摘要:
An abrasion-resistant sliding material is produced by forming a powdery mixture of (a) 70-98% of a eutectic alloy consisting of 0.2-3.0% of boron, 1.0-4.0% of carbon, with the balance being iron, the alloy having a particle size finer than 200 mesh and (b) 2-30% of a second eutectic alloy consisting of 3.0-7.0% phosphorus, 0.5-2.5% of carbon, with the balance being iron, this second alloy also having a particle size finer than 200 mesh, compression molding the resulting mixture into a desired shape at a pressure of 0.5-3.0 t/cm.sup.2, and sintering the resulting molded product at 950.degree.-1130.degree. C. for at least 5 minutes in an atmosphere of an inert gas (e.g., argon, nitrogen, hydrogen) or in a vacuum. The final product is characterized in that it has a porosity not exceeding 7.0%, a pore size not exceeding 50.mu. in diameter, with its structure including portions of iron compounds [Fe.sub.3 (B.C.)], portions where iron and iron compounds are copresent [Fe + Fe.sub.3 (B.P.C.)] and in which the P content is higher at the boundary areas than at the central areas, and portions of fine pores.
摘要:
A pull-up circuit prevents generation of a leak current if a difference of potentials occurs between a power source voltage of a pull-up circuit (a bus-hold circuit) and an input terminal. A control terminal is provided in the bus-hold circuit. Inputs of the input terminal and the control terminal are input to a NOR gate, and an output of the NOR gate is input to a gate terminal of a first MOSFET that controls coupling between an input terminal and the power source voltage of the bus-hold circuit. A second MOSFET (“control” MOSFET) is provided as a switch that operates by an inverted output of the control terminal. By coupling the first MOSFET and the control MOSFET in series, the coupling between the input terminal and the power source voltage is controlled with a higher precision, thereby preventing generation of a leak current.
摘要:
There is disclosed a honeycomb structure in which while sufficiently maintaining a collection efficiency and a bonding strength of a plugging portion, a thermal shock resistance is improved. A plugging portion 32 is formed in the end of each cell 3 of a honeycomb structure 1, and a gap 34 having a size of 20 μm or more is formed between the plugging portion 32 and each partition wall 2. Moreover, the length of the gap 34 in the axial direction is 50% or more and less than 95% of the length of the plugging portion 32 in the axial direction, the length of the gap in a face vertical to the axial direction is 20% or more and 50% or less of the length of the inner peripheral surface of the cell 3, and the gaps are formed in at least ⅓ of the plugging portions 32.
摘要:
There is provided a honeycomb structure usable in a filter for trapping/collecting particulates included in exhaust gas and in which ashes deposited inside can be removed without requiring any special mechanism or apparatus or without detaching the filter from an exhaust system. The honeycomb structure includes: a plurality of through channels 9 separated by porous partition walls 7 and extending in the axial direction of the honeycomb structure; and plugging portions 11 for plugging one end of each of predetermined through channels 9a and an opposite end of each of the rest of through channels 9b in a checkered flag pattern, alternately. In the honeycomb structure, at least one slit 15 per through channel is formed in the vicinity of the plugging portions 11 of the partition walls 7 surrounding the respective through channels 9b.
摘要:
The present invention provides a semiconductor integrated circuit device having an SRAM in which leak current is reduced. In an SRAM comprising a plurality of memory cells each constructed by a storage in which input and output terminals of two inverter circuits are cross-connected and a selection MOSFET provided between the storage and complementary bit lines and whose gate is connected to a word line, a substrate bias switching circuit is provided. In normal operation, the substrate bias switching circuit supplies a power source voltage to an N-type well in which a P-channel MOSFET of a memory cell is formed and supplies a ground potential of the circuit to a P-type well in which an N-channel MOSFET is formed. In the standby state, the substrate bias switching circuit supplies a predetermined voltage which is lower than the power source voltage and by which a PN junction between the N-type well and the source of the P-channel MOSFET is not forward biased to the N-type well, and supplies a predetermined voltage which is higher than the ground potential and by which a PN junction between the P-type well and the source of the N-channel MOSFET is not forward biased to the P-type well.
摘要:
Wirings connected to a gate electrode of a slave switch circuit cell for substrate bias circuits are respectively electrically connected to a wiring for a power supply potential and a wiring for a reference potential. Thus, the switch operation of the slave switch circuit cell is made invalid. Wirings connected to n wells of respective circuit cells are electrically connected to a wiring for the power supply potential, and wirings connected to p wells of the respective circuit cells are electrically connected to the wiring. Thus, the n wells are fixed to the power supply potential, and the p wells are fixed to the reference potential.
摘要:
A semiconductor integrated circuit has a memory which can enter active state or standby state, and the memory has voltage generation circuits for bit lines and source lines with which memory cells are connected. The voltage generation circuits make the potential of the bit lines and the potential of the source lines equal to each other in response to an instruction to transition from active state to standby state. The voltage generation circuits produce a potential difference between the bit lines and the source lines in response to an instruction to transition from standby state to active state. In standby state, the potential of the bit lines and that of the source lines are equal to each other. Therefore, sub-threshold leakage does not occur between the source and drain of each memory cell. In active state, the source line potential is not varied.
摘要:
A honeycomb catalyst body includes: porous partition walls having a large number of pores and disposed to form a plurality of cells communicating between two end faces, plugged portions disposed to plug each of the cells on one of the end faces, and catalyst layers loaded in layers on an inner surface of the cells and an inner surface of the pores and containing a noble metal. Mass (Mc) of the noble metal contained in the catalyst layer loaded on the inner surface of the cells and mass (Mp) of the noble metal contained in the catalyst layer loaded on the inner surface of the pores satisfy the relation of (Mp)/(Mc)≧4. The honeycomb catalyst body is excellent in purification efficiency, has low pressure loss, and is mountable even in a limited space.
摘要:
A ceramic honeycomb structure includes a cell structure which includes a plurality of cells partitioned by porous partition walls and forming fluid channels, and an outer wall disposed on an outer circumferential surface of the cell structure and formed of a coating material including ceramic particles. The ceramic particles have an average particle size of 20 to 50 μm, and a portion of the outer wall positioned on an outer side of a center portion of the outer wall in its thickness direction has a porosity lower than porosity of the center portion.
摘要:
A semiconductor integrated circuit has a memory which can enter active state or standby state, and the memory has voltage generation circuits for bit lines and source lines with which memory cells are connected. The voltage generation circuits make the potential of the bit lines and the potential of the source lines equal to each other in response to an instruction to transition from active state to standby state. The voltage generation circuits produce a potential difference between the bit lines and the source lines in response to an instruction to transition from standby state to active state. In standby state, the potential of the bit lines and that of the source lines are equal to each other. Therefore, sub-threshold leakage does not occur between the source and drain of each memory cell. In active state, the source line potential is not varied.