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    TRANSMISSION DEVICE
    3.
    发明公开
    TRANSMISSION DEVICE 审中-公开

    公开(公告)号：US20240128626A1

    公开(公告)日：2024-04-18

    申请号：US18058799

    申请日：2022-11-25

    Applicant: Unimicron Technology Corp. ,  National Taiwan University

    Inventor： Yu-Kuang WANG ,  Ruey-Beei Wu ,  Ching-Sheng Chen ,  Chun-Jui Huang ,  Wei-Yu Liao ,  Chi-Min Chang

    IPC: H01P3/08 ,  H05K1/02

    CPC classification number: H01P3/081 ,  H05K1/0237

    Abstract: A transmission device includes a daisy chain structure composed of at least three daisy chain units arranged periodically and continuously. Each of the daisy chain units includes first, second and third conductive lines, and first and second conductive pillars. The first and second conductive lines at a first layer extend along a first direction and are discontinuously arranged. The third conductive line at a second layer extends along the first direction and is substantially parallel to the first and second conductive lines. The first conductive pillar extends in a second direction. The second direction is different from the first direction. A first part of the first conductive pillar is connected to the first and third conductive lines. The second conductive pillar extends in the second direction. A first part of the second conductive pillar is connected to the second and third conductive lines.

    CIRCUIT BOARD AND FABRICATION METHOD THEREOF
    5.
    发明申请
    CIRCUIT BOARD AND FABRICATION METHOD THEREOF 审中-公开
    电路板及其制造方法

    公开(公告)号：US20130040071A1

    公开(公告)日：2013-02-14

    申请号：US13653423

    申请日：2012-10-17

    Applicant: UNIMICRON TECHNOLOGY CORP.

    Inventor： Cheng-Po Yu ,  Chi-Min Chang ,  Wei-Ming Cheng

    IPC: B05D5/00 ,  B05D3/06

    CPC classification number: H05K3/185 ,  H05K3/0032 ,  H05K3/107 ,  H05K3/465 ,  H05K3/4661 ,  H05K2201/0236

    Abstract: A method for fabricating a circuit board is provided. A non-conductive material layer is provided on a core substrate, wherein the non-conductive material layer comprises a dielectric material and catalytic particles. A recessed circuit structure is then formed in the non-conductive material layer with a laser beam. Simultaneously, the catalytic particles in the recessed circuit structure are activated with aid of the laser. A buried conductive structure is then formed in the recessed circuit structure by chemical copper deposition methods.

    Abstract translation: 提供一种制造电路板的方法。 非导电材料层设置在芯基板上，其中非导电材料层包括电介质材料和催化颗粒。 然后在非导电材料层中用激光束形成凹陷的电路结构。 同时，凹陷电路结构中的催化颗粒借助于激光器被激活。 然后通过化学铜沉积方法在凹陷电路结构中形成掩埋导电结构。

    Circuit board structure
    6.
    发明授权
    Circuit board structure 有权

    公开(公告)号：US12144113B2

    公开(公告)日：2024-11-12

    申请号：US17938977

    申请日：2022-09-07

    Applicant: Unimicron Technology Corp.

    Inventor： Chih-Chiang Lu ,  Chi-Min Chang ,  Ming-Hao Wu ,  Yi-Pin Lin ,  Tung-Chang Lin ,  Jun-Rui Huang

    IPC: H05K1/11 ,  H05K1/02

    Abstract: A circuit board structure includes a substrate, a first build-up structure layer, first and second external circuit layers, at least one first conductive via, and second conductive vias. The first build-up structure layer is disposed on a first circuit layer of the substrate. The first external circuit layer is disposed on the first build-up structure layer. The second external circuit layer is disposed on a second circuit layer and a portion of a third dielectric layer of the substrate. The first conductive via is electrically connected to the first external circuit layer and the second external circuit layer to define a signal path. The second conductive vias surround the first conductive via, and the first external circuit layer, the second conductive vias, the first circuit layer, the outer conductive layer, and the second external circuit layer define a first ground path. The first ground path surrounds the signal path.

    CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF AND ELECTRONIC DEVICE
    7.
    发明申请
    CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF AND ELECTRONIC DEVICE 有权

    公开(公告)号：US20220232694A1

    公开(公告)日：2022-07-21

    申请号：US17496791

    申请日：2021-10-08

    Applicant: Unimicron Technology Corp.

    Inventor： Chih-Chiang Lu ,  Heng-Ming Nien ,  Ching-Sheng Chen ,  Ching Chang ,  Ming-Ting Chang ,  Chi-Min Chang ,  Shao-Chien Lee ,  Jun-Rui Huang ,  Shih-Lian Cheng

    IPC: H05K1/02 ,  H05K1/11 ,  H05K3/46 ,  H05K3/42

    Abstract: Provided is a circuit board, including a first substrate, a second substrate, a third substrate, a fourth substrate, multiple conductive structures, and a conductive via structure. The second substrate is disposed between the first substrate and the third substrate. The third substrate is disposed between the second substrate and the fourth substrate. The third substrate has an opening penetrating the third substrate and includes a first dielectric layer filling the opening. The conductive via structure penetrates the first substrate, the second substrate, the first dielectric layer of the third substrate, and the fourth substrate, and is electrically connected to the first substrate and the fourth substrate to define a signal path. The first substrate, the second substrate, the third substrate and the fourth substrate are electrically connected through the conductive structures to define a ground path, and the ground path surrounds the signal path.

    Method for manufacturing circuit board
    8.
    发明授权
    Method for manufacturing circuit board 有权

    公开(公告)号：US10470317B2

    公开(公告)日：2019-11-05

    申请号：US15853990

    申请日：2017-12-26

    Applicant: Unimicron Technology Corp.

    Inventor： Hsiang-Hung Huang ,  Chi-Min Chang

    IPC: H05K3/46 ,  H05K3/00 ,  H05K3/40 ,  H05K3/06

    Abstract: A method for manufacturing a circuit board includes: forming a first adhesive layer on a first surface of a vibration unit, in which the vibration unit includes at least one piezoelectric material layer; forming a first stacking structure on the first adhesive layer; and applying a voltage to the at least one piezoelectric material layer to cause the at least one piezoelectric material layer to vibrate, such that the first stacking structure is separate from the vibration unit.

    CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF AND ELECTRONIC DEVICE
    9.
    发明申请
    CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF AND ELECTRONIC DEVICE 有权

    公开(公告)号：US20220240369A1

    公开(公告)日：2022-07-28

    申请号：US17574551

    申请日：2022-01-13

    Applicant: Unimicron Technology Corp.

    Inventor： Chih-Chiang Lu ,  Chi-Min Chang ,  Shao-Chien Lee ,  Jun-Rui Huang ,  Ming-Ting Chang

    IPC: H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K3/42 ,  H05K3/10

    Abstract: A circuit board includes a first dielectric material, a second dielectric material, a third dielectric material, a first external circuit layer, a second external circuit layer, multiple conductive structures, and a conductive via structure. Dielectric constants of the first, the second and the third dielectric materials are different. The first and the second external circuit layers are respectively disposed on the first and the third dielectric materials. The conductive via structure at least penetrates the first and the second dielectric materials and is electrically connected to the first and the second external circuit layers to define a signal path. The conductive structures are electrically connected to each other and surround the first, the second and the third dielectric materials. The conductive structures are electrically connected to the first and the second external circuit layers to define a ground path surrounding the signal path.

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