摘要:
Provided is an adhesive composition suitable for fortifying panel joints in construction, the adhesive composition comprising a polymeric binder, filler and thickener, wherein the binder is selected from acrylic acid polymers, acrylic acid copolymers, alkyds, polyurethanes, polyesters, epoxies, and combinations thereof and wherein the viscosity of the composition is the range from 100 to 200 Brabender Units and density is in the range from about 7.5 lbs/gal to about 10 lbs/gal. Methods of using the adhesive composition in wall assembly are provided as well.
摘要:
This invention provides flexible adhesive compositions which can be used instead of joint reinforcement tape for securing a joint seam between abutting panels. Methods using the compositions are provided as well.
摘要:
A prefill tool for finishing wallboard joints is provided for finishing a wallboard joint, and includes a box assembly defining a hopper, having a top wall and a front wall constructed and arranged for engaging the wallboard joint. The front wall partially defines a gate dimensioned for dispensing joint compound stored in the hopper. Also, the gate is located on a skid plate mounted on the front wall, the skid plate having a main portion, and a gate portion partially defining the gate being displaced from a plane defined by the main portion.
摘要:
This invention provides flexible adhesive compositions which can be used instead of joint reinforcement tape for securing a joint seam between abutting panels. Methods using the compositions are provided as well.
摘要:
A construction adhesive composition comprises between about 10 weight percent (wt. %) and about 30 wt. % of a vinyl acrylic latex, between about 30 wt. % and about 65 wt. % of calcium carbonate, and a surfactant.
摘要:
Provided are compositions and methods for expeditious wall installation by spray-applying a joint compound comprising a polymeric binder and hollow spheres.
摘要:
A kit for assembling walls and ceilings is provided. The kit comprises at least two gypsum boards, each with at least one tapered edge, and a self-drying joint compound comprising a polymeric binder and hollow spheres. Methods for wall and ceiling installation are provided as well.
摘要:
Provided is an adhesive composition suitable for fortifying panel joints in construction, the adhesive composition comprising a polymeric binder, filler and thickener, wherein the binder is selected from acrylic acid polymers, acrylic acid copolymers, alkyds, polyurethanes, polyesters, epoxies, and combinations thereof and wherein the viscosity of the composition is the range from 100 to 200 Bradbender Units and density is in the range from about 7.5 lbs/gal to about 10 lbs/gal. Methods of using the adhesive composition in wall assembly are provided as well.
摘要:
Disclosed are aspects of board finishing systems. For example, in various aspects, disclosed are joint compound compositions, wall assemblies, methods of treating walls, and products related to any of the foregoing, including reinforcement trim, e.g., for protecting corners where boards meet, fasteners, and tape. The joint compound preferably is a drying type composition with reduced shrinkage property, and includes binder and hollow spheres, resulting in an ultra lightweight formulation in some embodiments. The joint compound composition can be applied in a one-coat treatment in preferred embodiments. Other aspects of board finishing system accommodate such a one-coat treatment to thusly allow a user to manipulate the compound closer to the plane of board as compared with conventional formulations. Joint tape and reinforcement trim can include non-swelling synthetic paper facing material in some embodiments.
摘要:
A method of making a setting type compound by injecting an activator compound into a plaster compound wherein the activator compound tube is coaxial and within the plaster compound tube, each at the same flowrate, the same pressure and the same viscosity. The cross sectional transverse areas of an annulus containing the plaster compound and the hole in the annulus containing the activator compound are the same.