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51 条记录 (耗时 0.025 秒)

    Methods and apparatus for supporting substrates
    1.
    发明授权
    Methods and apparatus for supporting substrates 有权
    用于支撑基材的方法和装置

    公开(公告)号：US08365682B2

    公开(公告)日：2013-02-05

    申请号：US11140777

    申请日：2005-05-31

    申请人： Wendell T. Blonigan ,  Carl Sorensen ,  John M. White ,  Robin L. Tiner

    发明人： Wendell T. Blonigan ,  Carl Sorensen ,  John M. White ,  Robin L. Tiner

    IPC分类号： B65G49/07

    CPC分类号： H01L21/67259 ,  H01L21/68742 ,  H01L21/68778

    摘要： Substrate support methods and apparatus include vertically aligned lift pins that have bearing surfaces that engage friction plates and/or magnetic fields to maintain the vertical orientation of the lift pins during substrate lifting. In some embodiments, a magnetic field and/or weighting may alternatively or additionally be used to control the vertical orientation of the lift pins, limit the angle of the lift pins, and/or prevent the lift pins from unintentionally binding in a susceptor as the susceptor is raised and prevent the resulting uneven support of the substrate.

    摘要翻译： 衬底支撑方法和装置包括垂直对齐的提升销，其具有接合摩擦板和/或磁场的承载表面，以在衬垫提升期间保持提升销的垂直取向。 在一些实施例中，可以替代地或另外地使用磁场和/或加权来控制提升销的垂直定向，限制提升销的角度和/或防止提升销在基座中无意地结合，因为 感受器被升高并且防止由此产生的基板不均匀的支撑。

    RF GROUNDING OF CATHODE IN PROCESS CHAMBER
    4.
    发明申请
    RF GROUNDING OF CATHODE IN PROCESS CHAMBER 审中-公开
    过程室中阴极射频接地

    公开(公告)号：US20090178617A1

    公开(公告)日：2009-07-16

    申请号：US12406407

    申请日：2009-03-18

    申请人： John M. White ,  Robin L. Tiner ,  Beom Soo Park ,  Wendell T. Blonigan

    发明人： John M. White ,  Robin L. Tiner ,  Beom Soo Park ,  Wendell T. Blonigan

    IPC分类号： C23C16/513

    CPC分类号： H01J37/32082 ,  H01J37/32174

    摘要： An apparatus for providing a short return current path for RF current between a process chamber wall and a substrate support is provided. The RF grounding apparatus, which is RF grounded and is place above the substrate transfer port, establishes electrical contact with the substrate support only during substrate processing, such as deposition, to provide return current path for the RF current. One embodiment of the RF grounding apparatus comprises one or more low impedance flexible curtains, which are electrically connected to the grounded chamber wall, and to one or more low impedance blocks, which make contacts with the substrate support during substrate processing. Another embodiment of the RF grounding apparatus comprises a plurality of low impedance flexible straps, which are electrically connected to the grounded chamber wall, and to one or more low impedance blocks, which make contacts with the substrate support during substrate processing. Yet another embodiment of the RF grounding apparatus comprises a plurality of probes, which either are electrically connected to the grounded chamber wall or are grounded by other means, and actuators accompanying the probes. The actuators move the probes to make electrical contact with the substrate support during substrate processing.

    摘要翻译： 提供一种用于在处理室壁和衬底支撑件之间提供用于RF电流的短的返回电流路径的装置。 射频接地装置，其RF接地并位于衬底传送端口之上，仅在衬底处理（例如沉积）期间与衬底支撑件电接触，以提供RF电流的返回电流路径。 RF接地装置的一个实施例包括电连接到接地室壁的一个或多个低阻抗柔性窗帘，以及在衬底处理期间与衬底支撑件接触的一个或多个低阻抗块。 RF接地装置的另一实施例包括多个低阻抗柔性带，其电连接到接地室壁，以及一个或多个低阻抗块，其在衬底处理期间与衬底支撑件接触。 RF接地装置的另一个实施例包括多个探针，它们或者被电连接到接地室壁，或者通过其它装置接地，以及伴随探头的致动器。 致动器在衬底处理期间移动探针以与衬底支撑件电接触。

