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1.发明授权公开(公告)号：US08053797B2
公开(公告)日：2011-11-08
申请号：US12234652
申请日：2008-09-20
IPC分类号： H01L33/00
摘要： The present invention provides a light-emitting device with a reflection layer and the structure of the reflection layer. The reflection layer comprises a variety of dielectric materials. The reflection layer includes a plurality of dielectric layers. The materials of the plurality of dielectric layers have two or more types with two or more thicknesses, except for the combination of two material types and two thicknesses, for forming the reflection layer with a variety of structures. The reflection layer according to the present invention can be applied to light-emitting diodes of various types to form new light-emitting devices. Owing to its excellent reflectivity, the reflection layer can improve light-emitting efficiency of the light-emitting devices.
摘要翻译： 本发明提供一种具有反射层的发光装置和反射层的结构。 反射层包括各种介电材料。 反射层包括多个电介质层。 除了两种材料类型和两种厚度的组合之外，多个电介质层的材料具有两种或更多种类型，具有两种或更多种厚度，用于形成具有各种结构的反射层。 根据本发明的反射层可以应用于各种类型的发光二极管，以形成新的发光器件。 由于反射率优异，因此能够提高发光元件的发光效率。
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公开(公告)号：US20100078671A1
公开(公告)日：2010-04-01
申请号：US12354820
申请日：2009-01-16
申请人： Kuo-Chin HUANG , Shyi-Ming Pan , Hung-Li Pan , Cheng-Kuo Huang , Wei-Kang Cheng , Yi-Sheng Ting
发明人： Kuo-Chin HUANG , Shyi-Ming Pan , Hung-Li Pan , Cheng-Kuo Huang , Wei-Kang Cheng , Yi-Sheng Ting
IPC分类号： H01L33/00
摘要： A nitride based semiconductor light emitting device is revealed. The light emitting device includes a light emitting epitaxial layer, a P-type electrode and a N-type electrode. The P-type electrode and the N-type electrode are disposed on the light emitting epitaxial layer. The light emitting device features on that the N-type electrode is arranged on the inner side of the P-type electrode. The P-type electrode extends toward the N-type electrode along the edge of the light emitting epitaxial layer and the N-type electrode extends inward along the inner side of the P-type electrode. By means of the electrode pattern with special design, the light emitting area of the light emitting device is increased.
摘要翻译： 揭示了一种基于氮化物的半导体发光器件。 发光器件包括发光外延层，P型电极和N型电极。 P型电极和N型电极设置在发光外延层上。 发光器件的特征在于N型电极布置在P型电极的内侧。 P型电极沿着发光外延层的边缘朝向N型电极延伸，并且N型电极沿着P型电极的内侧向内延伸。 通过具有特殊设计的电极图案，发光器件的发光面积增加。
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公开(公告)号：US08698175B2
公开(公告)日：2014-04-15
申请号：US12547571
申请日：2009-08-26
申请人： Wei-Kang Cheng , Jia-Lin Li , Shyi-Ming Pan , Kuo-Chin Huang
发明人： Wei-Kang Cheng , Jia-Lin Li , Shyi-Ming Pan , Kuo-Chin Huang
IPC分类号： H01L33/00
CPC分类号： H01L25/0753 , H01L33/486 , H01L33/504 , H01L33/507 , H01L33/508 , H01L33/56 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要： The present invention relates to a light-emitting diode (LED). The LED comprises an LED die, one or more metal pads, and a fluorescent layer. The characteristics of the present invention include that the metals pads are left exposed for the convenience of subsequent wiring and packaging processes. In addition, the LED provided by the present invention is a single light-mixing chip, which can be packaged directly without the need of coating fluorescent powders on the packaging glue. Because the fluorescent layer and the packaging glue are not processed simultaneously and are of different materials, the stress problem in the packaged LED can be reduced effectively.
摘要翻译： 本发明涉及一种发光二极管（LED）。 LED包括LED管芯，一个或多个金属焊盘和荧光层。 本发明的特征包括为了方便后续的布线和包装过程，将金属垫留下来露出。 此外，本发明提供的LED是单一的混合芯片，其可以直接包装而不需要在包装胶上涂布荧光粉。 由于荧光层和包装胶不是同时处理并且具有不同的材料，所以可以有效地降低封装LED中的应力问题。
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公开(公告)号：US20100081220A1
公开(公告)日：2010-04-01
申请号：US12552368
申请日：2009-09-02
申请人： Wei-Kang Cheng , Jia-Lin Li , Shyi-Ming Pan , Kuo-Chin Huang
发明人： Wei-Kang Cheng , Jia-Lin Li , Shyi-Ming Pan , Kuo-Chin Huang
IPC分类号： H01L21/56
CPC分类号： H01L25/0753 , H01L33/486 , H01L33/504 , H01L33/507 , H01L33/508 , H01L33/56 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要： The present invention relates to a light-emitting diode (LED) and a method for manufacturing the same. The LED comprises an LED die, one or more metal pads, and a fluorescent layer. The characteristics of the present invention include that the metals pads are left exposed for the convenience of subsequent wiring and packaging processes. In addition, the LED provided by the present invention is a single light-mixing chip, which can be packaged directly without the need of coating fluorescent powders on the packaging glue. Because the fluorescent layer and the packaging glue are not processed simultaneously and are of different materials, the stress problem in the packaged LED can be reduced effectively.
