公开(公告)号：US5879457A

公开(公告)日：1999-03-09

申请号：US783988

申请日：1997-01-14

申请人： Tsutomu Sahoda ,  Koji Ueda ,  Hiroki Endo ,  Hidenori Miyamoto

发明人： Tsutomu Sahoda ,  Koji Ueda ,  Hiroki Endo ,  Hidenori Miyamoto

IPC分类号： B05C11/08 ,  G03F7/16 ,  H01L21/00 ,  H01L21/027 ,  B05C5/00 ,  B05C13/00

CPC分类号： H01L21/6715 ,  B05C11/08

摘要： A rotating cup type liquid coating device with structure for suppressing pulsatory movement of the coated liquid when stopping rotation of the inner cup 3, includes a buffer space S formed for connecting an inner space of the inner cup 3 and an inner space of an outer cup 2 surrounding the inner cup, on an outer periphery of the inner cup 3 , through respective throttle portions 16, 17.

摘要翻译： 具有用于在停止内杯3的旋转时抑制被涂液体的脉动运动的结构的旋转杯式液体涂布装置包括形成为用于连接内杯3的内部空间和外杯的内部空间的缓冲空间S 2通过相应的节流部分16,17围绕内杯3在内杯3的外周上。

公开(公告)号：US5706930A

公开(公告)日：1998-01-13

申请号：US637356

申请日：1996-04-24

申请人： Tsutomu Sahoda ,  Koji Ueda ,  Hidenori Miyamoto ,  Toru Arikawa

发明人： Tsutomu Sahoda ,  Koji Ueda ,  Hidenori Miyamoto ,  Toru Arikawa

IPC分类号： B65G49/07 ,  H01L21/027 ,  H01L21/677 ,  H01L21/68 ,  B65G29/00

CPC分类号： H01L21/681 ,  H01L21/67796 ,  Y10S414/135

摘要： When a carrier arm is retracted, a semiconductor wafer carried thereon passes between three light-emitting elements and three light-detecting elements associated therewith. At this time, a controller determines six points on the outer circumferential edge of the semiconductor wafer based on signals from sensors made up of the light-emitting elements and the light-detecting elements. The controller selects three of the determined points, determines the center of a circumscribed circle passing through the selected three points, and regards the determined center as the center of the semiconductor wafer. Then, the controller controls movement of the semiconductor wafer toward a rotary-cup coating device, an evacuating drying device, or an edge cleaning device based on the center of the semiconductor wafer.

摘要翻译： 当承载臂缩回时，其上承载的半导体晶片通过三个发光元件和与其相关联的三个光检测元件。 此时，控制器基于由发光元件和光检测元件构成的传感器的信号来确定半导体晶片的外周边缘上的六个点。 控制器选择三个确定的点，确定通过所选三个点的外接圆的中心，并将确定的中心视为半导体晶片的中心。 然后，控制器基于半导体晶片的中心来控制半导体晶片朝向旋转杯式涂布装置，抽真空干燥装置或边缘清洁装置的移动。

公开(公告)号：US5707687A

公开(公告)日：1998-01-13

申请号：US637357

申请日：1996-04-24

申请人： Koji Ueda ,  Hiroki Endo ,  Hidenori Miyamoto

发明人： Koji Ueda ,  Hiroki Endo ,  Hidenori Miyamoto

IPC分类号： B05D1/40 ,  B05C11/08 ,  G03F7/16 ,  H01L21/00 ,  H01L21/027 ,  B05D3/12 ,  B05C11/02 ,  B05D1/18

CPC分类号： H01L21/6715 ,  B05C11/08 ,  G03F7/162

摘要： A suction chuck and an inner cup are rotated in unison with each other to spread a coating solution uniformly over a planar object in the inner cup under centrifugal forces. Vent holes defined in an outer cup lid which closes an outer cup are held out of communication with vent holes defined in a ring-shaped closure member, so that the interior space in the outer cup is kept out of communication with the exterior space around the outer cup. The concentration of a solvent in the outer cup remains so high that no mist is produced in the outer cup. After the planar object has been coated and before the outer cup lid is opened, the ring-shaped closure member is turned to align the vent holes in the outer cup lid with the vent holes in the ring-shaped closure member, breaking any vacuum in the outer cup with ambient air introduced through the vent holes into the outer cup. Thereafter, the outer and inner cup lids are opened, and the coated planar object is taken out.