    Method and apparatus for substrate transfer and processing
    5.
    发明授权
    Method and apparatus for substrate transfer and processing 失效

    公开(公告)号：US06213704B1

    公开(公告)日：2001-04-10

    申请号：US09082428

    申请日：1998-05-20

    申请人： John M. White ,  Wendell T. Blonigan ,  Robin L. Tiner ,  Shinichi Kurita

    发明人： John M. White ,  Wendell T. Blonigan ,  Robin L. Tiner ,  Shinichi Kurita

    IPC分类号： B65G4907

    CPC分类号： H01L21/67748 ,  B65G49/061 ,  B65G49/064 ,  B65G2249/02 ,  H01L21/67173 ,  H01L21/67207 ,  H01L21/67236 ,  Y10S414/139

    摘要： The present invention allows large glass substrates to be rapidly moved from one processing station to another. Such movement occurs such that drives in different chambers are synchronized to move the glass substrates on shuttles at appropriate times. In systems according to the invention, at least a first and second chamber are provided. Typically, the first chamber is a load lock and the second chamber is a processing chamber. A substrate transfer shuttle is used to move substrate along a guide path defined by, e.g., guide rollers. Drive mechanisms are employed for most chambers to drive the shuttle along associated portions of the path. A control system is provided which powers the drive mechanism for the first chamber to drive the substrate transfer shuttle from a first position toward a second position and through an intermediate position. At the intermediate position, the substrate transfer shuttle begins to engage and induce movement of the drive mechanism for the second chamber. The control system receives an input caused by the induced movement of the drive mechanism for the second chamber, this input indicative of the substrate transfer shuttle having moved a predetermined distance beyond the intermediate position. The input may then be used to synchronize movement of the substrate transfer shuttle from the first chamber to the second chamber. Such synchronization may include reducing power to the drive mechanism for the first chamber and/or powering the drive mechanism for the second chamber.

    Linear vacuum deposition system
    6.
    发明授权
    Linear vacuum deposition system 失效
    线性真空沉积系统

    公开(公告)号：US07438175B2

    公开(公告)日：2008-10-21

    申请号：US11176085

    申请日：2005-07-07

    申请人： John M. White ,  Wendell T. Blonigan

    发明人： John M. White ,  Wendell T. Blonigan

    IPC分类号： B65G43/08

    CPC分类号： H01L21/67739 ,  C23C14/56 ,  C23C14/568 ,  C23C16/54

    摘要： Embodiments of a vacuum conveyor system are provided herein. In one embodiment a vacuum conveyor system includes a first vacuum sleeve having a plurality of rollers that support and move substrates through the first vacuum sleeve. A port is provided for sealably coupling the first vacuum sleeve to a process chamber. A first substrate handler is disposed proximate the port. Multiple ports may be provided for sealably coupling the first vacuum sleeve to a plurality of process chambers. A dedicated substrate handler is provided for each process chamber. A second vacuum sleeve may be sealably coupled to an opposing side of the process chambers. The vacuum conveyor system may be modular with independent modules linked via load lock chambers. The plurality of rollers may compensate for any sag of the leading edge of a substrate being transported thereupon.

