摘要:
A method is provided for forming a rare earth element-doped silicon oxide (SiO2) precursor with nanocrystalline (nc) Si particles. In one aspect the method comprises: mixing Si particles into a first organic solvent, forming a first solution with a first boiling point; filtering the first solution to remove large Si particles; mixing a second organic solvent having a second boiling point, higher than the first boiling point, to the filtered first solution; and, fractionally distilling, forming a second solution of nc Si particles. The Si particles are formed by immersing a Si wafer into a third solution including hydrofluoric (HF) acid and alcohol, applying an electric bias, and forming a porous Si layer overlying the Si wafer. Then, the Si particles are mixed into the organic solvent by depositing the Si wafer into the first organic solvent, and ultrasonically removing the porous Si layer from the Si wafer.
摘要:
A method is provided for forming a rare earth element-doped silicon oxide (SiO2) precursor with nanocrystalline (nc) Si particles. In one aspect the method comprises: mixing Si particles into a first organic solvent, forming a first solution with a first boiling point; filtering the first solution to remove large Si particles; mixing a second organic solvent having a second boiling point, higher than the first boiling point, to the filtered first solution; and, fractionally distilling, forming a second solution of nc Si particles. The Si particles are formed by immersing a Si wafer into a third solution including hydrofluoric (HF) acid and alcohol, applying an electric bias, and forming a porous Si layer overlying the Si wafer. Then, the Si particles are mixed into the organic solvent by depositing the Si wafer into the first organic solvent, and ultrasonically removing the porous Si layer from the Si wafer.
摘要:
A nanotip electroluminescence (EL) diode and a method are provided for fabricating said device. The method comprises: forming a plurality of Si nanotip diodes; forming a phosphor layer overlying the nanotip diode; and, forming a top electrode overlying the phosphor layer. The nanotip diodes are formed by: forming a Si substrate with a top surface; forming a Si p-well; forming an n+ layer of Si, having a thickness in the range of 30 to 300 nanometers (nm) overlying the Si p-well; forming a reactive ion etching (RIE)-induced polymer grass overlying the substrate top surface; using the RIE-induced polymer grass as a mask, etching areas of the substrate not covered by the mask; and, forming the nanotip diodes in areas of the substrate covered by the mask.
摘要:
A method is provided for forming a metal/semiconductor/metal (MSM) current limiter and resistance memory cell with an MSM current limiter. The method provides a substrate; forms an MSM bottom electrode overlying the substrate; forms a ZnOx semiconductor layer overlying the MSM bottom electrode, where x is in the range between about 1 and about 2, inclusive; and, forms an MSM top electrode overlying the semiconductor layer. The ZnOx semiconductor can be formed through a number of different processes such as spin-coating, direct current (DC) sputtering, radio frequency (RF) sputtering, metalorganic chemical vapor deposition (MOCVD), or atomic layer deposition (ALD).
摘要:
A method of monitoring synthesis of PCMO precursor solutions includes preparing a PCMO precursor solution and withdrawing samples of the precursor solution at intervals during a reaction phase of the PCMO precursor solution synthesis. The samples of the PCMO precursor solution are analyzed by UV spectroscopy to determine UV transmissivity of the samples of the PCMO precursor solution and the samples used to form PCMO thin films. Electrical characteristics of the PCMO thin films formed from the samples are determined to identify PCMO thin films having optimal electrical characteristics. The UV spectral characteristics of the PCMO precursor solutions are correlated with the PCMO thin films having optimal electrical characteristics. The UV spectral characteristics are used to monitor synthesis of future batches of the PCMO precursor solutions, which will result in PCMO thin films having optimal electrical characteristics.
摘要:
A method of fabricating a continuous layer of a defect sensitive material on a silicon substrate includes preparing a silicon substrate; forming a nanostructure array directly on the silicon substrate; depositing a selective growth enhancing layer on the substrate; smoothing the selective growth enhancing layer; and growing a continuous layer of the defect sensitive material on the nanostructure array.
