公开(公告)号：US09173266B2

公开(公告)日：2015-10-27

申请号：US13551854

申请日：2012-07-18

申请人： Wen-Chia Liao ,  Li-Fan Lin ,  Ching-Chuan Shiue ,  Shih-Peng Chen

发明人： Wen-Chia Liao ,  Li-Fan Lin ,  Ching-Chuan Shiue ,  Shih-Peng Chen

IPC分类号： H01L33/50 ,  H05B33/08 ,  F21Y101/02 ,  F21Y103/00 ,  F21Y113/00

CPC分类号： H05B33/0857 ,  F21Y2103/10 ,  F21Y2113/13 ,  F21Y2115/10

摘要： An illumination apparatus includes a first light-emitting device, a second light-emitting device, and a third light-emitting device. The light emitted from the third light-emitting device is selectively mixed with the light emitted from the first light-emitting device or the second light-emitting device to form a white light having a chromaticity coordinate point substantially located on a Black Body Locus. A color of the light emitted from the third light-emitting device is determined by linear relationships between chromaticity coordinate points corresponding to wavelengths of the lights emitted form the first light-emitting device and the second light-emitting device and corresponding to a color temperature of the white light. A method for generating a white light is also disclosed herein.

摘要翻译： 照明装置包括第一发光装置，第二发光装置和第三发光装置。 从第三发光装置发射的光与从第一发光装置或第二发光装置发射的光有选择地混合，以形成具有基本上位于黑体轨迹上的色度坐标点的白光。 从第三发光装置发出的光的颜色由对应于从第一发光装置和第二发光装置发射的光的波长的色度坐标点之间的线性关系确定，并且对应于 白光。 本文还公开了产生白光的方法。

公开(公告)号：US08882313B2

公开(公告)日：2014-11-11

申请号：US13604021

申请日：2012-09-05

申请人： Li-Fan Lin ,  Ching-Chuan Shiue ,  Wen-Chia Liao ,  Shih-Peng Chen

发明人： Li-Fan Lin ,  Ching-Chuan Shiue ,  Wen-Chia Liao ,  Shih-Peng Chen

IPC分类号： F21V19/00

CPC分类号： H01L25/0753 ,  H01L33/507 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light emitting semiconductor element includes at least two electrically conductive units, at least a light emitting semiconductor die and a light transmitting layer. A groove is located between the two electrically conductive units. The light emitting semiconductor die is cross over the electrically conductive units. The light transmitting layer covers the light emitting semiconductor and partially fills within the groove for linking the electrically conductive units.

摘要翻译： 发光半导体元件至少包括两个导电单元，至少一个发光半导体管芯和透光层。 凹槽位于两个导电单元之间。 发光半导体管芯横跨导电单元。 透光层覆盖发光半导体，并部分地填充在沟槽内，用于连接导电单元。

公开(公告)号：US20120326173A1

公开(公告)日：2012-12-27

申请号：US13364963

申请日：2012-02-02

申请人： Wen-Chia LIAO ,  Li-Fan Lin ,  Ching-Chuan Shiue ,  Shih-Peng Chen

发明人： Wen-Chia LIAO ,  Li-Fan Lin ,  Ching-Chuan Shiue ,  Shih-Peng Chen

IPC分类号： H01L33/22 ,  H01L33/36 ,  H01L33/08

CPC分类号： H01L33/38 ,  H01L33/382 ,  H01L33/385 ,  H01L33/44

摘要： A light emitting diode comprises a multi-layer semiconductor, a first electrode and a second electrode. The multi-layer semiconductor has a light emitting active layer substantially perpendicular to the predetermined surface, a first semiconductor layer located on a surface of the light emitting active layer and a second semiconductor layer located on an opposite surface of the light emitting active layer. The first electrode is provided adjacent to and electrically connect to the first semiconductor layer. The second electrode is provided adjacent to and electrically connect to the second semiconductor layer. In addition, a method of fabricating LED element and a light emitting device having the LED elements are provided.