摘要翻译： 吸盘和内杯彼此一致地旋转，以在离心力下在内杯中的平面物体上均匀地涂覆涂布溶液。 限定在封闭外杯的外杯盖中的排气孔与环形封闭构件中限定的通气孔保持不连通，使得外杯中的内部空间与外围空间相连接 外杯。 外杯中的溶剂的浓度保持如此高，使得外杯中不产生雾。 在平面物体被涂覆之后并且在外杯盖打开之前，环形封闭构件被转动以使外杯盖中的通气孔与环形封闭构件中的通气孔对齐，从而破坏 具有环境空气的外杯通过通气孔引入外杯中。 此后，打开外杯盖和内杯盖，并取出涂覆的平面物体。

公开(公告)号：US09027504B2

公开(公告)日：2015-05-12

申请号：US13484625

申请日：2012-05-31

申请人： Hidenori Miyamoto ,  Tsutomu Sahoda

发明人： Hidenori Miyamoto ,  Tsutomu Sahoda

IPC分类号： B05C13/02 ,  F24J3/00 ,  F27B5/16 ,  H01L21/67 ,  H01L21/677 ,  H01L31/032

CPC分类号： H01L21/67173 ,  H01L21/67109 ,  H01L21/67253 ,  H01L21/6776 ,  H01L31/0322 ,  H01L31/0326 ,  Y02E10/541

摘要： A heating apparatus including: a first heating part and a second heating part between which a substrate having a coating film is disposed at a substrate position in the film thickness direction; and a distance control part which controls at least one of a first distance between the substrate position and the first heating part and a second distance between the substrate position and the second heating part.

摘要翻译： 一种加热装置，包括：第一加热部和第二加热部，在所述第一加热部和第二加热部之间，在所述膜厚度方向的基板位置配置有具有涂膜的基板; 以及距离控制部，其控制所述基板位置与所述第一加热部之间的第一距离和所述基板位置与所述第二加热部之间的第二距离中的至少一个。

公开(公告)号：US20120238075A1

公开(公告)日：2012-09-20

申请号：US13412910

申请日：2012-03-06

申请人： Hidenori Miyamoto ,  Tsutomu Sahoda

发明人： Hidenori Miyamoto ,  Tsutomu Sahoda

IPC分类号： H01L21/208 ,  B05B1/02 ,  B05B15/04

CPC分类号： C23C2/003 ,  C23C18/12 ,  C23C18/1204 ,  C23C18/1275 ,  C23C26/02 ,  H01L21/6715 ,  H01L21/67173 ,  H01L21/6776 ,  Y02E10/541 ,  Y02P70/521

摘要： A coating apparatus including a coating part which applies a liquid material containing an oxidizable metal and a solvent to a substrate; a chamber having a coating space in which the coating part applies the liquid material to the substrate and a transport space into which the substrate is transported; and a removal part which removes the liquid material from the atmosphere inside the chamber when a concentration of the solvent in the atmosphere inside the chamber exceeds a threshold value.

摘要翻译： 一种涂布设备，包括：将含有可氧化金属和溶剂的液体材料施加到基材上的涂布部分; 一个具有涂层空间的腔室，其中涂层部分将液体材料施加到衬底上，以及传送空间，衬底被运送到该腔室中; 以及当室内的大气中的溶剂的浓度超过阈值时，从室内的大气中除去液体物质的去除部。

公开(公告)号：US20120309179A1

公开(公告)日：2012-12-06

申请号：US13484642

申请日：2012-05-31

申请人： Hidenori Miyamoto ,  Tsutomu Sahoda

发明人： Hidenori Miyamoto ,  Tsutomu Sahoda

IPC分类号： H01L21/208 ,  B05C9/14

CPC分类号： H01L31/18 ,  H01L31/0322 ,  H01L31/0326 ,  Y02E10/541

摘要： A substrate treating apparatus including: a first chamber having a coating part which forms a coating film of a liquid material containing an oxidizable metal and a solvent on a substrate; a second chamber having a first heating part which heats the coating film; and a connection part which connects the first chamber and the second chamber, wherein the connection part is provided with a second heating part which heats the coating film coated on the substrate and a pressure control part which controls the pressure around the coating film.

摘要翻译： 一种基板处理装置，包括：第一室，其具有涂布部，其在基板上形成含有可氧化金属和溶剂的液体材料的涂膜; 第二室，具有加热涂膜的第一加热部; 以及连接第一室和第二室的连接部，其中，连接部设置有加热涂布在基板上的涂膜的第二加热部和控制涂膜周围的压力的压力控制部。

公开(公告)号：US20120308715A1

公开(公告)日：2012-12-06

申请号：US13484728

申请日：2012-05-31

申请人： Hidenori Miyamoto ,  Tsutomu Sahoda

发明人： Hidenori Miyamoto ,  Tsutomu Sahoda

IPC分类号： H01L31/18

CPC分类号： H01L21/6715 ,  H01L21/67173 ,  H01L21/6776 ,  Y02E10/541

摘要： A coating apparatus including: a coating part having a nozzle which ejects a liquid material containing an oxidizable metal and a solvent to a substrate; a supplying system which supplies the liquid material to the coating part; and a recycling system which recovers the liquid material from at least one of the supplying system and the coating part, and supplies the recovered liquid material to at least one of the supplying system and the coating part.