摘要:
A method is provided for forming a metal/semiconductor/metal (MSM) current limiter and resistance memory cell with an MSM current limiter. The method includes the steps of: providing a substrate; forming an MSM bottom electrode overlying the substrate; forming a ZnOx semiconductor layer overlying the MSM bottom electrode, where x is in the range between about 1 and about 2, inclusive; and, forming an MSM top electrode overlying the semiconductor layer, The ZnOx semiconductor can be formed through a number of different processes such as spin-coating, direct current (DC) sputtering, radio frequency (RF) sputtering, metalorganic chemical vapor deposition (MOCVD), or atomic layer deposition (ALD).
摘要:
A method is provided for forming a buffered-layer memory cell. The method comprises: forming a bottom electrode; forming a colossal magnetoresistance (CMR) memory film overlying the bottom electrode; forming a memory-stable semiconductor buffer layer, typically a metal oxide, overlying the memory film; and, forming a top electrode overlying the semiconductor buffer layer. In some aspects of the method the semiconductor buffer layer is formed from YBa2Cu3O7−X (YBCO), indium oxide (In2O3), or ruthenium oxide (RuO2), having a thickness in the range of 10 to 200 nanometers (nm). The top and bottom electrodes may be TiN/Ti, Pt/TiN/Ti, In/TiN/Ti, PtRhOx compounds, or PtIrOx compounds. The CMR memory film may be a Pr1−XCaXMnO3 (PCMO) memory film, where x is in the region between 0.1 and 0.6, with a thickness in the range of 10 to 200 nm.
摘要翻译:提供了一种用于形成缓冲层存储单元的方法。 该方法包括:形成底部电极; 形成覆盖底部电极的巨大磁阻(CMR)记忆膜; 形成存储器稳定的半导体缓冲层,通常为覆盖存储膜的金属氧化物; 并且形成覆盖半导体缓冲层的顶部电极。 在该方法的一些方面,半导体缓冲层由YBa 2 N 3 O 7-X(YBCO),氧化铟(In 2或2 O 3)或氧化钌(RuO 2 N 2),其厚度在10-200纳米(nm)的范围内。 顶部和底部电极可以是TiN / Ti,Pt / TiN / Ti,In / TiN / Ti,PtRhOx化合物或PtIrOx化合物。 CMR存储器膜可以是Pr 1-X C x MnO 3(PCMO)存储膜,其中x在0.1之间的区域 和0.6,厚度在10至200nm的范围内。
摘要:
PrCaMnO (PCMO) thin films with predetermined memory-resistance characteristics and associated formation processes have been provided. In one aspect the method comprises: forming a Pr3+1−xCa2+xMnO thin film composition, where 0.1
摘要翻译:已经提供了具有预定的记忆电阻特性和相关的形成过程的PrCaMnO(PCMO)薄膜。 在一个方面,所述方法包括:形成Pr 3+ 1-x 2 Ca 2 O 3 x MnO薄膜 组成,其中0.1 0.78Mn4+</SUP>0.22O2-2.96 SUB>组合, Mn和O离子的比例变化如下:O 2 - (2.96); Mn(3+)+((1-x)+ 8%); 和Mn 4+(x-8%)。 在另一方面,该方法响应于晶体取向在PCMO膜中产生密度。 例如,如果PCMO膜具有(110)取向,则在垂直于(110)取向的平面中产生在每平方英尺5至6.76个Mn原子的范围内的密度。
摘要:
A method is provided for forming a Pr0.3Ca0.7MnO3 (PCMO) thin film with crystalline structure-related memory resistance properties. The method comprises: forming a PCMO thin film with a first crystalline structure; and, changing the resistance state of the PCMO film using pulse polarities responsive to the first crystalline structure. In one aspect the first crystalline structure is either amorphous or a weak-crystalline. Then, the resistance state of the PCMO film is changed in response to unipolar pulses. In another aspect, the PCMO thin film has either a polycrystalline structure. Then, the resistance state of the PCMO film changes in response to bipolar pulses.