摘要翻译： 本发明涉及发光二极管（LED）及其制造方法。 LED包括LED管芯，一个或多个金属焊盘和荧光层。 本发明的特征包括为了方便后续的布线和包装过程，将金属垫留下来露出。 此外，本发明提供的LED是单一的混合芯片，其可以直接包装而不需要在包装胶上涂布荧光粉。 由于荧光层和包装胶不是同时处理并且具有不同的材料，所以可以有效地降低封装LED中的应力问题。
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公开(公告)号：US20100078667A1
公开(公告)日：2010-04-01
申请号：US12547571
申请日：2009-08-26
申请人： Wei-Kang Cheng , Jia-Lin Li , Shyi-Ming Pan , Kuo-Chin Huang
发明人： Wei-Kang Cheng , Jia-Lin Li , Shyi-Ming Pan , Kuo-Chin Huang
IPC分类号： H01L33/00
CPC分类号： H01L25/0753 , H01L33/486 , H01L33/504 , H01L33/507 , H01L33/508 , H01L33/56 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要： The present invention relates to a light-emitting diode (LED).The LED comprises an LED die, one or more metal pads, and a fluorescent layer. The characteristics of the present invention include that the metals pads are left exposed for the convenience of subsequent wiring and packaging processes. In addition, the LED provided by the present invention is a single light-mixing chip, which can be packaged directly without the need of coating fluorescent powders on the packaging glue. Because the fluorescent layer and the packaging glue are not processed simultaneously and are of different materials, the stress problem in the packaged LED can be reduced effectively.
摘要翻译： 本发明涉及一种发光二极管（LED）。该LED包括一个LED管芯，一个或多个金属焊盘和荧光层。 本发明的特征包括为了方便后续的布线和包装过程，将金属垫留下来露出。 此外，本发明提供的LED是单一的混合芯片，其可以直接包装而不需要在包装胶上涂布荧光粉。 由于荧光层和包装胶不是同时处理并且具有不同的材料，所以可以有效地降低封装LED中的应力问题。
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公开(公告)号：US07635871B2
公开(公告)日：2009-12-22
申请号：US12106277
申请日：2008-04-19
申请人： Shyi-Ming Pan , Wei-Kang Cheng , Kuo-Chin Huang
发明人： Shyi-Ming Pan , Wei-Kang Cheng , Kuo-Chin Huang
CPC分类号： H01L33/44 , H01L33/22 , H01L33/508 , H01L33/60 , H01L2224/32245 , H01L2224/32257 , H01L2224/45139 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2924/00
摘要： A light emitting diode (LED) with higher illumination efficiency is revealed. The LED includes a LED chip and an optical layer arranged on the bottom of the LED chip. The optical layer is a light-guiding layer, a light reflective layer or an energy-conversion layer that increases light emitting efficiency of the LED. Furthermore, a rough layer is disposed between the LED chip and the optical layer so as to increase surface area of the LED chip. Thus light emitted from the LED chip enters the optical layer more easily and the illumination efficiency of the LED is increased.
摘要翻译： 揭示了具有较高照明效率的发光二极管（LED）。 LED包括配置在LED芯片底部的LED芯片和光学层。 光学层是增加LED的发光效率的光导层，光反射层或能量转换层。 此外，在LED芯片和光学层之间设置粗糙层以增加LED芯片的表面积。 因此，从LED芯片发出的光更容易进入光学层，并且LED的照明效率提高。
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公开(公告)号：US20090189172A1
公开(公告)日：2009-07-30
申请号：US12106277
申请日：2008-04-19
申请人： Shyi-Ming Pan , Wei-Kang Cheng , Kuo-Chin Huang
发明人： Shyi-Ming Pan , Wei-Kang Cheng , Kuo-Chin Huang
IPC分类号： H01L33/00
CPC分类号： H01L33/44 , H01L33/22 , H01L33/508 , H01L33/60 , H01L2224/32245 , H01L2224/32257 , H01L2224/45139 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2924/00
摘要： A light emitting diode (LED) with higher illumination efficiency is revealed. The LED includes a LED chip and an optical layer arranged on the bottom of the LED chip. The optical layer is a light-guiding layer, a light reflective layer or an energy-conversion layer that increases light emitting efficiency of the LED. Furthermore, a rough layer is disposed between the LED chip and the optical layer so as to increase surface area of the LED chip. Thus light emitted from the LED chip enters the optical layer more easily and the illumination efficiency of the LED is increased.
