Methods and Apparatus for High Voltage Diodes
    1.
    发明申请
    Methods and Apparatus for High Voltage Diodes 审中-公开
    高压二极管的方法和装置

    公开(公告)号:US20130334648A1

    公开(公告)日:2013-12-19

    申请号:US13524902

    申请日:2012-06-15

    IPC分类号: H01L29/861 H01L21/329

    摘要: High voltage diodes are disclosed. A semiconductor device is provided having a P well region; an N well region adjacent to the P well region and forming a p-n junction with the P well region; a P+ region forming an anode at the upper surface of the semiconductor substrate in the P well region; an N+ region forming a cathode at the upper surface of the semiconductor substrate in the N well region; and an isolation structure formed over the upper surface of the semiconductor substrate between the anode and the cathode and electrically isolating the anode and cathode including a first dielectric layer overlying a portion of the upper surface of the semiconductor substrate, and a second dielectric layer overlying a portion of the first dielectric layer and a portion of the upper surface of the semiconductor substrate. Methods for forming the devices are disclosed.

    摘要翻译: 公开了高电压二极管。 提供具有P阱区域的半导体器件; 与P阱区相邻并与P阱区形成p-n结的N阱区; 在P阱区域中的半导体衬底的上表面处形成阳极的P +区域; 在N阱区域中的半导体衬底的上表面处形成阴极的N +区域; 以及在阳极和阴极之间形成在半导体衬底的上表面上的隔离结构,并且电绝缘包括覆盖半导体衬底的上表面的一部分的第一电介质层的阳极和阴极以及覆盖在半导体衬底的上表面的第二电介质层 第一电介质层的一部分和半导体衬底的上表面的一部分。 公开了形成装置的方法。

    Diode formed of PMOSFET and schottky diodes
    2.
    发明授权
    Diode formed of PMOSFET and schottky diodes 有权
    二极管由PMOSFET和肖特基二极管组成

    公开(公告)号:US09576949B2

    公开(公告)日:2017-02-21

    申请号:US13604299

    申请日:2012-09-05

    摘要: A P-type Metal-Oxide-Semiconductor Field Effect Transistor (PMOSFET) includes a gate, a first source/drain region connected to the gate, and a second source/drain region on an opposite side of the gate than the first source/drain region. A first Schottky diode includes a first anode connected to the first source/drain region, and a first cathode connected to a body of the PMOSFET. A second Schottky diode includes a second anode connected to the second source/drain region, and a second cathode connected to the body of the PMOSFET.

    摘要翻译: P型金属氧化物半导体场效应晶体管(PMOSFET)包括栅极,连接到栅极的第一源极/漏极区域和栅极相对于第一源极/漏极的第二源极/漏极区域 地区。 第一肖特基二极管包括连接到第一源极/漏极区域的第一阳极和连接到PMOSFET主体的第一阴极。 第二肖特基二极管包括连接到第二源极/漏极区的第二阳极和连接到PMOSFET的主体的第二阴极。

    Diode Formed of PMOSFET and Schottky Diodes
    3.
    发明申请
    Diode Formed of PMOSFET and Schottky Diodes 有权
    PMOSFET和肖特基二极管形成的二极管

    公开(公告)号:US20140062580A1

    公开(公告)日:2014-03-06

    申请号:US13604299

    申请日:2012-09-05

    IPC分类号: G05F3/02

    摘要: A P-type Metal-Oxide-Semiconductor Field Effect Transistor (PMOSFET) includes a gate, a first source/drain region connected to the gate, and a second source/drain region on an opposite side of the gate than the first source/drain region. A first Schottky diode includes a first anode connected to the first source/drain region, and a first cathode connected to a body of the PMOSFET. A second Schottky diode includes a second anode connected to the second source/drain region, and a second cathode connected to the body of the PMOSFET.