摘要翻译： 一种涂布装置，包括：涂布部，其具有将含有可氧化金属和溶剂的液体材料喷射到基材的喷嘴; 供给系统，其将液体材料供给到涂布部; 以及回收系统，其从供给系统和涂布部中的至少一个回收液体材料，并将回收的液体材料供给到供给系统和涂布部中的至少一个。

公开(公告)号：US20120304921A1

公开(公告)日：2012-12-06

申请号：US13484625

申请日：2012-05-31

申请人： Hidenori Miyamoto ,  Tsutomu Sahoda

发明人： Hidenori Miyamoto ,  Tsutomu Sahoda

IPC分类号： F27D19/00 ,  F27D7/02 ,  B05C9/14 ,  F27D1/00

CPC分类号： H01L21/67173 ,  H01L21/67109 ,  H01L21/67253 ,  H01L21/6776 ,  H01L31/0322 ,  H01L31/0326 ,  Y02E10/541

摘要： A heating apparatus including: a first heating part and a second heating part between which a substrate having a coating film is disposed at a substrate position in the film thickness direction; and a distance control part which controls at least one of a first distance between the substrate position and the first heating part and a second distance between the substrate position and the second heating part.

摘要翻译： 一种加热装置，包括：第一加热部和第二加热部，在所述第一加热部和第二加热部之间，在所述膜厚度方向的基板位置配置有具有涂膜的基板; 以及距离控制部，其控制所述基板位置与所述第一加热部之间的第一距离和所述基板位置与所述第二加热部之间的第二距离中的至少一个。

公开(公告)号：US5332557A

公开(公告)日：1994-07-26

申请号：US5602

申请日：1993-01-19

申请人： Tsutomu Sahoda ,  Hideyuki Mizuki ,  Hidenori Miyamoto ,  Hisashi Hori ,  Hiroyoshi Sago

发明人： Tsutomu Sahoda ,  Hideyuki Mizuki ,  Hidenori Miyamoto ,  Hisashi Hori ,  Hiroyoshi Sago

IPC分类号： B01J19/00 ,  C03C17/25 ,  C23C18/12 ,  G05D23/22 ,  H01L21/00 ,  H01L21/324 ,  H01L21/677 ,  F28D21/00 ,  G05D23/19 ,  H05H1/24

CPC分类号： H01L21/67757 ,  G05D23/1934 ,  G05D23/22 ,  H01L21/67115 ,  Y10S422/906

摘要： A plurality of workpieces are supported on a workpiece holder disposed over an opening defined in a horizontal base plate and connected to an evacuating device. A reaction chamber, which is supported on an arm of a lifting and lowering device, is vertically movable with respect to the base plate between a lowered position in which the reaction chamber defines a closed space which accommodates the workpieces therein and a lifted position in which the workpieces are exposed out of the reaction chamber. A heating device, which is supported on an arm of another lifting and lowering device, is vertically movable with respect to the base plate between a lowered position in which the heating device surrounds the reaction chamber and a lifted position in which the reaction chamber is exposed out of the heating device.

摘要翻译： 多个工件被支撑在设置在水平基板中限定的开口上并连接到抽空装置的工件保持件上。 支撑在提升和降低装置的臂上的反应室可在下降位置之间相对于基板垂直移动，其中反应室限定容纳工件的封闭空间和提升位置， 工件暴露在反应室外。 支撑在另一升降装置的臂上的加热装置可相对于基板垂直移动，该下降位置在加热装置围绕反应室的下降位置和反应室暴露于其中的提升位置之间 离开加热装置。

公开(公告)号：US06287067B1

公开(公告)日：2001-09-11

申请号：US08947543

申请日：1997-10-11

申请人： Hidenori Miyamoto ,  Susumu Okano ,  Koji Ueda ,  Taiichiro Aoki

发明人： Hidenori Miyamoto ,  Susumu Okano ,  Koji Ueda ,  Taiichiro Aoki

IPC分类号： B65H100

CPC分类号： H01L21/67161 ,  B23P21/004 ,  H01L21/67178 ,  H01L21/67184 ,  H01L21/67742 ,  Y10S414/135 ,  Y10S414/136

摘要： A processing unit structure 1 a plurality of processing units 2, . . . , assembled together continuously in a horizontal direction, wherein a transfer portion 3 is provided on the top of each processing unit 2, . . . , for transferring the plate-like material to be processed between adjacent one of the processing units. A transfer device, such as a shuttle (SH) is provided in each of the transfer portions 3. Each processing unit 2 performs a series of processes on the plate-like material and is constructed with processing blocks 4 and 4 and a transfer portion 3 in the form of a transfer robot (R) positioned between the processing blocks 4 and 4. Further, each processing unit 2. . . is independent from one another so that it is possible to selectively add and remove different ones of the processing units with respect to the processing unit structure 1.

摘要翻译： 处理单元结构1是多个处理单元2，...。 。 。 在水平方向上连续地组装在一起，其中传送部分3设置在每个处理单元2的顶部。 。 。 用于在相邻的一个处理单元之间传送待处理的板状材料。 在每个转印部分3中设置有诸如梭（SH）的转印装置。每个处理单元2对板状材料执行一系列处理，并且由处理块4和4以及转印部3 以位于处理块4和4之间的传送机器人（R）的形式。此外，每个处理单元2。 。 彼此独立，使得可以相对于处理单元结构1选择性地添加和去除处理单元中的不同处理单元。