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公开(公告)号：US07279782B2
公开(公告)日：2007-10-09
申请号：US11029929
申请日：2005-01-05
申请人： Wen-Kun Yang , Chin-Chen Yang , Wen-Bin Sun , Jui-Hsien Chang , Chun Hui Yu , His-Ying Yuan
发明人： Wen-Kun Yang , Chin-Chen Yang , Wen-Bin Sun , Jui-Hsien Chang , Chun Hui Yu , His-Ying Yuan
IPC分类号： H01L23/02
CPC分类号： H01L27/14618 , H01L27/14625 , H01L27/14627 , H01L2224/48227 , H01L2924/10253 , H01L2924/16235 , H01L2924/181 , H01L2924/3011 , H01L2924/00 , H01L2924/00012
摘要： A structure of package comprises a die placed on printed circuit board. A glass substrate is adhered on an adhesive film pattern to form an air gap area between the glass substrate and the chip. Micro lens are disposed on the chip. A lens holder is fixed on printed circuit board. The glass substrate can prevent the micro lens from particle contamination.
摘要翻译： 封装结构包括放置在印刷电路板上的管芯。 将玻璃基板粘附在粘合膜图案上以在玻璃基板和芯片之间形成气隙区域。 微透镜设置在芯片上。 透镜架固定在印刷电路板上。 玻璃基板可防止微透镜受到颗粒污染。
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公开(公告)号：US07525139B2
公开(公告)日：2009-04-28
申请号：US11025746
申请日：2004-12-29
申请人： Wen-Kun Yang , Chin-Chen Yang , Wen-Ping Yang , Wen-Bin Sun , Chao-nan Chou , His-Ying Yuan , Jui-Hsien Chang
发明人： Wen-Kun Yang , Chin-Chen Yang , Wen-Ping Yang , Wen-Bin Sun , Chao-nan Chou , His-Ying Yuan , Jui-Hsien Chang
IPC分类号： H01L31/062
CPC分类号： H01L27/14687 , H01L21/561 , H01L24/97 , H01L27/14618 , H01L27/14625 , H01L27/14627 , H01L27/14632 , H01L27/14685 , H01L31/0203 , H01L31/02325 , H01L2224/04105 , H01L2224/20 , H01L2224/211 , H01L2224/24137 , H01L2224/32145 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2224/97 , H01L2924/01068 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/15788 , H05K1/189 , H01L2924/00 , H01L2224/83 , H01L2224/82
摘要： An image sensor die comprises a substrate and an image sensor array formed over the substrate. Micro lens are disposed on the image sensor array. A protection layer is formed on the micro lens to prevent the micro lens from particle containment.
摘要翻译： 图像传感器管芯包括衬底和形成在衬底上的图像传感器阵列。 微透镜设置在图像传感器阵列上。 在微透镜上形成保护层，以防止微透镜受到颗粒的抑制。
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公开(公告)号：US20050242409A1
公开(公告)日：2005-11-03
申请号：US11025746
申请日：2004-12-29
申请人： Wen-Kun Yang , Chin-Chen Yang , Wen-Ping Yang , Wen-Bin Sun , Chao-nan Chou , His-Ying Yuan , Jui-Hsien Chang
发明人： Wen-Kun Yang , Chin-Chen Yang , Wen-Ping Yang , Wen-Bin Sun , Chao-nan Chou , His-Ying Yuan , Jui-Hsien Chang
IPC分类号： H01L27/14 , H01L21/00 , H01L21/50 , H01L21/56 , H01L23/12 , H01L23/50 , H01L27/144 , H01L27/146 , H01L29/06 , H01L31/00 , H01L31/0203 , H01L31/0232 , H01L31/10 , H04N5/225 , H05K1/18
CPC分类号： H01L27/14687 , H01L21/561 , H01L24/97 , H01L27/14618 , H01L27/14625 , H01L27/14627 , H01L27/14632 , H01L27/14685 , H01L31/0203 , H01L31/02325 , H01L2224/04105 , H01L2224/20 , H01L2224/211 , H01L2224/24137 , H01L2224/32145 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2224/97 , H01L2924/01068 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/15788 , H05K1/189 , H01L2924/00 , H01L2224/83 , H01L2224/82
摘要： An image sensor die comprises a substrate and an image sensor array formed over the substrate. Micro lens are disposed on the image sensor array. A protection layer is formed on the micro lens to prevent the micro lens from particle containment.
