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    Intelligent driving assistant systems
    2.
    发明授权
    Intelligent driving assistant systems 失效
    智能驾驶辅助系统

    公开(公告)号：US08244410B2

    公开(公告)日：2012-08-14

    申请号：US12382880

    申请日：2009-03-26

    申请人： Bing-Fei Wu ,  Chao-Jung Chen ,  Hsin-Yuan Peng ,  Ying-Han Chen ,  Wen-Hsin Lin

    发明人： Bing-Fei Wu ,  Chao-Jung Chen ,  Hsin-Yuan Peng ,  Ying-Han Chen ,  Wen-Hsin Lin

    IPC分类号： G05D1/00 ,  B60Q1/00

    CPC分类号： G08G1/167 ,  B60Q9/008 ,  B60W50/14

    摘要： The invention discloses an intelligent driving assistant system applied to a handheld device. The invention can detect more than one safety mode including lane departure detection, lost-cargo detection, detecting front-object under driving condition, detecting side-object under driving condition and detecting back-object under driving condition, also the invention can mention alarm according to the detection results from different modules. Finally the invention can store the real-time image according to the detection results from different modules, and then transfer the related information to other places for real-time notice with matching the information from the GPS system and the digitized map.

    摘要翻译： 本发明公开了一种应用于手持设备的智能驾驶辅助系统。 本发明可以检测多种安全模式，包括车道偏离检测，货物丢失检测，驾驶状态下的前方物体检测，驾驶状况下检测侧面物体，检测驾驶状况下的后方物体，本发明还可以提及报警 对不同模块的检测结果。 最后，本发明可以根据来自不同模块的检测结果存储实时图像，然后将相关信息传送到其他地方进行实时通知，与GPS系统和数字化地图匹配。

    Lactobacillus Plantarum and Uses Thereof
    3.
    发明申请
    Lactobacillus Plantarum and Uses Thereof 有权
    植物乳杆菌及其用途

    公开(公告)号：US20120020943A1

    公开(公告)日：2012-01-26

    申请号：US12868136

    申请日：2010-08-25

    申请人： Wen-Hsin Lin

    发明人： Wen-Hsin Lin

    IPC分类号： A61K35/74 ,  C12N1/20 ,  A61P1/02 ,  A61P31/04 ,  A61P13/02

    CPC分类号： C12R1/25 ,  A23L33/135 ,  A61K2035/115 ,  C12N1/20

    摘要： Provided is an isolated Lactobacillus plantarum CMU995, which was deposited at the Food Industry Research and Development Institute in Taiwan with the accession number BCRC 910472 and in the German Collection of Microorganisms and Cell Cultures (DSMZ) under accession number DSM 23780. Also provided are a composition comprising Lactobacillus plantarum CMU995 and a method for inhibiting pathogens, protecting the gastrointestinal tract, and/or protecting the urinary tract in a mammal comprising administrating an effective amount of Lactobacillus plantarum CMU995 to the mammal.

    摘要翻译： 提供了一种分离的植物乳杆菌CMU995，其保藏在台湾的食品工业研究开发研究所，登记号为BCRC 910472，并在德国收藏的微生物和细胞培养物（DSMZ）中，登录号DSM 23780。还提供了 组合物，其包含植物乳杆菌CMU995和抑制病原体，保护胃肠道和/或保护哺乳动物的尿道的方法，包括向哺乳动物施用有效量的植物乳酸乳杆菌CMU995。

    High-precision ceramic substrate preparation process
    4.
    发明申请
    High-precision ceramic substrate preparation process 审中-公开
    高精度陶瓷基板的制备工艺

    公开(公告)号：US20110123931A1

    公开(公告)日：2011-05-26

    申请号：US12805720

    申请日：2010-08-17

    申请人： Wen-Hsin Lin

    发明人： Wen-Hsin Lin

    IPC分类号： G03F7/20

    CPC分类号： H05K3/108 ,  H05K1/0306 ,  H05K3/062 ,  H05K3/281 ,  H05K2201/017

    摘要： A high-precision ceramic substrate preparation process is disclosed to bond a dry film to a metal layer on a ceramic plate, and then to coat a conductive layer on the metal layer and an anti-etching metal layer on the conductive layer after application of an exposing and developing process to form a predetermined circuit pattern in the dry film, and then to remove the dry film and to etch the metal layer, and then to bond an oxygen-free tape, which is prepared from a compound of ceramic powder, glass powder and pasting agent, to the conductive layer, and then to sinter the oxygen-free tape in an oxygen-free sintering furnace into a retaining wall, and then to coat an anti-oxidation bonding layer on the surface of the conductive layer.

