘要翻译: 本发明提供一种用于形成具有优异的机械强度和介电性能的多孔膜的涂布溶液,并且在半导体工艺中通常采用的方法容易地形成具有自由控制的膜厚度的膜。 更具体地说,提供了制备多孔膜形成组合物的方法,其包括制备聚硅氧烷,二氧化硅或沸石颗粒(组分A)的步骤,赋予组分A交联性,并暂时终止交联性; 和通过该方法得到的多孔膜形成组合物。 此外,提供了形成多孔膜的方法,其包括通过制备组分A制备多孔膜形成组合物,赋予组分A交联性并加入交联性抑制剂以暂时终止交联性; 将多孔膜形成组合物施加到基材上以形成膜,干燥膜,使颗粒交联,同时通过加热干燥膜除去交联性抑制剂。

    Porous-film-forming composition, preparation method of the composition, porous film and semiconductor device
    6.
    发明申请
    Porous-film-forming composition, preparation method of the composition, porous film and semiconductor device 有权
    多孔膜形成组合物,组合物的制备方法,多孔膜和半导体器件

    公开(公告)号:US20050165197A1

    公开(公告)日:2005-07-28

    申请号:US11041780

    申请日:2005-01-24

    摘要: The invention provides a coating solution for forming a porous film having excellent mechanical strength and dielectric properties and for easily forming a film with a freely controlled film thickness in an ordinarily employed method in semiconductor process. More specifically, provided are a method for preparing a porous-film-forming composition comprising steps of preparing polysiloxane, silica or zeolite particles (Component A), imparting crosslinkability to Component A, and temporarily terminating the crosslinkability; and a porous-film-forming composition obtainable in this method. In addition, provided is a method of forming a porous film comprising steps of preparing a porous-film-forming composition by preparing Component A, imparting crosslinkability to Component A and adding a crosslinkability inhibitor to temporarily terminate the crosslinkability; applying the porous-film-forming composition onto a substrate to form a film, drying the film, crosslinking the particles along with removing the crosslinkability inhibitor by heating the dried film.

    摘要翻译: 本发明提供一种用于形成具有优异的机械强度和介电性能的多孔膜的涂布溶液,并且在半导体工艺中通常采用的方法容易地形成具有自由控制的膜厚度的膜。 更具体地说,提供了制备多孔膜形成组合物的方法,其包括制备聚硅氧烷,二氧化硅或沸石颗粒(组分A)的步骤,赋予组分A交联性,并暂时终止交联性; 和通过该方法得到的多孔膜形成组合物。 此外,提供了形成多孔膜的方法,其包括通过制备组分A制备多孔膜形成组合物,赋予组分A交联性并添加交联性抑制剂以暂时终止交联性的步骤; 将多孔膜形成组合物施加到基材上以形成膜,干燥膜,使颗粒交联,同时通过加热干燥膜除去交联性抑制剂。

    Composition for forming porous film, porous film and method for forming the same, interlevel insulator film, and semiconductor device
    7.
    发明授权
    Composition for forming porous film, porous film and method for forming the same, interlevel insulator film, and semiconductor device 有权
    用于形成多孔膜的组合物,多孔膜及其形成方法,层间绝缘膜和半导体器件

    公开(公告)号:US07357961B2

    公开(公告)日:2008-04-15

    申请号:US10819544

    申请日:2004-04-07

    IPC分类号: C08G77/06 B05D3/02

    摘要: Provided are a film formation composition which can produce a film having high strength and low dielectric constant, a method for manufacturing the same, a method for forming a porous film, a porous film, and a semiconductor device containing the porous film internally. More specifically provided is a film formation composition, comprising a polymer which is obtainable by hydrolysis and condensation of one or more hydrolysable silane compounds in the presence of anionic ion exchange resin, wherein the hydrolysable silane compound is selected from the group consisting of Formulae (1) and (2): (R1)aSi(R2)4-a  (1) (R3)b(R5)3-bSi—R7—Si(R6)3-c(R4)c  (2) wherein R1, R3 and R4 each independently represents a monovalent hydrocarbon group which may have a substituent; R2, R5 and R6 each independently represents a hydrolyzable group; R7 represents a divalent organic group; a represents an integer of 0 to 3; and b and c each represents an integer of 1 or 2.

    摘要翻译: 本发明提供一种成膜组合物,其可以制造具有高强度和低介电常数的膜,其制造方法,多孔膜形成方法,多孔膜和在内部含有多孔膜的半导体器件。 更具体地提供了一种成膜组合物,其包含通过在阴离子离子交换树脂的存在下水解和缩合一种或多种可水解硅烷化合物而获得的聚合物,其中可水解硅烷化合物选自由式(1) )和(2):<?in-line-formula description =“In-line Formulas”end =“lead”?(R&lt; 1&gt;)&lt; 4-a(1)<?in-line-formula description =“In-line Formulas”end =“tail”?> <?in-line-formula- 公式描述=“在线公式”end =“lead”?>(R 3)3(R 5)3 -b-Si-R 7 -Si(R 6)3-c(R 4) )(2)<?in-line-formula description =“In-line Formulas”end =“tail”?>其中R 1,R 3 R 4和R 4各自独立地表示可以具有取代基的一价烃基; R 2,R 5和R 6各自独立地表示可水解基团; R 7表示二价有机基团; a表示0〜3的整数, b和c各自表示1或2的整数。