摘要翻译： 图像传感器管芯包括衬底和形成在衬底上的图像传感器阵列。 微透镜设置在图像传感器阵列上。 在微透镜上形成保护层，以防止微透镜受到颗粒的抑制。
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公开(公告)号：US20060145325A1
公开(公告)日：2006-07-06
申请号：US11029929
申请日：2005-01-05
申请人： Wen-Kun Yang , Chin-Chen Yang , Wen-Bin Sun , Jui-Hsien Chang , Chun Yu , His-Ying Yuan
发明人： Wen-Kun Yang , Chin-Chen Yang , Wen-Bin Sun , Jui-Hsien Chang , Chun Yu , His-Ying Yuan
IPC分类号： H01L23/02
CPC分类号： H01L27/14618 , H01L27/14625 , H01L27/14627 , H01L2224/48227 , H01L2924/10253 , H01L2924/16235 , H01L2924/181 , H01L2924/3011 , H01L2924/00 , H01L2924/00012
摘要： A structure of package comprises a die placed on printed circuit board. A glass substrate is adhered on an adhesive film pattern to form an air gap area between the glass substrate and the chip. Micro lens are disposed on the chip. A lens holder is fixed on printed circuit board. The glass substrate can prevent the micro lens from particle contamination.
摘要翻译： 封装结构包括放置在印刷电路板上的管芯。 将玻璃基板粘附在粘合膜图案上以在玻璃基板和芯片之间形成气隙区域。 微透镜设置在芯片上。 透镜架固定在印刷电路板上。 玻璃基板可防止微透镜受到颗粒污染。
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5.发明授权Packaging structure with coplanar filling paste and dice and with patterned glue for WL-CSP 有权包装结构具有共面填充膏和骰子，并具有WL-CSP图案胶公开(公告)号：US07400037B2
公开(公告)日：2008-07-15
申请号：US11026488
申请日：2004-12-30
申请人： Wen-Kun Yang , Chin-Chen Yang , Cheng-hsien Chiu , Wen-Bin Sun , Kuang-Chi Chao , His-Ying Yuan , Chun-Hui Yu
发明人： Wen-Kun Yang , Chin-Chen Yang , Cheng-hsien Chiu , Wen-Bin Sun , Kuang-Chi Chao , His-Ying Yuan , Chun-Hui Yu
IPC分类号： H01L23/34
CPC分类号： H01L21/6835 , H01L23/5389 , H01L24/29 , H01L24/83 , H01L2224/2919 , H01L2224/8385 , H01L2924/01006 , H01L2924/01015 , H01L2924/01027 , H01L2924/01033 , H01L2924/01094 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/14 , H01L2924/181 , H01L2924/00
摘要： A filling paste structure and process of wafer level package is disclosed. The process comprises filling an adhesive material to fill among plurality of dice and cover the plurality of dice. The pluralities of dice are adhered to glue pattern with viscosity in common state formed on a removable substrate. A rigid substrate is coated by adhesive material to adhere the dice. Then, pluralities of dice are departed from the glue pattern by a special environment after attaching the rigid base substrate.
摘要翻译： 公开了一种填充浆料结构和晶片级封装的工艺。 该方法包括填充粘合剂材料以填充多个骰子并覆盖多个骰子。 多个骰子粘附在形成在可移除基底上的共同状态下的粘度的胶图案上。 用粘合剂材料涂覆刚性基材以粘附骰子。 然后，在连接刚性基底之后，多个骰子由特殊的环境离开胶合图案。
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公开(公告)号：US20060145364A1
公开(公告)日：2006-07-06
申请号：US11026488
申请日：2004-12-30
申请人： Wen-Kun Yang , Chin-Chen Yang , Cheng-hsien Chiu , Wen-Bin Sun , Kuang-Chi Chao , His-Ying Yuan , Chun-Hui Yu
发明人： Wen-Kun Yang , Chin-Chen Yang , Cheng-hsien Chiu , Wen-Bin Sun , Kuang-Chi Chao , His-Ying Yuan , Chun-Hui Yu
IPC分类号： H01L23/29
CPC分类号： H01L21/6835 , H01L23/5389 , H01L24/29 , H01L24/83 , H01L2224/2919 , H01L2224/8385 , H01L2924/01006 , H01L2924/01015 , H01L2924/01027 , H01L2924/01033 , H01L2924/01094 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/14 , H01L2924/181 , H01L2924/00
摘要： A filling paste structure and process of wafer level package is disclosed. The process comprises filling an adhesive material to fill among plurality of dice and cover the plurality of dice. The pluralities of dice are adhered to glue pattern with viscosity in common state formed on a removable substrate. A rigid substrate is coated by adhesive material to adhere the dice. Then, pluralities of dice are departed from the glue pattern by a special environment after attaching the rigid base substrate.
摘要翻译： 公开了一种填充浆料结构和晶片级封装的工艺。 该方法包括填充粘合剂材料以填充多个骰子并覆盖多个骰子。 多个骰子粘附在形成在可移除基底上的共同状态下的粘度的胶图案上。 用粘合剂材料涂覆刚性基材以粘附骰子。 然后，在连接刚性基底之后，多个骰子由特殊的环境离开胶合图案。
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