    摘要翻译： 公开了一种高精度陶瓷基板制备方法，将干膜与陶瓷板上的金属层接合，然后在施加了导电层之后在导电层上涂覆金属层上的导电层和抗蚀刻金属层 曝光和显影工艺以在干膜中形成预定的电路图案，然后除去干膜并蚀刻金属层，然后粘合由陶瓷粉末化合物玻璃制成的无氧胶带 粉末和粘贴剂，导电层，然后在无氧烧结炉中将无氧胶带烧结成保持壁，然后在导电层的表面上涂覆抗氧化粘合层。

    Display Device and Light Source Block Used Therein
    5.
    发明申请
    Display Device and Light Source Block Used Therein 有权
    其中使用的显示设备和光源块

    公开(公告)号：US20100039580A1

    公开(公告)日：2010-02-18

    申请号：US12493369

    申请日：2009-06-29

    申请人： Chien-Hung Chen ,  Ching-Kun Lai ,  Wen-Hsin Lin ,  Wei-Chih Chiu

    发明人： Chien-Hung Chen ,  Ching-Kun Lai ,  Wen-Hsin Lin ,  Wei-Chih Chiu

    IPC分类号： G02F1/1335 ,  G02B5/00

    CPC分类号： G02B5/003 ,  G02F1/133608

    摘要： A display device and a light source block used therein are provided. The display device includes the light source block, a film set, and a display panel. The light source block has a reflective surface, a film supporter intersecting the reflective surface at an edge, and a panel supporting surface. The film supporter connects an end of an extremity surface, and the panel supporting surface connects the other end of the extremity surface. The film set is disposed on the film supporter, and the display panel is disposed on the panel supporting surface. The display panel has a display area and a light-shielding unit disposed outside the display area. The edge between the reflective surface and the film supporter falls into a vertical projection of the light-shielding unit.

    摘要翻译： 提供了一种其中使用的显示装置和光源块。 显示装置包括光源块，胶片组和显示面板。 光源块具有反射表面，与边缘处的反射表面相交的膜支撑件和面板支撑表面。 胶片支架连接末端表面的一端，面板支撑面连接肢体表面的另一端。 胶片组设置在胶片支持体上，显示面板设置在面板支撑面上。 显示面板具有设置在显示区域外的显示区域和遮光单元。 反射面与胶片支持体之间的边缘落入遮光单元的垂直投影中。

    Image sensing component package and manufacture method thereof
    6.
    发明授权
    Image sensing component package and manufacture method thereof 有权

    公开(公告)号：US06670551B2

    公开(公告)日：2003-12-30

    申请号：US09871993

    申请日：2001-06-04

    申请人： Wen-Hsin Lin ,  Fa-Tai Wang

    发明人： Wen-Hsin Lin ,  Fa-Tai Wang

    IPC分类号： H05K506

    CPC分类号： H01L27/14618 ,  H01L2924/0002 ,  H01L2924/00

    摘要： The present invention discloses an image sensing semiconductor package and manufacture method thereof utilizing the plastic leaded chip carrier (PLCC) manufacture process to produce image sensing chips with a cheaper plastic carrier, and it also seals dry high-pressure gas inside the image sensing chip in the manufacture process. Therefore, when the image sensing chip is used in a device, it can prevent moisture in the air from entering into the interior of the image sensing component due to pressure difference that will shorten the lifespan of the image sensing chip. The invention also provides a component rinsing procedure for the image sensing semiconductor package manufacture process, so that no environmental factor of the manufacture process such as humidity and dust particles will affect the sensitivity of the chip or the normal display of the screen, and hence lower the defective rate of the product.

    Display device and light source block used therein
    7.
    发明授权
    Display device and light source block used therein 有权
    其中使用的显示装置和光源块

    公开(公告)号：US08395719B2

    公开(公告)日：2013-03-12

    申请号：US12493369

    申请日：2009-06-29

    申请人： Chien-Hyung Chen ,  Ching-Kun Lai ,  Wen-Hsin Lin ,  Wei-Chih Chiu

    发明人： Chien-Hyung Chen ,  Ching-Kun Lai ,  Wen-Hsin Lin ,  Wei-Chih Chiu

    IPC分类号： G02F1/1333 ,  G02F1/1335

    CPC分类号： G02B5/003 ,  G02F1/133608

    摘要： A display device and a light source block used therein are provided. The display device includes the light source block, a film set, and a display panel. The light source block has a reflective surface, a film supporter intersecting the reflective surface at an edge, and a panel supporting surface. The film supporter connects an end of an extremity surface, and the panel supporting surface connects the other end of the extremity surface. The film set is disposed on the film supporter, and the display panel is disposed on the panel supporting surface. The display panel has a display area and a light-shielding unit disposed outside the display area. The edge between the reflective surface and the film supporter falls into a vertical projection of the light-shielding unit.