摘要翻译： 发光二极管包括多层半导体，第一电极和第二电极。 多层半导体具有基本上垂直于预定表面的发光有源层，位于发光有源层的表面上的第一半导体层和位于发光有源层的相对表面上的第二半导体层。 第一电极被设置成与第一半导体层相邻并电连接。 第二电极设置成与第二半导体层相邻并电连接。 此外，提供了制造LED元件的方法和具有LED元件的发光器件。

公开(公告)号：US20120281417A1

公开(公告)日：2012-11-08

申请号：US13448535

申请日：2012-04-17

申请人： Ghing-Cherng Sun ,  Shih-Peng Chen ,  Ching-Chuan Shiue ,  Li-Fan Lin ,  Shuang-Chao Chung ,  Shuang-Hau Yang

发明人： Ghing-Cherng Sun ,  Shih-Peng Chen ,  Ching-Chuan Shiue ,  Li-Fan Lin ,  Shuang-Chao Chung ,  Shuang-Hau Yang

IPC分类号： F21V13/04 ,  F21V13/12 ,  F21V7/08 ,  F21V7/06 ,  F21V7/04 ,  F21V13/08

CPC分类号： H01L33/60 ,  H01L33/58 ,  H01L2224/73265

摘要： A highly directional light source device, more specifically, a light emitting element electrically connected on a substrate to produce light, and one interior having a photon recycler with a reflective surface, covered and set on one side of this substrate, and an opening set in the center of the top of the cover which corresponds with the light emitting element, thereby allowing the light from the light emitting element to be directly emitted out the opening, and then to be reflected back to the light emitting element through the reflective surface of the photon recycler, and after light is reflected or refracted according to the structure of the light emitting element, again through the opening the light is emitted onto the photon recycler, thereby achieving increased Étendue of the highly directional light source device and achieving the goal of effective light emission.

摘要翻译： 高度定向的光源装置，更具体而言，电连接在基板上以产生光的发光元件，以及一个具有反射表面的光子回收器的内部，被覆盖并设置在该基板的一侧上， 与发光元件对应的盖的顶部的中心，从而允许来自发光元件的光直接从开口发射出来，然后通过反射表面反射回发光元件 光子回收器，并且根据发光元件的结构在光被反射或折射之后，再次通过开口将光发射到光子回收器上，从而实现高定向光源装置的增加，并实现有效的目标 发光。

公开(公告)号：US20120056223A1

公开(公告)日：2012-03-08

申请号：US13103986

申请日：2011-05-09

申请人： Hsieh-Shen Hsieh ,  Chao-Min Chen ,  Li-Fan Lin ,  Shih-Peng Chen ,  Huang-Kun Chen

发明人： Hsieh-Shen Hsieh ,  Chao-Min Chen ,  Li-Fan Lin ,  Shih-Peng Chen ,  Huang-Kun Chen

IPC分类号： H01L33/50 ,  H01L33/48 ,  H01L33/62

CPC分类号： H01L33/62 ,  H01L24/24 ,  H01L33/50 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73267 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/15153 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/3025 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00

摘要： A LED package structure includes a supporting substrate, a first electrically-conductive structure, a LED chip, an insulating layer and a second electrically-conductive structure. The supporting substrate includes a top surface, a bottom surface and a first channel. The first electrically-conductive structure is filled in the first channel and partially formed on the top and bottom surfaces of the supporting substrate. The LED chip is disposed over the supporting substrate. The insulating layer is formed over the supporting substrate and on bilateral sides of the LED chip. The insulating layer has a second channel corresponding to the first electrically-conductive structure. The second electrically-conductive structure is filled in the second channel and partially formed on the insulating layer, and connected with an electrode of the LED chip. The LED chip and the top and bottom surfaces of the supporting substrate are connected with each other through the first and second electrically-conductive structures.

摘要翻译： LED封装结构包括支撑衬底，第一导电结构，LED芯片，绝缘层和第二导电结构。 支撑基板包括顶表面，底表面和第一通道。 第一导电结构填充在第一通道中，并部分地形成在支撑基板的顶表面和底表面上。 LED芯片设置在支撑基板上。 绝缘层形成在支撑基板上和LED芯片的双侧上。 绝缘层具有对应于第一导电结构的第二通道。 第二导电结构填充在第二通道中，并部分地形成在绝缘层上，并与LED芯片的电极连接。 LED芯片和支撑基板的顶表面和底表面通过第一和第二导电结构相互连接。