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23 条记录 (耗时 0.027 秒)

    Manually operated switch for a faucet
    7.
    发明授权
    Manually operated switch for a faucet 有权
    水龙头手动开关

    公开(公告)号：US07258322B1

    公开(公告)日：2007-08-21

    申请号：US11406605

    申请日：2006-04-19

    申请人： Chin-Chen Yang

    发明人： Chin-Chen Yang

    IPC分类号： F16K31/44

    CPC分类号： F16K1/12 ,  E03C1/0404 ,  E03C2201/30 ,  Y10T137/9464

    摘要： A manually operated switch for a faucet has a body, an inner pipe, a switching valve assembly. The body is hollow. The inner pipe is located inside of the body and has a flowing way. The flowing way is formed through the inner pipe. The switching valve assembly is slidably mounted inside of the flowing way of the inner pipe and extends out the body. When the switching valve assembly closes the flowing way of the inner pipe, the water pressure will keep the switching valve assembly closed. After the water pressure applied to the switching valve assembly is released or dismissed, the switching valve assembly returns back to an original position so that the flowing way is opened. The opening and closing flowing way can manually control the way of water flowing so that a user may not be scared or burned by the water.

    摘要翻译： 用于水龙头的手动操作开关具有主体，内管，切换阀组件。 身体是空洞的 内管位于身体内部并具有流动的方式。 流动的方式通过内管形成。 切换阀组件可滑动地安装在内管的流动方式的内部并延伸出主体。 当切换阀组件关闭内管的流动方式时，水压将保持切换阀组件关闭。 在施加到切换阀组件的水压被释放或解除之后，切换阀组件返回到初始位置，使得流动方式打开。 打开和关闭流动的方式可以手动控制水的流动方式，使得使用者不会被水吓到或燃烧。

    Method for forming compact LCD packages and devices formed in which first bonding PCB to LCD panel and second bonding driver chip to PCB
    8.
    发明授权
    Method for forming compact LCD packages and devices formed in which first bonding PCB to LCD panel and second bonding driver chip to PCB 有权
    用于形成紧凑型LCD封装和器件的方法，其中将PCB粘合到LCD面板和将第二粘合驱动器芯片粘合到PCB

    公开(公告)号：US06556268B1

    公开(公告)日：2003-04-29

    申请号：US09282689

    申请日：1999-03-31

    申请人： Yu-Chi Lee ,  Chin-Chen Yang ,  Hong-Yu Lin ,  Fang-I Shieh

    发明人： Yu-Chi Lee ,  Chin-Chen Yang ,  Hong-Yu Lin ,  Fang-I Shieh

    IPC分类号： G02F11345

    CPC分类号： G02F1/13452 ,  H05K1/189 ,  H05K3/361

    摘要： A method for forming a compact LCD package and devices formed by such method are disclosed. In the method, an LCD display panel is formed by bonding an upper glass panel and a lower glass panel together and exposing an edge portion formed by a larger lower glass panel. Conductive traces formed of a conductive film layer such as ITO is provided on the edge portion of the LCD display panel for providing electrical connection to the drive lines and scan lines for the LCD panel. A two-step bonding method is used to first bond a printed circuit board in a pre-bonding step to the exposed edge portion of the LCD panel by using an anisotropic conductive film layer. The bonding is conducted under pressure and heat such that electrical communication is established through the conductive metal particles contained in the anisotropic conductive film. In a second, or post-bonding step, an IC chip or a driver chip is bonded to the top of the PCB by a multiplicity of solder bumps formed on the driver chip connecting electrically to a second multiplicity of conductive pads formed on top of the PCB substrate. The present invention novel method therefore produces a more compact LCD package which saves a planar area in an edge portion by at least 50%. In the first pre-bonding method that utilizes an anisotropic conductive film, fabrication equipment for an outer lead bonding method can be utilized. In the post-bonding step, fabrication equipment for an inner lead bonding method can be used.

    摘要翻译： 公开了一种用于形成紧凑型LCD封装的方法和通过这种方法形成的器件。 在该方法中，通过将上玻璃面板和下玻璃面板结合在一起并露出由较大的下玻璃面板形成的边缘部分而形成LCD显示面板。 在LCD显示面板的边缘部分设置由诸如ITO的导电膜层形成的导电迹线，用于提供与LCD面板的驱动线和扫描线的电连接。 使用两步接合方法通过使用各向异性导电膜层将预粘合步骤中的印刷电路板首先结合到LCD面板的暴露边缘部分。 在压力和热量下进行接合，使得通过各向异性导电膜中所含的导电金属颗粒建立电连通。 在第二或后贴合步骤中，IC芯片或驱动器芯片通过形成在驱动器芯片上的多个焊料凸块接合到PCB的顶部，该焊料凸块电连接到形成在第二多个导电焊盘上的第二多个导电焊盘 PCB基板。 因此，本发明的新方法产生更紧凑的LCD封装，其将边缘部分中的平面区域保持至少50％。 在利用各向异性导电膜的第一预接合方法中，可以利用外引线接合方法的制造设备。 在后贴合步骤中，可以使用内引线接合方法的制造设备。