    摘要翻译： 提供了一种其中使用的显示装置和光源块。 显示装置包括光源块，胶片组和显示面板。 光源块具有反射表面，与边缘处的反射表面相交的膜支撑件和面板支撑表面。 胶片支架连接末端表面的一端，面板支撑面连接肢体表面的另一端。 胶片组设置在胶片支持体上，显示面板设置在面板支撑面上。 显示面板具有设置在显示区域外的显示区域和遮光单元。 反射面与胶片支持体之间的边缘落入遮光单元的垂直投影中。

    Ceramic substrate preparation process
    9.
    发明申请
    Ceramic substrate preparation process 审中-公开
    陶瓷基板制备工艺

    公开(公告)号：US20110123930A1

    公开(公告)日：2011-05-26

    申请号：US12805056

    申请日：2010-07-09

    申请人： Wen-Hsin Lin

    发明人： Wen-Hsin Lin

    IPC分类号： G03F7/20 ,  C23C14/34

    CPC分类号： H05K3/045 ,  H05K1/0306 ,  H05K3/244

    摘要： An etching-free ceramic substrate preparation process includes the step of bonding a dry film to one side of a ceramic plate, the step of applying an exposing and developing process to the dry film to form a predetermined circuit layout on the dry film, the step of coating a thin-thickness first metal layer on the ceramic plate and the dry film, the step of forming a copper layer on the first metal layer by a coating technique, the step of cutting/grinding the dry film, the first metal layer and the copper layer to remove the dry film from the ceramic plate, the step of obtaining the desired height of the copper layer on the ceramic plate, and the step of forming a second metal layer on the surface of the copper layer by a coating technique.

    摘要翻译： 无腐蚀陶瓷基板的制备方法包括将干膜粘结在陶瓷板的一面上的步骤，对干膜施加曝光和显影处理以在干膜上形成预定的电路布局的步骤，步骤 在陶瓷板和干膜上涂覆薄的第一金属层，通过涂布技术在第一金属层上形成铜层的步骤，切割/研磨干膜，第一金属层和 从陶瓷板除去干膜的铜层，获得陶瓷板上的铜层的期望高度的步骤，以及通过涂布技术在铜层的表面上形成第二金属层的工序。

    Backlight module
    10.
    发明授权
    Backlight module 有权
    背光模组

    公开(公告)号：US07922379B2

    公开(公告)日：2011-04-12

    申请号：US12209217

    申请日：2008-09-12

    申请人： Wen-Hsin Lin ,  Chien-Hung Chen ,  Tsung-Fu Cheng ,  Ren-Wei Huang

    发明人： Wen-Hsin Lin ,  Chien-Hung Chen ,  Tsung-Fu Cheng ,  Ren-Wei Huang

    IPC分类号： F21V19/00

    CPC分类号： G02F1/133604 ,  G02F1/133605 ,  G02F1/133608

    摘要： A backlight module including a back cover, a reflector, a lamp supporter, and a number of lamps is provided. The back cover includes a number of holes, an inner face, and an outer face. The reflector is disposed on the inner face and has a number of openings. The openings expose parts of the holes. The lamp supporter has a base substrate and a number of carriers that are connected to the base substrate. The base substrate is assembled to the outer face of the back cover, and the carriers penetrate the holes of the back cover and the openings of the reflector. The lamps are disposed in the carriers, such that the lamps and the base substrate are located at two opposite sides of the back cover.

    摘要翻译： 提供了包括后盖，反射器，灯支撑件和多个灯的背光模块。 后盖包括多个孔，内表面和外表面。 反射器设置在内表面上并且具有多个开口。 这些开口露出孔的部分。 灯支架具有基底基板和多个与基底基板连接的载体。 基底基板组装到后盖的外表面，载体穿过后盖的孔和反射器的开口。 灯被布置在载体中，使得灯和基底基板位于后盖的两个相对侧。