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公开(公告)号：US12133323B2
公开(公告)日：2024-10-29
申请号：US18058381
申请日：2022-11-23
Applicant: UNIMICRON TECHNOLOGY CORP. , National Taiwan University
Inventor： Chin-Hsun Wang , Ruey-Beei Wu , Ching-Sheng Chen , Chun-Jui Huang , Wei-Yu Liao , Chi-Min Chang
CPC classification number: H05K1/0242 , H01P3/08
Abstract: A transmission device for suppressing the glass-fiber effect includes a circuit board and a transmission line. The circuit board includes a plurality of glass fibers, so as to define a fiber pitch. The transmission line is disposed on the circuit board. The transmission line includes a plurality of non-parallel segments. Each of the non-parallel segments of the transmission line has an offset distance with respect to a reference line. The offset distance is longer than or equal to a half of the fiber pitch.
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公开(公告)号：US20240130038A1
公开(公告)日：2024-04-18
申请号：US18058381
申请日：2022-11-23
Applicant: UNIMICRON TECHNOLOGY CORP. , National Taiwan University
Inventor： Chin-Hsun WANG , Ruey-Beei Wu , Ching-Sheng Chen , Chun-Jui Hung , Wei-Yu Liao , Chi-Min Chang
CPC classification number: H05K1/0242 , H01P3/08
Abstract: A transmission device for suppressing the glass-fiber effect includes a circuit board and a transmission line. The circuit board includes a plurality of glass fibers, so as to define a fiber pitch. The transmission line is disposed on the circuit board. The transmission line includes a plurality of non-parallel segments. Each of the non-parallel segments of the transmission line has an offset distance with respect to a reference line. The offset distance is longer than or equal to a half of the fiber pitch.
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公开(公告)号：US20240128626A1
公开(公告)日：2024-04-18
申请号：US18058799
申请日：2022-11-25
Applicant: Unimicron Technology Corp. , National Taiwan University
Inventor： Yu-Kuang WANG , Ruey-Beei Wu , Ching-Sheng Chen , Chun-Jui Huang , Wei-Yu Liao , Chi-Min Chang
CPC classification number: H01P3/081 , H05K1/0237
Abstract: A transmission device includes a daisy chain structure composed of at least three daisy chain units arranged periodically and continuously. Each of the daisy chain units includes first, second and third conductive lines, and first and second conductive pillars. The first and second conductive lines at a first layer extend along a first direction and are discontinuously arranged. The third conductive line at a second layer extends along the first direction and is substantially parallel to the first and second conductive lines. The first conductive pillar extends in a second direction. The second direction is different from the first direction. A first part of the first conductive pillar is connected to the first and third conductive lines. The second conductive pillar extends in the second direction. A first part of the second conductive pillar is connected to the second and third conductive lines.
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公开(公告)号：US12052815B2
公开(公告)日：2024-07-30
申请号：US18447265
申请日：2023-08-09
Applicant: Unimicron Technology Corp.
Inventor： Chih-Chiang Lu , Heng-Ming Nien , Ching-Sheng Chen , Ching Chang , Ming-Ting Chang , Chi-Min Chang , Shao-Chien Lee , Jun-Rui Huang , Shih-Lian Cheng
CPC classification number: H05K1/0222 , H05K1/113 , H05K1/119 , H05K3/429 , H05K3/462 , H05K1/181 , H05K3/0094 , H05K3/24 , H05K2201/10734
Abstract: Provided is a manufacturing method of circuit board, including a first substrate, a second substrate, a third substrate, a fourth substrate, multiple conductive structures, and a conductive via structure. The third substrate has an opening and includes a first dielectric layer. The opening penetrates the third substrate, and the first dielectric layer fills the opening. Multiple conductive structures are formed so that the first substrate, the second substrate, the third substrate, and the fourth substrate are electrically connected through the conductive structures to define a ground path. A conductive via structure is formed to penetrate the first substrate, the second substrate, the first dielectric layer of the third substrate, and the fourth substrate. The conductive via structure is electrically connected to the first substrate and the fourth substrate to define a signal path, and the ground path surrounds the signal path.
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公开(公告)号：US11895772B2
公开(公告)日：2024-02-06
申请号：US17377280
申请日：2021-07-15
Applicant: Unimicron Technology Corp.
Inventor： Chi-Min Chang , Ching-Sheng Chen , Jun-Rui Huang , Wei-Yu Liao , Yi-Pin Lin
CPC classification number: H05K1/115 , H05K1/181 , H05K3/423 , H05K2201/09545
Abstract: An interlayer connective structure is suitable for being formed in a wiring board, in which the wiring board includes two traces and an insulation part between the traces. The insulation part has a through hole. The interlayer connective structure located in the through hole is connected to the traces. The interlayer connective structure includes a column and a pair of protuberant parts. The protuberant parts are located at two ends of the through hole respectively and connected to the column and the traces. The protuberant parts stick out from the outer surfaces of the traces respectively. Each of the protuberant parts has a convex curved surface, in which the distance between the convex curved surface and the axis of the through hole is less than the radius of the through hole.
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Patent Agency Ranking
公开(公告)号：US20230389172A1
公开(公告)日：2023-11-30
申请号：US18447265
申请日：2023-08-09
Applicant: Unimicron Technology Corp.