    COMPOSITION FOR FORMING POROUS FILM, POROUS FILM AND METHOD FOR FORMING THE SAME, INTERLEVEL INSULATOR FILM, AND SEMICONDUCTOR DEVICE
    9.
    发明申请
    COMPOSITION FOR FORMING POROUS FILM, POROUS FILM AND METHOD FOR FORMING THE SAME, INTERLEVEL INSULATOR FILM, AND SEMICONDUCTOR DEVICE 审中-公开
    用于形成多孔膜的组合物,多孔膜及其形成方法,间隔绝缘膜和半导体器件

    公开(公告)号:US20070087124A1

    公开(公告)日:2007-04-19

    申请号:US11537697

    申请日:2006-10-02

    IPC分类号: C08J9/26 B05D3/02

    摘要: Provided are a composition for forming porous film which can form a porous film having practical mechanical strength in a simple and low cost process; a porous film and a method for forming the film; and an inexpensive, high-performing and highly reliable semiconductor device comprising the porous film inside. More specifically, provided is a composition for forming porous film, comprising a polymer which is obtainable by hydrolyzing and condensing one or more silane compounds represented by Formula (1), or preferably by hydrolyzing and co-condensing one or more silane compounds represented by Formula (1) and one more silane compounds represented by Formula (2), Formulas (1) and (2) being: (R1)aSi(R2)4-a  (1) (R3)bSi(R4)4-b  (2)Also provided is a method for forming porous film comprising a step of applying said composition on a substrate to form film and a step of transforming the film into porous film.

    摘要翻译: 提供一种用于形成多孔膜的组合物,其可以以简单且低成本的方法形成具有实际机械强度的多孔膜; 多孔膜和形成膜的方法; 以及包含多孔膜的便宜,高性能和高可靠性的半导体器件。 更具体地说,提供了一种用于形成多孔膜的组合物,其包含通过水解和缩合一种或多种由式(1)表示的硅烷化合物,或优选通过水解和共缩合一种或多种由式 (1)和另外一个由式(2),式(1)和(2)表示的硅烷化合物是:<?in-line-formula description =“In-line formula”end =“lead” (1)&lt;&lt; 1&gt;&lt; 1&gt;&lt; 1&gt; “In-line Formulas”end =“tail”?> <?in-line-formula description =“In-line Formulas”end =“lead”?>(R <3> ) (2)<βin-line-formula description =“In-line Formulas”end =“tail”? >还提供了一种形成多孔膜的方法,包括将所述组合物施加在基底上以形成膜的步骤和将膜转化为多孔膜的步骤。

    Composition for forming porous film, porous film and method for forming the same, interlevel insulator film, and semiconductor device
    10.
    发明授权
    Composition for forming porous film, porous film and method for forming the same, interlevel insulator film, and semiconductor device 失效
    用于形成多孔膜的组合物,多孔膜及其形成方法,层间绝缘膜和半导体器件

    公开(公告)号:US07126208B2

    公开(公告)日:2006-10-24

    申请号:US10706863

    申请日:2003-11-12

    IPC分类号: H01L23/58 H01L21/31

    摘要: Provided are a composition for forming porous film which can form a porous film having practical mechanical strength in a simple and low cost process; a porous film and a method for forming the film; and an inexpensive, high-performing and highly reliable semiconductor device comprising the porous film inside. More specifically, provided is a composition for forming porous film, comprising a polymer which is obtainable by hydrolyzing and condensing one or more silane compounds represented by Formula (1), or preferably by hydrolyzing and co-condensing one or more silane compounds represented by Formula (1) and one more silane compounds represented by Formula (2), Formulas (1) and (2) being: (R1)aSi(R2)4-a   (1) (R3)bSi(R4)4-b   (2) Also provided is a method for forming porous film comprising a step of applying said composition on a substrate to form film and a step of transforming the film into porous film.

    摘要翻译: 提供一种用于形成多孔膜的组合物,其可以以简单且低成本的方法形成具有实际机械强度的多孔膜; 多孔膜和形成膜的方法; 以及包含多孔膜的便宜,高性能和高可靠性的半导体器件。 更具体地说,提供了一种用于形成多孔膜的组合物,其包含通过水解和缩合一种或多种由式(1)表示的硅烷化合物,或优选通过水解和共缩合一种或多种由式 (1)和另外一个由式(2),式(1)和(2)表示的硅烷化合物是:<?in-line-formula description =“In-line formula”end =“lead” (1)&lt;&lt; 1&gt;&lt; 1&gt;&lt; 1&gt; “In-line Formulas”end =“tail”?> <?in-line-formula description =“In-line Formulas”end =“lead”?>(R <3> ) (2)<βin-line-formula description =“In-line Formulas”end =“tail”? >还提供了一种形成多孔膜的方法,包括将所述组合物施加在基底上以形成膜的步骤和将膜转化为多孔膜的步骤。