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公开(公告)号：US08927303B2
公开(公告)日：2015-01-06
申请号：US12552368
申请日：2009-09-02
申请人： Wei-Kang Cheng , Jia-Lin Li , Shyi-Ming Pan , Kuo-Chi Huang
发明人： Wei-Kang Cheng , Jia-Lin Li , Shyi-Ming Pan , Kuo-Chi Huang
CPC分类号： H01L25/0753 , H01L33/486 , H01L33/504 , H01L33/507 , H01L33/508 , H01L33/56 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要： The present invention relates to a light-emitting diode (LED) and a method for manufacturing the same. The LED comprises an LED die, one or more metal pads, and a fluorescent layer. The characteristics of the present invention include that the metals pads are left exposed for the convenience of subsequent wiring and packaging processes. In addition, the LED provided by the present invention is a single light-mixing chip, which can be packaged directly without the need of coating fluorescent powders on the packaging glue. Because the fluorescent layer and the packaging glue are not processed simultaneously and are of different materials, the stress problem in the packaged LED can be reduced effectively.
摘要翻译： 本发明涉及发光二极管（LED）及其制造方法。 LED包括LED管芯，一个或多个金属焊盘和荧光层。 本发明的特征包括为了方便后续的布线和包装过程，将金属垫留下来露出。 此外，本发明提供的LED是单一的混合芯片，其可以直接包装而不需要在包装胶上涂布荧光粉。 由于荧光层和包装胶不是同时处理并且具有不同的材料，所以可以有效地降低封装LED中的应力问题。
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公开(公告)号：US20120061711A1
公开(公告)日：2012-03-15
申请号：US12959398
申请日：2010-12-03
申请人： Fang-I Li , Wei-Kang Cheng , Chih-Hsuan Lu , Yi-Sheng Ting , Shyi-Ming Pan
发明人： Fang-I Li , Wei-Kang Cheng , Chih-Hsuan Lu , Yi-Sheng Ting , Shyi-Ming Pan
IPC分类号： H01L33/36
CPC分类号： H01L33/38
摘要： A light emitting diode includes a substrate, an N-doped layer disposed on the substrate, a plurality of cathodes disposed between the N-doped layer and the substrate, an active layer disposed on the N-doped layer, a P-doped layer disposed on the active layer, and a plurality of anodes disposed on the P-doped layer. The cathodes are electrically connected to the N-doped layer, and the patterns of the cathodes are disconnected from each other. The anodes are electrically connected to the P-doped layer, and the patterns of the anodes are disconnected from each other. Each cathode and a corresponding anode form a loop, and each loop is an independent loop.
摘要翻译： 发光二极管包括衬底，设置在衬底上的N掺杂层，设置在N掺杂层和衬底之间的多个阴极，设置在N掺杂层上的有源层，设置P掺杂层 以及设置在P掺杂层上的多个阳极。 阴极电连接到N掺杂层，并且阴极的图案彼此断开。 阳极电连接到P掺杂层，并且阳极的图案彼此断开。 每个阴极和相应的阳极形成一个环，每个环是一个独立的环。
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公开(公告)号：US09296946B2
公开(公告)日：2016-03-29
申请号：US13541871
申请日：2012-07-05
申请人： Cheng-I Chu , Ru-Shi Liu , Yu-Chih Lin , Chen-Hong Lee , Wei-Kang Cheng , Yi-Sheng Ting , Shyi-Ming Pan
发明人： Cheng-I Chu , Ru-Shi Liu , Yu-Chih Lin , Chen-Hong Lee , Wei-Kang Cheng , Yi-Sheng Ting , Shyi-Ming Pan
CPC分类号： C09K11/0883 , C09K11/7734
摘要： A method of manufacturing an oxynitride phosphor is revealed. A precursor is sintered under 0.1-1000 MPa nitrogen pressure for synthesis of an oxynitride phosphor. The general formula of the oxynitride phosphors is Ba3-XSi6O12N2:EuxBa3-XSi6O6N6:Eux or Ba3-XSi6O9N4:Eux (0.00001≦x≦5; 0.00001). Thus pure phosphor can be mass-produced.
摘要翻译： 揭示了制造氮氧化物荧光体的方法。 将前体在0.1-1000MPa氮气压力下烧结以合成氮氧化物荧光体。 氧氮化物荧光体的通式为Ba3-XSi6O12N2：EuxBa3-XSi6O6N6：Eux或Ba3-XSi6O9N4：Eux（0.00001＆nlE; x＆nlE; 5; 0.00001）。 因此，可以批量生产纯的磷光体。
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