    摘要翻译: P型金属氧化物半导体场效应晶体管(PMOSFET)包括栅极,连接到栅极的第一源极/漏极区域和栅极相对于第一源极/漏极的第二源极/漏极区域 地区。 第一肖特基二极管包括连接到第一源极/漏极区域的第一阳极和连接到PMOSFET主体的第一阴极。 第二肖特基二极管包括连接到第二源极/漏极区的第二阳极和连接到PMOSFET的主体的第二阴极。

    High-Voltage Mosfets Having Current Diversion Region in Substrate Near Fieldplate
    4.
    发明申请
    High-Voltage Mosfets Having Current Diversion Region in Substrate Near Fieldplate 有权
    高压滤波器在底板附近有电流导流区域

    公开(公告)号:US20130093010A1

    公开(公告)日:2013-04-18

    申请号:US13271342

    申请日:2011-10-12

    IPC分类号: H01L29/78

    摘要: To limit or prevent current crowding, various HV-MOSFET embodiments include a current diversion region disposed near a drain region of an HV-MOSFET and near an upper surface of the semiconductor substrate. In some embodiments, the current diversion region is disposed near a field plate of the HV-MOSFET, wherein the field plate can also help to reduce or “smooth” electric fields near the drain to help limit current crowding. In some embodiments, the current diversion region is a p-doped, n-doped, or intrinsic region that is at a floating voltage potential. This current diversion region can push current deeper into the substrate of the HV-MOSFET (relative to conventional HV-MOSFETs), thereby reducing current crowding during ESD events. By reducing current crowding, the current diversion region makes the HV-MOSFETs disclosed herein more impervious to ESD events and, therefore, more reliable in real-world applications.

    摘要翻译: 为了限制或防止电流拥挤,各种HV-MOSFET实施例包括设置在HV-MOSFET的漏极区附近并且在半导体衬底的上表面附近的电流分流区域。 在一些实施例中,电流引流区域设置在HV-MOSFET的场板附近,其中场板还可以帮助减少或“平滑”漏极附近的电场,以帮助限制电流拥挤。 在一些实施例中,电流分流区域是处于浮置电压电位的p掺杂,n掺杂或本征区域。 该电流分流区可以将电流深度推入HV-MOSFET的衬底(相对于传统HV-MOSFET),从而减少ESD事件期间的电流拥挤。 通过减少电流拥挤,电流分流区域使得本文公开的HV-MOSFET更加不可避免地存在ESD事件,因此在现实世界的应用中更可靠。

    Schottky Diode
    5.
    发明申请
    Schottky Diode 有权
    肖特基二极管

    公开(公告)号:US20130093038A1

    公开(公告)日:2013-04-18

    申请号:US13271725

    申请日:2011-10-12

    IPC分类号: H01L29/861

    摘要: An embodiment is a semiconductor structure. The semiconductor structure comprises a p-type region in a substrate; a first n-type well in the p-type region; a first p-type well in the p-type region; and a second p-type well in the first p-type well. A concentration of a p-type impurity in the first p-type well is less than a concentration of a p-type impurity in the second p-type well. Additional embodiments further comprise further n-type and p-type wells in the substrate. A method for forming a semiconductor structure is also disclosed.

    摘要翻译: 一个实施例是半导体结构。 半导体结构包括在衬底中的p型区域; p型区域中的第一个n型阱; p型区域中的第一个p型阱; 和第一个p型井中的第二个p型井。 第一p型阱中p型杂质的浓度小于第二p型阱中p型杂质的浓度。 另外的实施例还包括在衬底中的另外的n型和p型阱。 还公开了一种用于形成半导体结构的方法。

    High voltage ESD protection apparatus
    6.
    发明授权
    High voltage ESD protection apparatus 有权
    高压ESD保护装置

    公开(公告)号:US09356012B2

    公开(公告)日:2016-05-31

    申请号:US13243688

    申请日:2011-09-23

    IPC分类号: H01L27/02

    摘要: An ESD protection apparatus comprises a metal contact formed on the emitter of a transistor. The metal contact has a different conductivity type from the emitter. In addition, the metal contact and the emitter of the transistor form a diode connected in series with the transistor. The diode connected in series with the transistor provides extra headroom for the breakdown voltage of the ESD protection apparatus.

    摘要翻译: ESD保护装置包括形成在晶体管的发射极上的金属触点。 金属触点具有与发射极不同的导电类型。 此外,晶体管的金属接触和发射极形成与晶体管串联连接的二极管。 与晶体管串联连接的二极管为ESD保护装置的击穿电压提供了额外的余量。

    ESD protection apparatus
    7.
    发明授权
    ESD protection apparatus 有权
    ESD保护装置

    公开(公告)号:US08853825B2

    公开(公告)日:2014-10-07

    申请号:US13246672

    申请日:2011-09-27

    摘要: An ESD protection apparatus comprises a substrate, a low voltage p-type well and a low voltage n-type well formed on the substrate. The ESD protection device further comprises a first P+ region formed on the low voltage p-type well and a second P+ region formed on the low voltage n-type well. The first P+ region and the second P+ region are separated by a first isolation region. The breakdown voltage of the ESD protection apparatus is tunable by adjusting the length of the first isolation region.