Inventor： Chih-Chiang Lu , Heng-Ming Nien , Ching-Sheng Chen , Ching Chang , Ming-Ting Chang , Chi-Min Chang , Shao-Chien Lee , Jun-Rui Huang , Shih-Lian Cheng
Abstract: Provided is a manufacturing method of circuit board, including a first substrate, a second substrate, a third substrate, a fourth substrate, multiple conductive structures, and a conductive via structure. The third substrate has an opening and includes a first dielectric layer. The opening penetrates the third substrate, and the first dielectric layer fills the opening. Multiple conductive structures are formed so that the first substrate, the second substrate, the third substrate, and the fourth substrate are electrically connected through the conductive structures to define a ground path. A conductive via structure is formed to penetrate the first substrate, the second substrate, the first dielectric layer of the third substrate, and the fourth substrate. The conductive via structure is electrically connected to the first substrate and the fourth substrate to define a signal path, and the ground path surrounds the signal path.
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公开(公告)号：US11785707B2
公开(公告)日：2023-10-10
申请号：US17496791
申请日：2021-10-08
Applicant: Unimicron Technology Corp.
Inventor： Chih-Chiang Lu , Heng-Ming Nien , Ching-Sheng Chen , Ching Chang , Ming-Ting Chang , Chi-Min Chang , Shao-Chien Lee , Jun-Rui Huang , Shih-Lian Cheng
CPC classification number: H05K1/0222 , H05K1/113 , H05K1/119 , H05K3/429 , H05K3/462 , H05K1/181 , H05K3/0094 , H05K3/24 , H05K2201/10734
Abstract: Provided is a circuit board, including a first substrate, a second substrate, a third substrate, a fourth substrate, multiple conductive structures, and a conductive via structure. The second substrate is disposed between the first substrate and the third substrate. The third substrate is disposed between the second substrate and the fourth substrate. The third substrate has an opening penetrating the third substrate and includes a first dielectric layer filling the opening. The conductive via structure penetrates the first substrate, the second substrate, the first dielectric layer of the third substrate, and the fourth substrate, and is electrically connected to the first substrate and the fourth substrate to define a signal path. The first substrate, the second substrate, the third substrate and the fourth substrate are electrically connected through the conductive structures to define a ground path, and the ground path surrounds the signal path.
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公开(公告)号：US20250056712A1
公开(公告)日：2025-02-13
申请号：US18930988
申请日：2024-10-29
Applicant: Unimicron Technology Corp.
Inventor： Jun-Rui Huang , Chih-Chiang Lu , Yi-Pin Lin , Ching-Sheng Chen
Abstract: A manufacturing method of the circuit board includes the following. The third substrate has an opening and includes a first, a second and a third dielectric layers. The opening penetrates the first and the second dielectric layers, and the opening is fully filled with the third dielectric layer. The first, the second and the third substrates are press-fitted so that the second substrate is located between the first and the third substrates. Multiple conductive structures are formed so that the first, the second and the third substrates are electrically connected through the conductive structures to define a ground path. A conductive via structure is formed to penetrate the first substrate, the second substrate, and the third dielectric layer of the third substrate. The conductive via structure is electrically connected to the first and the third substrates to define a signal path. The ground path surrounds the signal path.
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公开(公告)号：US12177964B2
公开(公告)日：2024-12-24
申请号：US17711027
申请日：2022-04-01
Applicant: Unimicron Technology Corp.
Inventor： Jun-Rui Huang , Chih-Chiang Lu , Yi-Pin Lin , Ching-Sheng Chen
IPC: H05K1/02 , H01L23/498 , H05K1/11 , H05K3/00 , H05K3/42
Abstract: A circuit board includes a first substrate, a second substrate, a third substrate, a plurality of conductive structures and a conductive via structure. The second substrate is disposed between the first substrate and the third substrate. The third substrate has an opening and includes a first dielectric layer, a second dielectric layer, and a third dielectric layer. The opening penetrates the first dielectric layer and the second dielectric layer, and the third dielectric layer fully fills the opening. The conductive via structure penetrates the first substrate, the second substrate, the third dielectric layer of the third substrate, and is electrically connected to the first substrate and the third substrate to define a signal path. The first substrate, the second substrate, and the third substrate are electrically connected through the conductive structures to define a ground path, and the ground path surrounds the signal path.
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公开(公告)号：US20220232694A1
公开(公告)日：2022-07-21
申请号：US17496791
申请日：2021-10-08
Applicant: Unimicron Technology Corp.
Inventor： Chih-Chiang Lu , Heng-Ming Nien , Ching-Sheng Chen , Ching Chang , Ming-Ting Chang , Chi-Min Chang , Shao-Chien Lee , Jun-Rui Huang , Shih-Lian Cheng
Abstract: Provided is a circuit board, including a first substrate, a second substrate, a third substrate, a fourth substrate, multiple conductive structures, and a conductive via structure. The second substrate is disposed between the first substrate and the third substrate. The third substrate is disposed between the second substrate and the fourth substrate. The third substrate has an opening penetrating the third substrate and includes a first dielectric layer filling the opening. The conductive via structure penetrates the first substrate, the second substrate, the first dielectric layer of the third substrate, and the fourth substrate, and is electrically connected to the first substrate and the fourth substrate to define a signal path. The first substrate, the second substrate, the third substrate and the fourth substrate are electrically connected through the conductive structures to define a ground path, and the ground path surrounds the signal path.
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