    摘要翻译： 本文提供了真空输送系统的实施例。 在一个实施例中，真空输送系统包括具有支撑并移动基板通过第一真空套筒的多个辊的第一真空套筒。 提供端口用于将第一真空套筒密封地联接到处理室。 第一衬底处理器设置在端口附近。 可以提供多个端口用于将第一真空套管密封地联接到多个处理室。 为每个处理室提供专用的基板处理器。 第二真空套筒可以密封地联接到处理室的相对侧。 真空输送系统可以是模块化的，具有通过负载锁定室连接的独立模块。 多个辊可以补偿在其上运送的基板的前缘的任何下垂。

    Tunable gas distribution plate assembly
    9.
    发明授权
    Tunable gas distribution plate assembly 失效
    可调气体分配板总成

    公开(公告)号：US07270713B2

    公开(公告)日：2007-09-18

    申请号：US10337483

    申请日：2003-01-07

    申请人： Wendell T. Blonigan ,  John M. White ,  William A. Bagley

    发明人： Wendell T. Blonigan ,  John M. White ,  William A. Bagley

    IPC分类号： C23C16/455 ,  C23C16/50 ,  C23C16/503 ,  C23C16/505 ,  C23C16/509 ,  C23F1/00 ,  H01L21/306

    CPC分类号： C23C16/45565 ,  C23C16/455 ,  C23C16/45591 ,  C23C16/5096 ,  H01J37/3244 ,  H01J37/32449

    摘要： A gas distribution plate assembly and a method for distributing gas in a processing chamber are provided. In one embodiment, a gas distribution plate assembly includes a tuning plate coupled to a diffuser plate. The tuning plate has a plurality of orifice holes formed therethrough that align with a plurality of apertures formed through the diffuser plate, where the apertures each have a greater sectional area than the holes in the tuning plate. Each aperture is aligned with a respective hole to define gas passages through the gas distribution plate assembly. The tuning plate may be interchanged with a replacement tuning plate to change the gas flow characteristics through the gas distribution plate assembly.

    摘要翻译： 提供一种气体分配板组件和在处理室中分配气体的方法。 在一个实施例中，气体分配板组件包括联接到扩散板的调谐板。 调谐板具有穿过其形成的多个孔孔，其与通过扩散板形成的多个孔对准，其中孔各自具有比调谐板中的孔更大的截面面积。 每个孔与相应的孔对准以限定通过气体分配板组件的气体通道。 调谐板可以与更换调谐板互换，以改变通过气体分配板组件的气流特性。

    Multi-function chamber for a substrate processing system
    10.
    发明授权
    Multi-function chamber for a substrate processing system 失效
    用于基板处理系统的多功能室

    公开(公告)号：US06435868B2

    公开(公告)日：2002-08-20

    申请号：US09732159

    申请日：2000-12-07

    申请人： John M. White ,  Wendell T. Blonigan ,  Michael W. Richter

    发明人： John M. White ,  Wendell T. Blonigan ,  Michael W. Richter

    IPC分类号： F27D306

    CPC分类号： H01L21/67748 ,  H01L21/67098 ,  H01L21/67109 ,  H01L21/67173 ,  H01L21/67201 ,  H01L21/67236 ,  H01L21/67248

    摘要： A load lock chamber includes a chamber body having an aperture to allow a substrate to be transferred into or out of the chamber. The load lock chamber is configurable in several configurations, including a base configuration for providing a transition between two different pressures, a heating configuration for heating the substrate and providing a transition between two different pressures, and a cooling configuration for cooling the substrate and providing a transition between two different pressures. Various features of the chamber configurations help increase the throughput of the system by enabling rapid heating and cooling of substrates and simultaneous evacuation and venting of the chamber, and help compensate for thermal losses near the substrate edges, thereby providing a more uniform temperature across the substrate.

    摘要翻译： 负载锁定室包括具有孔的腔体，以允许衬底被转移到腔室中或从腔室中移出。 负载锁定室可配置为多种配置，包括用于提供两种不同压力之间的转换的基本配置，用于加热衬底并提供两种不同压力之间的转换的加热配置，以及用于冷却衬底的冷却配置， 两种不同压力之间的转变。 腔室结构的各种特征有助于通过使衬底的快速加热和冷却以及腔室的同时排空和排气来增加系统的生产能力，并且有助于补偿衬底边缘附近的热损失，由此在衬底上提供更均匀的温度 。