    摘要翻译: ESD保护装置包括在基板上形成的基板,低电压p型阱和低电压n型阱。 ESD保护装置还包括形成在低电压p型阱上的第一P +区和形成在低电压n型阱上的第二P +区。 第一P +区和第二P +区被第一隔离区隔开。 ESD保护装置的击穿电压可以通过调整第一隔离区域的长度来调节。

    High-trigger current SCR
    8.
    发明授权
    High-trigger current SCR 有权
    高触发电流SCR

    公开(公告)号:US08841696B2

    公开(公告)日:2014-09-23

    申请号:US13459283

    申请日:2012-04-30

    IPC分类号: H01L23/36

    CPC分类号: H01L29/7436 H01L27/0262

    摘要: An SCR includes a first doped region of a first type having a first doping concentration. A first well of the first type and a first well of a second type are disposed in upper areas of the first doped region of the first type such that the first well of the second type is laterally spaced from the first well of the first type by a non-zero distance. A second doped region of the first type has a second doping concentration that is greater than the first doping concentration and is disposed in the first well of the second type to form an anode of the SCR. A first doped region of the second type is disposed in the first well of the first type and forms a cathode of the SCR.

    摘要翻译: SCR包括具有第一掺杂浓度的第一类型的第一掺杂区域。 第一类型的第一阱和第二类型的第一阱被布置在第一类型的第一掺杂区域的上部区域中,使得第二类型的第一阱与第一类型的第一阱横向间隔开, 非零距离。 第一类型的第二掺杂区域具有大于第一掺杂浓度的第二掺杂浓度,并且设置在第二类型的第一阱中以形成SCR的阳极。 第二类型的第一掺杂区域设置在第一类型的第一阱中并形成SCR的阴极。

    Schottky isolated NMOS for latch-up prevention
    9.
    发明授权
    Schottky isolated NMOS for latch-up prevention 有权
    肖特基隔离NMOS用于闭锁预防

    公开(公告)号:US08860168B2

    公开(公告)日:2014-10-14

    申请号:US13603329

    申请日:2012-09-04

    摘要: An integrated circuit structure includes a substrate, a semiconductor device supported by the substrate, and a guard ring structure disposed around the semiconductor device, the guard ring structure forming a Schottky junction. In an embodiment, the Schottky junction is formed from a p-type metal contact and an n-type guard ring. In an embodiment, the guard ring structure is electrically coupled to a positive or negative supply voltage.

    摘要翻译: 集成电路结构包括衬底,由衬底支撑的半导体器件以及围绕半导体器件设置的保护环结构,保护环结构形成肖特基结。 在一个实施例中,肖特基结由p型金属接触和n型保护环形成。 在一个实施例中,保护环结构电耦合到正或负电源电压。

    Schottky diode
    10.
    发明授权
    Schottky diode 有权
    肖特基二极管

    公开(公告)号:US08604582B2

    公开(公告)日:2013-12-10

    申请号:US13271725

    申请日:2011-10-12

    IPC分类号: H01L29/47

    摘要: An embodiment is a semiconductor structure. The semiconductor structure comprises a p-type region in a substrate; a first n-type well in the p-type region; a first p-type well in the p-type region; and a second p-type well in the first p-type well. A concentration of a p-type impurity in the first p-type well is less than a concentration of a p-type impurity in the second p-type well. Additional embodiments further comprise further n-type and p-type wells in the substrate. A method for forming a semiconductor structure is also disclosed.

    摘要翻译: 一个实施例是半导体结构。 半导体结构包括在衬底中的p型区域; p型区域中的第一个n型阱; p型区域中的第一个p型阱; 和第一个p型井中的第二个p型井。 第一p型阱中p型杂质的浓度小于第二p型阱中p型杂质的浓度。 另外的实施例还包括在衬底中的另外的n型和p型阱。 还公开了一种用于形成半导体结构的方法。