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公开(公告)号：US12250776B2
公开(公告)日：2025-03-11
申请号：US18317756
申请日：2023-05-15
Applicant: UNIMICRON TECHNOLOGY CORP.
Inventor： Jeng-Ting Li , Chi-Hai Kuo , Cheng-Ta Ko , Pu-Ju Lin
Abstract: A substrate structure and a cutting method thereof are provided. The cutting method includes the following steps. A first substrate structure is provided, wherein the first substrate structure includes a glass substrate and a redistribution layer disposed on the glass substrate. A laser process is performed on the glass substrate to form a modified region on the glass substrate. A wet etching process is performed on the modified region of the glass substrate to remove the modified region and form a plurality of second substrate structures.
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Patent Agency Ranking
公开(公告)号：US12185479B2
公开(公告)日：2024-12-31
申请号：US17945106
申请日：2022-09-15
Applicant: Unimicron Technology Corp.
Inventor： Cheng-Ta Ko , Pu-Ju Lin , Shih-Chieh Chen , Chi-Hai Kuo , Jeng-Ting Li
Abstract: A flexible circuit board and a manufacturing method thereof are provided. The flexible circuit board includes a circuit structure, a first cover layer, and a second cover layer. The circuit structure has a top surface and a bottom surface opposite to the top surface. The circuit structure includes multiple circuit layers and multiple insulating layers stacked alternately. A material of the insulating layers is a photosensitive dielectric material and a Young's modulus of the insulating layers is between 0.36 GPa and 8 GPa. The first cover layer is disposed on the top surface of the circuit structure. The second cover layer is disposed on the bottom surface of the circuit structure.
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公开(公告)号：US11955587B2
公开(公告)日：2024-04-09
申请号：US17227391
申请日：2021-04-12
Applicant: Unimicron Technology Corp.
Inventor： Jeng-Ting Li , Chi-Hai Kuo , Cheng-Ta Ko , Pu-Ju Lin
CPC classification number: H01L33/62 , H01L27/156 , H01L33/005 , H01L2933/0066
Abstract: A light emitting diode (LED) package structure includes a glass substrate, conductive through holes, active elements, an insulating layer, LEDs and pads. The glass substrate has an upper surface and a lower surface. The conductive through holes penetrate the glass substrate and connect the upper and the lower surfaces. The active elements are disposed on the upper surface of the glass substrate and electrically connected to the conductive through holes. The insulating layer is disposed on the upper surface and covers the active elements. The LEDs are disposed on the insulating layer and electrically connected to at least one of the active elements. The pads are disposed on the lower surface of the glass substrate and electrically connected to the conductive through holes. A source of at least one active elements is directly electrically connected to at least one of the corresponding pads through the corresponding conductive through hole.
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公开(公告)号：US20230164928A1
公开(公告)日：2023-05-25
申请号：US17945106
申请日：2022-09-15
Applicant: Unimicron Technology Corp.
Inventor： Cheng-Ta Ko , Pu-Ju Lin , Shih-Chieh Chen , Chi-Hai Kuo , Jeng-Ting Li
CPC classification number: H05K3/4691 , H05K1/0393 , H05K1/118 , H05K3/06 , H05K2201/0154 , H05K2201/09509
Abstract: A flexible circuit board and a manufacturing method thereof are provided. The flexible circuit board includes a circuit structure, a first cover layer, and a second cover layer. The circuit structure has a top surface and a bottom surface opposite to the top surface. The circuit structure includes multiple circuit layers and multiple insulating layers stacked alternately. A material of the insulating layers is a photosensitive dielectric material and a Young's modulus of the insulating layers is between 0.36 GPa and 8 GPa. The first cover layer is disposed on the top surface of the circuit structure. The second cover layer is disposed on the bottom surface of the circuit structure.
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公开(公告)号：US12062742B2
公开(公告)日：2024-08-13
申请号：US17653659
申请日：2022-03-07
Applicant: Unimicron Technology Corp.
Inventor： Hao-Wei Tseng , Chi-Hai Kuo , Jeng-Ting Li , Ying-Chu Chen , Pu-Ju Lin , Cheng-Ta Ko
IPC: H01L33/54 , H01L23/00 , H01L25/075
CPC classification number: H01L33/54 , H01L24/83 , H01L25/0753 , H01L24/29 , H01L24/32 , H01L2224/29194 , H01L2224/32227 , H01L2224/83099 , H01L2224/83203 , H01L2224/83856 , H01L2224/83862 , H01L2224/8389 , H01L2924/12041 , H01L2933/005
Abstract: A package structure includes a substrate, a plurality of conductive pads, a light-emitting diode, a photo imageable dielectric material, and a black matrix. The substrate includes a top surface. The conductive pads are located on the top surface of the substrate. The light-emitting diode is located on the conductive pads. The photo imageable dielectric material is located between the light-emitting diode and the top surface of the substrate and between the conductive pads. An orthogonal projection of the light-emitting diode on the substrate is overlapped with an orthogonal projection of the photo imageable dielectric material on the substrate. The black matrix is located on the top surface of the substrate and the conductive pads.
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公开(公告)号：US20220271208A1
公开(公告)日：2022-08-25
申请号：US17227391
申请日：2021-04-12
Applicant: Unimicron Technology Corp.
Inventor： Jeng-Ting Li , Chi-Hai Kuo , Cheng-Ta Ko , Pu-Ju Lin
Abstract: A light emitting diode (LED) package structure includes a glass substrate, conductive through holes, active elements, an insulating layer, LEDs and pads. The glass substrate has an upper surface and a lower surface. The conductive through holes penetrate the glass substrate and connect the upper and the lower surfaces. The active elements are disposed on the upper surface of the glass substrate and electrically connected to the conductive through holes. The insulating layer is disposed on the upper surface and covers the active elements. The LEDs are disposed on the insulating layer and electrically connected to at least one of the active elements. The pads are disposed on the lower surface of the glass substrate and electrically connected to the conductive through holes. A source of at least one active elements is directly electrically connected to at least one of the corresponding pads through the corresponding conductive through hole.
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